电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

SSW-128-06-TM-D-RA

产品描述Board Connector, 56 Contact(s), 2 Row(s), Female, Right Angle, Solder Terminal, Socket,
产品类别连接器    连接器   
文件大小527KB,共3页
制造商SAMTEC
官网地址http://www.samtec.com/
下载文档 详细参数 全文预览

SSW-128-06-TM-D-RA概述

Board Connector, 56 Contact(s), 2 Row(s), Female, Right Angle, Solder Terminal, Socket,

SSW-128-06-TM-D-RA规格参数

参数名称属性值
厂商名称SAMTEC
Reach Compliance Codecompliant
ECCN代码EAR99
Samacsys Description56 Position, Tiger Buy™ Socket Strip with PCB Tails, 0.100" Pitch
主体/外壳类型SOCKET
连接器类型BOARD CONNECTOR
联系完成配合MATTE TIN
联系完成终止MATTE TIN
触点性别FEMALE
DIN 符合性NO
滤波功能NO
IEC 符合性NO
JESD-609代码e3
MIL 符合性NO
制造商序列号SSW-1
混合触点NO
安装方式RIGHT ANGLE
安装类型BOARD
装载的行数2
选件GENERAL PURPOSE
端子节距2.54 mm
端接类型SOLDER
触点总数56
UL 易燃性代码94V-0

