8-BIT, MROM, 8MHz, MICROCONTROLLER, PDSO24, 0.300 INCH, PLASTIC, SOP-24
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ST(意法半导体) |
| 零件包装代码 | SOIC |
| 包装说明 | 0.300 INCH, PLASTIC, SOP-24 |
| 针数 | 24 |
| Reach Compliance Code | compliant |
| 具有ADC | NO |
| 地址总线宽度 | |
| 位大小 | 8 |
| CPU系列 | ST72 |
| 最大时钟频率 | 8 MHz |
| DAC 通道 | NO |
| DMA 通道 | NO |
| 外部数据总线宽度 | |
| JESD-30 代码 | R-PDSO-G24 |
| 长度 | 15.4 mm |
| I/O 线路数量 | 3 |
| 端子数量 | 24 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| PWM 通道 | NO |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP24,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| RAM（字节） | 768 |
| ROM（单词） | 16384 |
| ROM可编程性 | MROM |
| 座面最大高度 | 2.65 mm |
| 速度 | 8 MHz |
| 最大压摆率 | 15 mA |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.5 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
| ST7SCR1M1/XXX | ST7FSCR1E4U1 | ST7SCR1E4M1/XXX | ST7PSCR1R4T1/XXX | ST7PSCR1E4M1/XXX | ST7SCR1T1/XXX | ST7SCR1R4T1/XXX | ST7SCR1E4U1/XXX | |
|---|---|---|---|---|---|---|---|---|
| 描述 | 8-BIT, MROM, 8MHz, MICROCONTROLLER, PDSO24, 0.300 INCH, PLASTIC, SOP-24 | 8-BIT, FLASH, 8MHz, MICROCONTROLLER, QCC64, QFN-64 | 8-BIT, MROM, 8MHz, MICROCONTROLLER, PDSO24, 0.300 INCH, PLASTIC, SOP-24 | 8-BIT, MROM, 8MHz, MICROCONTROLLER, PQFP64, 14 X 14 MM, LQFP-64 | 8-BIT, MROM, 8MHz, MICROCONTROLLER, PDSO24, 0.300 INCH, PLASTIC, SOP-24 | 8-BIT, MROM, 8MHz, MICROCONTROLLER, PQFP64, 14 X 14 MM, LQFP-64 | 8-BIT, MROM, 8MHz, MICROCONTROLLER, PQFP64, 14 X 14 MM, LQFP-64 | MICROCONTROLLER, QCC24, ROHS COMPLIANT, QFN-24 |
| 零件包装代码 | SOIC | QFN | SOIC | QFP | SOIC | QFP | QFP | QFN |
| 包装说明 | 0.300 INCH, PLASTIC, SOP-24 | QFN-64 | SOP, SOP24,.4 | LQFP, QFP64,.6SQ,32 | SOP, SOP24,.4 | 14 X 14 MM, LQFP-64 | 14 X 14 MM, LQFP-64 | ROHS COMPLIANT, QFN-24 |
| 针数 | 24 | 64 | 24 | 64 | 24 | 64 | 64 | 24 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 具有ADC | NO | NO | NO | NO | NO | NO | NO | NO |
| 位大小 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| CPU系列 | ST72 | ST72 | ST72 | ST72 | ST72 | ST72 | ST72 | ST72 |
| 最大时钟频率 | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz |
| DMA 通道 | NO | NO | NO | NO | NO | NO | NO | NO |
| JESD-30 代码 | R-PDSO-G24 | S-XQCC-N64 | R-PDSO-G24 | S-PQFP-G64 | R-PDSO-G24 | S-PQFP-G64 | S-PQFP-G64 | S-XQCC-N24 |
| 长度 | 15.4 mm | 5 mm | 15.4 mm | 14 mm | 15.4 mm | 14 mm | 14 mm | 5 mm |
| I/O 线路数量 | 3 | 31 | 3 | 31 | 3 | 31 | 31 | 3 |
| 端子数量 | 24 | 64 | 24 | 64 | 24 | 64 | 64 | 24 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| PWM 通道 | NO | NO | NO | NO | NO | NO | NO | NO |
| 封装主体材料 | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED |
| 封装代码 | SOP | HVQCCN | SOP | LQFP | SOP | LQFP | LQFP | QCCN |
| 封装等效代码 | SOP24,.4 | SOP24,.4 | SOP24,.4 | QFP64,.6SQ,32 | SOP24,.4 | QFP64,.6SQ,32 | QFP64,.6SQ,32 | LCC24,.19SQ,25 |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | SQUARE | SQUARE |
| 封装形式 | SMALL OUTLINE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | FLATPACK, LOW PROFILE | SMALL OUTLINE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | CHIP CARRIER |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字节） | 768 | 768 | 768 | 768 | 768 | 768 | 768 | 768 |
| ROM（单词） | 16384 | 16384 | 16384 | 16384 | 16384 | 16384 | 16384 | 16384 |
| ROM可编程性 | MROM | FLASH | MROM | MROM | MROM | MROM | MROM | MROM |
| 速度 | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz |
| 最大压摆率 | 15 mA | 15 mA | 15 mA | 15 mA | 15 mA | 15 mA | 15 mA | 15 mA |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4 V | 4 V | 4 V | 4 V | 4 V | 4 V | 4 V | 4 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | GULL WING | NO LEAD | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | NO LEAD |
| 端子节距 | 1.27 mm | 0.65 mm | 1.27 mm | 0.8 mm | 1.27 mm | 0.8 mm | 0.8 mm | 0.65 mm |
| 端子位置 | DUAL | QUAD | DUAL | QUAD | DUAL | QUAD | QUAD | QUAD |
| 宽度 | 7.5 mm | 5 mm | 7.5 mm | 14 mm | 7.5 mm | 14 mm | 14 mm | 5 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | - |
| 厂商名称 | ST(意法半导体) | - | - | - | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
| DAC 通道 | NO | NO | NO | NO | NO | NO | NO | - |
| 座面最大高度 | 2.65 mm | 1 mm | 2.65 mm | 1.6 mm | 2.65 mm | 1.6 mm | 1.6 mm | - |
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