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SI4113-D-ZT1

产品描述TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC28
产品类别热门应用    无线/射频/通信   
文件大小286KB,共36页
制造商SILABS
官网地址http://www.silabs.com
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SI4113-D-ZT1概述

TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC28

电信, 蜂窝式, 射频和基带电路, QCC28

SI4113-D-ZT1规格参数

参数名称属性值
功能数量1
端子数量28
最大工作温度85 Cel
最小工作温度-40 Cel
额定供电电压3 V
加工封装描述ROHS COMPLIANT, MS-220VHHD-1, QFN-28
无铅Yes
欧盟RoHS规范Yes
状态ACTIVE
包装形状SQUARE
包装尺寸CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
表面贴装Yes
端子形式NO LEAD
端子间距0.5000 mm
端子涂层NOT SPECIFIED
端子位置QUAD
包装材料UNSPECIFIED
温度等级INDUSTRIAL
通信类型RF AND BASEBAND CIRCUIT

文档预览

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Si4133
Si4123/22/13/12
D
U A L
- B
A N D
R F S
Y N T H E S I Z E R
W
I T H
I
N TE G R A T E D
V C O
S
F
OR
W
I R E L E S S
C
O M M U N I C A T I O N S
F
EATURES
Dual-band RF synthesizers
900 MHz to 1.8 GHz

RF2: 750 MHz to 1.5 GHz

RF1:
IF synthesizer

IF:
62.5 to 1000 MHz
Integrated VCOs, loop filters,
varactors, and resonators
Minimal (2) number of external
components required
Low phase noise
Programmable powerdown modes
1 µA standby current
18 mA typical supply current
2.7 to 3.6 V operation
Packages: 24-pin TSSOP,
28-lead QFN

Lead-free
Ordering Information:
See page 31.
and RoHS compliant
Applications
Pin Assignments
Dual-band communications
Digital cellular telephones GSM 850, E-GSM 900, DCS 1800,
PCS 1900
Digital cordless phones
Analog cordless phones
Wireless local loop
Si4133-GT
SCLK
SDATA
GNDR
RFLD
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
SEN
VDDI
IFOUT
GNDI
IFLB
IFLA
GNDD
VDDD
GNDD
XIN
PWDN
AUXOUT
Description
The Si4133 is a monolithic integrated circuit that performs both IF and dual-
band RF synthesis for wireless communications applications. The Si4133
includes three VCOs, loop filters, reference and VCO dividers, and phase
detectors. Divider and powerdown settings are programmable with a three-
wire serial interface.
RFLC
GNDR
RFLB
RFLA
GNDR
GNDR
RFOUT
Functional Block Diagram
VDDR
XIN
SDATA
IFOUT
GNDR
Reference
Amplifier
Powerdown
Control
R
Si4133-GM
SCLK
RF1
PWDN
N
R
Phase
Detector
RF2
RFOUT
GNDR
28 27 26 25 24 23 22
1
2
3
4
5
6
7
8
GNDR
SEN
VDDI
RFLB
GNDI
Phase
Detector
RFLA
21
20
19
GNDI
IFLB
IFLA
GNDD
VDDD
GNDD
XIN
SDATA
SCLK
SEN
Serial
Interface
22-bit
Data
Register
RFLC
RFLD
RFLD
RFLC
GNDR
RFLB
N
R
Phase
Detector
IF
GND
Pad
18
17
16
15
AUXOUT
Test
Mux
IFDIV
IFOUT
RFLA
GNDR
PWDN
GNDR
Patents pending
Rev. 1.61 1/10
Copyright © 2010 by Silicon Laboratories
Si4133
RFOUT
GNDD
VDDR
IFLB
AUXOUT
N
IFLA
9
10 11 12 13 14

SI4113-D-ZT1相似产品对比

SI4113-D-ZT1 SI4112-D-GM SI4112-D-GT SI4113-D-GM SI4113-D-GT SI4122-D-GM SI4122-D-GT SI4123-D-GM SI4123-D-GT SI4133-D-GT
描述 TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC28 TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC28 TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PDSO24 TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC28 TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PDSO24 TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC28 TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC28 TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC28 TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PDSO24 TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PDSO24
功能数量 1 1 1 1 1 1 1 1 1 1
端子数量 28 28 24 28 24 28 28 28 24 24
最大工作温度 85 Cel 85 Cel 85 Cel 85 Cel 85 Cel 85 Cel 85 Cel 85 Cel 85 Cel 85 Cel
最小工作温度 -40 Cel -40 Cel -40 Cel -40 Cel -40 Cel -40 Cel -40 Cel -40 Cel -40 Cel -40 Cel
额定供电电压 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
加工封装描述 ROHS COMPLIANT, MS-220VHHD-1, QFN-28 ROHS COMPLIANT, MS-220VHHD-1, QFN-28 ROHS COMPLIANT, TSSOP-24 ROHS COMPLIANT, MS-220VHHD-1, QFN-28 ROHS COMPLIANT, TSSOP-24 ROHS COMPLIANT, MS-220VHHD-1, QFN-28 ROHS COMPLIANT, MS-220VHHD-1, QFN-28 ROHS COMPLIANT, MS-220VHHD-1, QFN-28 ROHS COMPLIANT, TSSOP-24 ROHS COMPLIANT, TSSOP-24
无铅 Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes
欧盟RoHS规范 Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes
状态 ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
包装形状 SQUARE SQUARE RECTANGULAR SQUARE RECTANGULAR SQUARE SQUARE SQUARE RECTANGULAR 矩形的
包装尺寸 CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
表面贴装 Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes
端子形式 NO LEAD NO LEAD GULL WING NO LEAD GULL WING NO LEAD NO LEAD NO LEAD GULL WING GULL WING
端子间距 0.5000 mm 0.5000 mm 0.6500 mm 0.5000 mm 0.6500 mm 0.5000 mm 0.5000 mm 0.5000 mm 0.6500 mm 0.6500 mm
端子涂层 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
端子位置 QUAD QUAD DUAL QUAD DUAL QUAD QUAD QUAD DUAL
包装材料 UNSPECIFIED UNSPECIFIED PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY UNSPECIFIED UNSPECIFIED UNSPECIFIED PLASTIC/EPOXY 塑料/环氧树脂
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
通信类型 RF AND BASEBAND CIRCUIT RF AND BASEBAND CIRCUIT RF AND BASEBAND CIRCUIT RF AND BASEBAND CIRCUIT RF AND BASEBAND CIRCUIT RF AND BASEBAND CIRCUIT RF AND BASEBAND CIRCUIT RF AND BASEBAND CIRCUIT RF AND BASEBAND CIRCUIT 射频和基带电路
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