Parallel I/O Port, 8 I/O, CMOS, 4 X 4 MM, ROHS COMPLIANT, MO-220, TQFN-16
参数名称 | 属性值 |
厂商名称 | Catalyst |
零件包装代码 | QFN |
包装说明 | HVQCCN, |
针数 | 16 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
JESD-30 代码 | S-XQCC-N16 |
JESD-609代码 | e4 |
长度 | 4 mm |
I/O 线路数量 | 8 |
端口数量 | 1 |
端子数量 | 16 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | UNSPECIFIED |
封装代码 | HVQCCN |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
认证状态 | Not Qualified |
座面最大高度 | 0.8 mm |
最大供电电压 | 5.5 V |
最小供电电压 | 2.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | NICKEL PALLADIUM GOLD |
端子形式 | NO LEAD |
端子节距 | 0.65 mm |
端子位置 | QUAD |
宽度 | 4 mm |
uPs/uCs/外围集成电路类型 | PARALLEL IO PORT, GENERAL PURPOSE |
CAT9534HV4I-G | CAT9534HV4I-GT2 | CAT9534WI-GT2 | CAT9534YI-GT2 | |
---|---|---|---|---|
描述 | Parallel I/O Port, 8 I/O, CMOS, 4 X 4 MM, ROHS COMPLIANT, MO-220, TQFN-16 | Parallel I/O Port, 8 I/O, CMOS, 4 X 4 MM, ROHS COMPLIANT, MO-220, TQFN-16 | Parallel I/O Port, 8 I/O, CMOS, PDSO16, 0.150 INCH, ROHS COMPLIANT, MS-012, SOIC-16 | Parallel I/O Port, 8 I/O, CMOS, PDSO16, 4.40 MM, ROHS COMPLIANT, MO-153, TSSOP-16 |
厂商名称 | Catalyst | Catalyst | Catalyst | Catalyst |
零件包装代码 | QFN | QFN | SOIC | TSSOP |
包装说明 | HVQCCN, | HVQCCN, | SOP, | TSSOP, |
针数 | 16 | 16 | 16 | 16 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
JESD-30 代码 | S-XQCC-N16 | S-XQCC-N16 | R-PDSO-G16 | R-PDSO-G16 |
JESD-609代码 | e4 | e4 | e4 | e4 |
长度 | 4 mm | 4 mm | 9.9 mm | 5 mm |
I/O 线路数量 | 8 | 8 | 8 | 8 |
端口数量 | 1 | 1 | 1 | 1 |
端子数量 | 16 | 16 | 16 | 16 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HVQCCN | HVQCCN | SOP | TSSOP |
封装形状 | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 0.8 mm | 0.8 mm | 1.75 mm | 1.1 mm |
最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 | 2.3 V | 2.3 V | 2.3 V | 2.3 V |
表面贴装 | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD |
端子形式 | NO LEAD | NO LEAD | GULL WING | GULL WING |
端子节距 | 0.65 mm | 0.65 mm | 1.27 mm | 0.65 mm |
端子位置 | QUAD | QUAD | DUAL | DUAL |
宽度 | 4 mm | 4 mm | 3.9 mm | 4.4 mm |
uPs/uCs/外围集成电路类型 | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE |
Base Number Matches | - | 1 | 1 | 1 |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved