IC TELEPHONE RINGER CKT, PSIP9, SLIM, PLASTIC, SIP-9, Telephone Circuit
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Toshiba(东芝) |
| 零件包装代码 | SIP |
| 包装说明 | SLIM, PLASTIC, SIP-9 |
| 针数 | 9 |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-PSIP-T9 |
| 长度 | 22.8 mm |
| 功能数量 | 1 |
| 端子数量 | 9 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | -30 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | 240 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.7 mm |
| 表面贴装 | NO |
| 电信集成电路类型 | TELEPHONE RINGER CKT |
| 温度等级 | OTHER |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | SINGLE |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 2.8 mm |
| TA31075AS | TA31075AF(EL) | TA31075AF(ER) | TA31075AF-TP1 | TA31075AF-TP2 | TA31075AF | |
|---|---|---|---|---|---|---|
| 描述 | IC TELEPHONE RINGER CKT, PSIP9, SLIM, PLASTIC, SIP-9, Telephone Circuit | IC TELEPHONE RINGER CKT, PDSO10, 0.225 INCH, PLASTIC, SSOP-10, Telephone Circuit | IC TELEPHONE RINGER CKT, PDSO10, 0.225 INCH, PLASTIC, SSOP-10, Telephone Circuit | IC TELEPHONE RINGER CKT, PDSO10, 0.225 INCH, PLASTIC, SSOP-10, Telephone Circuit | IC TELEPHONE RINGER CKT, PDSO10, 0.225 INCH, PLASTIC, SSOP-10, Telephone Circuit | IC TELEPHONE RINGER CKT, PDSO10, 0.225 INCH, PLASTIC, SSOP-10, Telephone Circuit |
| 厂商名称 | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) |
| 零件包装代码 | SIP | SSOP | SSOP | SSOP | SSOP | SSOP |
| 包装说明 | SLIM, PLASTIC, SIP-9 | SSOP, | SSOP, | SSOP, | SSOP, | 0.225 INCH, PLASTIC, SSOP-10 |
| 针数 | 9 | 10 | 10 | 10 | 10 | 10 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-PSIP-T9 | R-PDSO-G10 | R-PDSO-G10 | R-PDSO-G10 | R-PDSO-G10 | R-PDSO-G10 |
| 长度 | 22.8 mm | 5.2 mm | 5.2 mm | 5.2 mm | 5.2 mm | 5.2 mm |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 9 | 10 | 10 | 10 | 10 | 10 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 最低工作温度 | -30 °C | -30 °C | -30 °C | -30 °C | -30 °C | -30 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SIP | SSOP | SSOP | SSOP | SSOP | SSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.7 mm | 1.9 mm | 1.9 mm | 1.9 mm | 1.9 mm | 1.9 mm |
| 表面贴装 | NO | YES | YES | YES | YES | YES |
| 电信集成电路类型 | TELEPHONE RINGER CKT | TELEPHONE RINGER CIRCUIT | TELEPHONE RINGER CIRCUIT | TELEPHONE RINGER CIRCUIT | TELEPHONE RINGER CIRCUIT | TELEPHONE RINGER CKT |
| 温度等级 | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
| 端子位置 | SINGLE | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 2.8 mm | 4.4 mm | 4.4 mm | 4.4 mm | 4.4 mm | 4.4 mm |
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