Power Management Circuit, Fixed, +4.6VV, BIPolar
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Motorola ( NXP ) |
包装说明 | , SIP3,.1,50 |
Reach Compliance Code | unknown |
可调阈值 | NO |
JESD-609代码 | e0 |
端子数量 | 3 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装等效代码 | SIP3,.1,50 |
电源 | 5 V |
认证状态 | Not Qualified |
最大供电电流 (Isup) | 0.5 mA |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | BIPOLAR |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子节距 | 1.27 mm |
端子位置 | SINGLE |
阈值电压标称 | +4.6V |
MC33064P5 | MC34064P5 | MC34064DM5 | MC33064D5R2 | MC33064D5 | MC33064DM5 | |
---|---|---|---|---|---|---|
描述 | Power Management Circuit, Fixed, +4.6VV, BIPolar | Power Management Circuit, Fixed, +4.6VV, BIPolar | Power Management Circuit, Fixed, +4.6VV, BIPolar, PDSO8 | Power Management Circuit, Fixed, +4.6VV, BIPolar, PDSO8 | Power Management Circuit, Fixed, +4.6VV, BIPolar, PDSO8 | Power Management Circuit, Fixed, +4.6VV, BIPolar, PDSO8 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) |
包装说明 | , SIP3,.1,50 | TO-226, SIP3,.1,50 | TSSOP, TSSOP8,.19 | SOP, SOP8,.25 | SOP, SOP8,.25 | TSSOP, TSSOP8,.19 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknow |
可调阈值 | NO | NO | NO | NO | NO | NO |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
端子数量 | 3 | 3 | 8 | 8 | 8 | 8 |
最高工作温度 | 85 °C | 85 °C | 70 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装等效代码 | SIP3,.1,50 | SIP3,.1,50 | TSSOP8,.19 | SOP8,.25 | SOP8,.25 | TSSOP8,.19 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电流 (Isup) | 0.5 mA | 0.5 mA | 0.5 mA | 0.5 mA | 0.5 mA | 0.5 mA |
标称供电电压 (Vsup) | 5 V | 4 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | YES | YES | YES | YES |
温度等级 | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子位置 | SINGLE | BOTTOM | DUAL | DUAL | DUAL | DUAL |
阈值电压标称 | +4.6V | +4.6V | +4.6V | +4.6V | +4.6V | +4.6V |
电源 | 5 V | - | 5 V | 5 V | 5 V | 5 V |
技术 | BIPOLAR | - | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
端子节距 | 1.27 mm | - | 0.635 mm | 1.27 mm | 1.27 mm | 0.635 mm |
JESD-30 代码 | - | O-XBCY-T3 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
封装代码 | - | TO-226 | TSSOP | SOP | SOP | TSSOP |
封装形状 | - | ROUND | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | - | CYLINDRICAL | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
端子形式 | - | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING |
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