文档预览

下载PDF文档
REVISION BX
SSW-1XX-XX-XXX-X-XX-XXX-XX
No OF POSITIONS
-01 THRU -50
(-P OPTION: 36 POS MAX)
DO NOT
SCALE FROM
THIS PRINT
LEAD STYLE
(SEE TABLE 1)
-01 THRU -06 (STD. INS. FORCE)
-21 THRU -24 (LOW INS. FORCE)
OPTION
-LL: LOCKING LEAD
(SEE FIG 4, SHT 2)
(N/A IN SINGLE ROW,
1 & 2 POSITION)
POLARIZING OPTION
INDICATE POS, SEE FIG 3, SHT 3
OPTION
-RA: RIGHT ANGLE (SEE FIG 2, SHT 2)
(STYLE -01 & -21 N/A)
-N: NOTCH (SEE FIG 6, SHT 3)
(ONLY AVAILABLE IN -D ROW)
(ONLY AVAILABLE IN 5, 7, 8, 10, 12,
13, 15, 17, 20, 25, 32, 36 POSITIONS)
(USE NSW-XX-D-N-XX BODY,
SEE TABLE 6)
PLATING SPECIFICATION
-G: 20µ" GOLD IN CONTACT AREA,
3µ" GOLD ON TAIL
-T: MATTE TIN CONTACT AND TAIL
(CONTACT -21 THRU -24 N/A)
-S: 30µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL
-H: 30µ" HEAVY GOLD IN CONTACT AREA,
ROW SPECIFICATION
3µ" GOLD ON TAIL
-E: 50µ" EXTRA HEAVY GOLD IN CONTACT AREA,
-S: SINGLE
3µ" GOLD ON TAIL
-D: DOUBLE
(CONTACT -01 & -02 STRAIGHT ONLY)
-T: TRIPLE
-F: 3µ" FLASH SELECTIVE GOLD IN CONTACT AREA,
-P: SINGLE
MATTE TIN ON TAIL
-Q: TRIPLE WITH ONLY OUTER 2 ROWS
-STL: 30µ" SELECTIVE GOLD IN CONTACT AREA,
FILLED
TIN/LEAD (90/10 ± 5%) TAIL
-TL: TIN/LEAD (90/10 ± 5%) CONTACT AND TAIL
(AVAILABLE ONLY ON LEAD STYLES -01)
-TM: MATTE TIN CONTACT AND TAIL (CONTACT -21 THRU -24 N/A)
-SM: 30µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL
-FM: 3µ" FLASH GOLD SELECTIVE IN CONTACT AREA,
MATTE TIN ON TAIL
-L: 10µ" LIGHT SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL
.050 1.27 REF
((No. OF POS x .10[2.5]) + .02[0.5])
SEE NOTE 10
.0110 0.280
REF
.095 2.41
REF
.095 2.41
REF
.245 6.22
.195 4.95
REF
SEE NOTE 8
.295 7.49
REF
60°
.335 8.51
DETAIL 'A'
SCALE 4 : 1
SEE NOTE 5
NOTES:
'A'
*"B"
.031 0.79 X .016[0.41]
REF (TYP)
+.000
*"B"
- .005
FOR
C
C
-S
MACHINE FILL ONLY
-P
.100 2.54
C
-D
FIG 1
-D-N
.100 2.54
.200 5.08
-T
1.
C
REPRESENTS A CRITICAL DIMENSION.
2. MAXIMUM CUT FLASH: .015[.38] WITH NO FLASH BELOW STANDOFFS OR IN CONTACT HOLES.
3. MINIMUM CONTACT PUSHOUT FORCE: 1.5 LBS.
4. MAXIMUM ALLOWABLE BOW: .003[.08] INCH/INCH.
5. MAXIMUM ALLOWABLE SWAY: 2° (TYP) FOR HAND FILL & 1° (TYP) FOR MACHINE FILL.
6. MAXIMUM ALLOWABLE VARIATION BETWEEN ROWS: .010[.25].
7. "END WALLS" AFTER CUTTING SHOULD BE .020±.003 [.51±.08].
8. NOTCH ON -P-RA & -D-RA-N OPTIONS TO BE ORIENTED AS SHOWN.
9. SHEAR LOCATION TO BE WITHIN .001[.03] OF THE BREAK OFF CENTER LOCATION.
10. SHEAR LOCATION TO BE WITHIN .001[.03] OF THE BREAK OFF CENTER LOCATION
FOR MACHINE FILL.
11. LEAD STYLE X2 (SINGLE AND DOUBLE) -RA's TO BE LAYER PACKAGED. ALL OTHER -RA
LEAD STYLES: UNDER 5 POSITION TO BE LAYER PACKAGED, 5 AND UP TO BE PACKAGED
IN TUBES.
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
DECIMALS
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
.XX: .01 [.3]
.XXX: .005 [.13]
ANGLES
2
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
DESCRIPTION:
DWG. NO.
MATERIAL:
DO NOT SCALE DRAWING
INSULATOR:
-S, -D, -D-N: VECTRA E130i, COLOR: BLACK UL94 V0
-P, -T: PCT, COLOR: BLACK UL94 V0
CONTACT: PHOSPHOR BRONZE, SPRING TEMPER
ALLOY 511 OR 510
(TENSILE STRENGTH 90-100 KSI)
(YEILD STRENGTH @ 2% OFFSET 88-98 KSI)
PER MIL-B-13501
THICKNESS: .0160±.001 [0.635±0.03]
F:\DWG\MISC\MKTG\SSW-1XX-XX-XXX-X-XX-XXX-XX-MKT.SLDDRW
SHEET SCALE: 2:1
ASSEMBLY, SOCKET STRIP .016 X .031 TAIL
SSW-1XX-XX-XXX-X-XX-XXX-XX
06/12/1987
SHEET
1
OF
3
BY:
PURVIS
【TI建议】将网友的一些资料整理成PDF文档
建议我们论坛,把一些网友的分享的一些开发心得、使用经验和DIY的一些作品。跟这些网友商量一下将其整理成PDF文档,在他们的同意下打上我们论坛的LOGO。然后建立一个我们论坛的数据库,将那些文 ......
cat3902982 微控制器 MCU
EVC下串口程序,急!!!!
按照ZLG的WINCE书编写了一个串口测试程序,做打开串口,简单的接收发送数据 应该跟硬件驱动没有直接关系 但是现在有些问题: 1、编译成功后用EVC自带的模拟器仿真,总是COM1可以打开,CO ......
whatseal 嵌入式系统
提问:WinCE 5.0中能否利用remote heap walker察看某一块内存是谁分配的?
前几天提问过一个问题,WinCE4.2上的程序移植到5.0之后出现了内存不足。 经过调查,发现以下问题。 现在把调查手段和结果说明一下: 用PB5.0的remote heap walker工具查看堆的分配情况。 发 ......
Essen 嵌入式系统
bsp下的DLL无法生成!
现在我自己写的(EP9315)GIPO的驱动,添加到BSP当中后,编译是通过,就是不能生成DLL,但却弹出如下错误!Built: Jun 16 2004 15:09:27 Error: Could not find file 'D:\WINCE500\PBWorkspaces\ ......
sy_ocean 嵌入式系统
请教arm开发板的基本问题
请问arm开发板的国内生产商主要有哪有呢?国外呢? 在百度上搜到的都是代理商的。还有就是要在开发板上集成GPS,GSM模块什么的,如果不从代理商那购买,是可以直接跟厂家定制吗? ...
ldw3 ARM技术
wince 320*240显示驱动开发
要在以前640*480基础上修改分辨率为320*240,ce镜像启动起来后,系统图标明显过大.但能全屏显示.这是哪里出了问题?...
glenovo 嵌入式系统

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2310  2546  2381  2838  2579  8  33  41  45  55 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved