BAT54XY
Schottky barrier quadruple diode
Rev. 3 — 8 October 2012
Product data sheet
1. Product profile
1.1 General description
Schottky barrier quadruple diode with an integrated guard ring for stress protection. Two
electrically isolated dual Schottky barrier diodes series, encapsulated in a very small
SOT363 (SC-88) Surface-Mounted Device (SMD) plastic package.
1.2 Features and benefits
Low forward voltage
Low capacitance
AEC-Q101 qualified
1.3 Applications
Ultra high-speed switching
Line termination
Voltage clamping
Reverse polarity protection
1.4 Quick reference data
Table 1.
Quick reference data
T
amb
= 25
C unless otherwise specified.
Symbol
Per diode
V
R
I
F
V
F
[1]
Parameter
reverse voltage
forward current
forward voltage
Conditions
Min
-
-
Typ
-
-
-
Max
30
200
400
Unit
V
mA
mV
I
F
= 10 mA
[1]
-
Pulse test: t
p
30 ms;
0.02.
NXP Semiconductors
BAT54XY
Schottky barrier quadruple diode
2. Pinning information
Table 2.
Pin
1
2
3
4
5
6
Pinning
Description
anode 1
cathode 2
anode 3/cathode 4
anode 4
cathode 3
cathode 1/anode 2
1
2
3
6
5
4
6
5
4
Simplified outline
Graphic symbol
1
2
3
006aaa256
3. Ordering information
Table 3.
Ordering information
Package
Name
BAT54XY
SC-88
Description
plastic surface-mounted package; 6 leads
Version
SOT363
Type number
4. Marking
Table 4.
BAT54XY
[1]
* = placeholder for manufacturing site code.
Marking codes
Marking code
[1]
*C5
Type number
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Per diode
V
R
I
F
I
FRM
I
FSM
T
j
T
amb
T
stg
reverse voltage
forward current
repetitive peak forward
current
non-repetitive peak forward
current
junction temperature
ambient temperature
storage temperature
t
p
1 s;
0.5
t
p
< 10 ms
-
-
-
-
-
55
65
30
200
300
600
125
+125
+150
V
mA
mA
mA
C
C
C
Parameter
Conditions
Min
Max
Unit
BAT54XY
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 8 October 2012
2 of 9
NXP Semiconductors
BAT54XY
Schottky barrier quadruple diode
6. Thermal characteristics
Table 6.
Symbol
R
th(j-sp)
[1]
Thermal characteristics
Parameter
Conditions
[1]
Min
-
Typ
-
Max
260
Unit
K/W
thermal resistance from junction to in free air
solder point
Soldering point at pins 2, 3, 5 and 6.
7. Characteristics
Table 7.
Characteristics
T
amb
= 25
C unless otherwise specified.
Symbol
Per diode
V
F
forward voltage
I
F
= 0.1 mA
I
F
= 1 mA
I
F
= 10 mA
I
F
= 30 mA
I
F
= 100 mA
I
R
C
d
[1]
[1]
Parameter
Conditions
Min
Typ
Max
Unit
-
-
-
-
-
-
-
-
-
-
-
-
-
-
240
320
400
500
800
2
10
mV
mV
mV
mV
mV
A
pF
reverse current
diode capacitance
Pulse test: t
p
300
s;
0.02.
V
R
= 25 V
V
R
= 1 V; f = 1 MHz
10
3
I
F
(mA)
10
2
(1)
006aac829
(3)
(2)
,
5
DDD
10
(1)
(2)
(3)
1
10
-1
0.0
0.4
0.8
V
F
(V)
1.2
9
5
(1) T
amb
= 125
C
(2) T
amb
= 85
C
(3) T
amb
= 25
C
(1) T
amb
= 125
C
(2) T
amb
= 85
C
(3) T
amb
= 25
C
Fig 1.
Forward current as a function of forward
voltage; typical values
Fig 2.
Reverse current as a function of reverse
voltage; typical values
BAT54XY
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 8 October 2012
3 of 9
NXP Semiconductors
BAT54XY
Schottky barrier quadruple diode
10
C
d
(pF)
8
006aac891
6
4
2
0
0
10
20
V
R
(V)
30
T
amb
= 25
C;
f = 1 MHz
Fig 3.
Diode capacitance as a function of reverse voltage; typical values
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard
Q101 - Stress test qualification for discrete semiconductors,
and is
suitable for use in automotive applications.
9. Package outline
2.2
1.8
6
5
4
0.45
0.15
1.1
0.8
2.2 1.35
2.0 1.15
pin 1
index
1
0.65
1.3
Dimensions in mm
2
3
0.3
0.2
0.25
0.10
06-03-16
Fig 4.
Package outline SOT363 (SC-88)
BAT54XY
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 8 October 2012
4 of 9
NXP Semiconductors
BAT54XY
Schottky barrier quadruple diode
10. Packing information
Table 8.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number
BAT54XY
Package
SOT363
Description
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
[1]
[2]
[3]
[2]
[3]
Packing quantity
3000
-115
-125
10000
-135
-165
For further information and the availability of packing methods, see
Section 14.
T1: normal taping
T2: reverse taping
11. Soldering
2.65
solder lands
2.35 1.5
0.6 0.5
(4×) (4×)
0.4 (2×)
solder resist
solder paste
0.5
(4×)
0.6
(4×)
1.8
0.6
(2×)
occupied area
Dimensions in mm
sot363_fr
Fig 5.
Reflow soldering footprint SOT363 (SC-88)
1.5
solder lands
4.5
0.3 2.5
solder resist
occupied area
1.5
Dimensions in mm
preferred transport
direction during soldering
1.3
2.45
5.3
1.3
sot363_fw
Fig 6.
Wave soldering footprint SOT363 (SC-88)
BAT54XY
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 8 October 2012
5 of 9
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