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SCN68661BA1F28

产品描述IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, CDIP28, 0.600 INCH, CERAMIC, DIP-28, Serial IO/Communication Controller
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小695KB,共19页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
下载文档 详细参数 选型对比 全文预览

SCN68661BA1F28概述

IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, CDIP28, 0.600 INCH, CERAMIC, DIP-28, Serial IO/Communication Controller

SCN68661BA1F28规格参数

参数名称属性值
厂商名称NXP(恩智浦)
零件包装代码DIP
包装说明DIP,
针数28
Reach Compliance Codeunknown
其他特性MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS
地址总线宽度2
边界扫描NO
通信协议ASYNC, BIT; SYNC, BYTE; BISYNC
数据编码/解码方法NRZ
最大数据传输速率0.125 MBps
外部数据总线宽度8
JESD-30 代码R-GDIP-T28
长度37.15 mm
低功率模式NO
DMA 通道数量
I/O 线路数量
串行 I/O 数1
端子数量28
片上数据RAM宽度
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料CERAMIC, GLASS-SEALED
封装代码DIP
封装形状RECTANGULAR
封装形式IN-LINE
认证状态Not Qualified
RAM(字数)0
座面最大高度5.72 mm
最大压摆率150 mA
最大供电电压5.25 V
最小供电电压4.75 V
标称供电电压5 V
表面贴装NO
技术NMOS
温度等级INDUSTRIAL
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
宽度15.24 mm
uPs/uCs/外围集成电路类型SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

SCN68661BA1F28相似产品对比

SCN68661BA1F28 SCN68661CA1F28 SCN68661CC1A28 SCN68661CC1N28 SCN68661AC1N28 SCN68661AC1A28 SCN68661BC1N28 SCN68661CC1F28 SCN68661BC1A28
描述 IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, CDIP28, 0.600 INCH, CERAMIC, DIP-28, Serial IO/Communication Controller IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, CDIP28, 0.600 INCH, CERAMIC, DIP-28, Serial IO/Communication Controller IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, PQCC28, PLASTIC, LCC-28, Serial IO/Communication Controller IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, PDIP28, 0.600 INCH, PLASTIC, DIP-28, Serial IO/Communication Controller IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, PDIP28, 0.600 INCH, PLASTIC, DIP-28, Serial IO/Communication Controller IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, PQCC28, PLASTIC, LCC-28, Serial IO/Communication Controller IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, PDIP28, 0.600 INCH, PLASTIC, DIP-28, Serial IO/Communication Controller IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, CDIP28, 0.600 INCH, CERAMIC, DIP-28, Serial IO/Communication Controller IC 1 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, PQCC28, PLASTIC, LCC-28, Serial IO/Communication Controller
零件包装代码 DIP DIP QLCC DIP DIP QLCC DIP DIP QLCC
包装说明 DIP, DIP, QCCJ, DIP, DIP, QCCJ, DIP, DIP, QCCJ,
针数 28 28 28 28 28 28 28 28 28
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
其他特性 MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS
地址总线宽度 2 2 2 2 2 2 2 2 2
边界扫描 NO NO NO NO NO NO NO NO NO
通信协议 ASYNC, BIT; SYNC, BYTE; BISYNC ASYNC, BIT; SYNC, BYTE; BISYNC ASYNC, BIT; SYNC, BYTE; BISYNC ASYNC, BIT; SYNC, BYTE; BISYNC ASYNC, BIT; SYNC, BYTE; BISYNC ASYNC, BIT; SYNC, BYTE; BISYNC ASYNC, BIT; SYNC, BYTE; BISYNC ASYNC, BIT; SYNC, BYTE; BISYNC ASYNC, BIT; SYNC, BYTE; BISYNC
数据编码/解码方法 NRZ NRZ NRZ NRZ NRZ NRZ NRZ NRZ NRZ
最大数据传输速率 0.125 MBps 0.125 MBps 0.125 MBps 0.125 MBps 0.125 MBps 0.125 MBps 0.125 MBps 0.125 MBps 0.125 MBps
外部数据总线宽度 8 8 8 8 8 8 8 8 8
JESD-30 代码 R-GDIP-T28 R-GDIP-T28 S-PQCC-J28 R-PDIP-T28 R-PDIP-T28 S-PQCC-J28 R-PDIP-T28 R-GDIP-T28 S-PQCC-J28
长度 37.15 mm 37.15 mm 11.5062 mm 36.51 mm 36.51 mm 11.5062 mm 36.51 mm 37.15 mm 11.5062 mm
低功率模式 NO NO NO NO NO NO NO NO NO
串行 I/O 数 1 1 1 1 1 1 1 1 1
端子数量 28 28 28 28 28 28 28 28 28
最高工作温度 85 °C 85 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
封装主体材料 CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC, GLASS-SEALED PLASTIC/EPOXY
封装代码 DIP DIP QCCJ DIP DIP QCCJ DIP DIP QCCJ
封装形状 RECTANGULAR RECTANGULAR SQUARE RECTANGULAR RECTANGULAR SQUARE RECTANGULAR RECTANGULAR SQUARE
封装形式 IN-LINE IN-LINE CHIP CARRIER IN-LINE IN-LINE CHIP CARRIER IN-LINE IN-LINE CHIP CARRIER
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 5.72 mm 5.72 mm 4.57 mm 5.08 mm 5.08 mm 4.57 mm 5.08 mm 5.72 mm 4.57 mm
最大压摆率 150 mA 150 mA 150 mA 150 mA 150 mA 150 mA 150 mA 150 mA 150 mA
最大供电电压 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V
最小供电电压 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V
标称供电电压 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 NO NO YES NO NO YES NO NO YES
技术 NMOS NMOS NMOS NMOS NMOS NMOS NMOS NMOS NMOS
温度等级 INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子形式 THROUGH-HOLE THROUGH-HOLE J BEND THROUGH-HOLE THROUGH-HOLE J BEND THROUGH-HOLE THROUGH-HOLE J BEND
端子节距 2.54 mm 2.54 mm 1.27 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm 2.54 mm 1.27 mm
端子位置 DUAL DUAL QUAD DUAL DUAL QUAD DUAL DUAL QUAD
宽度 15.24 mm 15.24 mm 11.5062 mm 15.24 mm 15.24 mm 11.5062 mm 15.24 mm 15.24 mm 11.5062 mm
uPs/uCs/外围集成电路类型 SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
厂商名称 NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) - - - NXP(恩智浦) -
Base Number Matches - 1 1 1 1 1 1 - 1

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