0-BIT, 50MHz, OTHER DSP, PBGA80, 9 X 9 MM, PLASTIC, FBGA-80
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Renesas(瑞萨电子) |
| 零件包装代码 | BGA |
| 针数 | 80 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.3 |
| 位大小 | 16 |
| 格式 | FIXED POINT |
| JESD-30 代码 | S-PBGA-B80 |
| 端子数量 | 80 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | FBGA |
| 封装等效代码 | BGA80,9X9,32 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, FINE PITCH |
| 电源 | 2/2.5,3/3.3 V |
| 认证状态 | Not Qualified |
| RAM（字数） | 32768 |
| 最大压摆率 | 75 mA |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | BALL |
| 端子节距 | 0.8 mm |
| 端子位置 | BOTTOM |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
| UPD77115AF1-XXX-CN6 | UPD77115F1-CN6 | UPD77115GK-9EU | UPD77115GK-9EU-A | UPD77115AF1-XXX-CN6-A | |
|---|---|---|---|---|---|
| 描述 | 0-BIT, 50MHz, OTHER DSP, PBGA80, 9 X 9 MM, PLASTIC, FBGA-80 | 0-BIT, 50MHz, OTHER DSP, PBGA80, 9 X 9 MM, PLASTIC, FBGA-80 | OTHER DSP | IC,DSP,16-BIT,CMOS,TQFP,80PIN,PLASTIC | IC,DSP,16-BIT,CMOS,BGA,80PIN,PLASTIC |
| Reach Compliance Code | unknown | unknown | unknown | compliant | unknown |
| 格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| JESD-30 代码 | S-PBGA-B80 | S-PBGA-B80 | S-PQFP-G80 | S-PQFP-G80 | S-PBGA-B80 |
| 端子数量 | 80 | 80 | 80 | 80 | 80 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | FBGA | LFBGA | QFP | QFP | FBGA |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | FLATPACK | FLATPACK | GRID ARRAY, FINE PITCH |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | MOS | CMOS | CMOS | CMOS |
| 端子形式 | BALL | BALL | GULL WING | GULL WING | BALL |
| 端子节距 | 0.8 mm | 0.8 mm | 0.5 mm | 0.5 mm | 0.8 mm |
| 端子位置 | BOTTOM | BOTTOM | QUAD | QUAD | BOTTOM |
| 是否Rohs认证 | 不符合 | 不符合 | - | 符合 | 符合 |
| 厂商名称 | Renesas(瑞萨电子) | - | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
| 零件包装代码 | BGA | BGA | QFP | - | - |
| 针数 | 80 | 80 | 80 | - | - |
| ECCN代码 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | - | - |
| 位大小 | 16 | - | 16 | 16 | 16 |
| 最高工作温度 | 85 °C | 85 °C | - | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | - | -40 °C | -40 °C |
| 封装等效代码 | BGA80,9X9,32 | - | TQFP80,.55SQ | TQFP80,.55SQ | BGA80,9X9,32 |
| 电源 | 2/2.5,3/3.3 V | - | 2/2.5,3/3.3 V | 2/2.5,3/3.3 V | 2/2.5,3/3.3 V |
| RAM（字数） | 32768 | - | 32768 | 32768 | 32768 |
| 最大压摆率 | 75 mA | - | - | 75 mA | 75 mA |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | - | - |
| 包装说明 | - | LFBGA, | - | QFP, TQFP80,.55SQ | FBGA, BGA80,9X9,32 |
| Base Number Matches | - | 1 | 1 | 1 | - |
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