TSTM872-20
RF POWER MODULE
MOBILE APPLICATIONS
PRODUCT DEVELOPMENT DATA SHEET
This data sheet contains the design criteria and target specifications for a product which is currently under
development by SGS-THOMSON. The design criteria and specifications of this item could change prior
to introduction and SGS-THOMSON assumes no liability for use of information contained herein.
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MOBILE CLASS C POWER AMPLIFIER
806 - 870 MHz
12.5 VOLTS
INPUT/OUTPUT 50 OHMS
P
OUT
=
20 W MIN.
GAIN
=
19 dB MIN.
ORDER CODE
TSTM872-20
BRANDING
TSTM872-20
PIN CONNECTION
DESCRIPTION
The TSTM872-20 module is designed for high
power, high efficiency, analog private mobile
radio systems in the 806 - 870 MHz frequency
range.
A significant advantage of this module is its
high RF power output performance and very
low standby current.
1. RF Input
4. 12.5 Vdc V
S3
2. 12.5 Vdc V
S1
5. RF Output
3. 12.5 Vdc V
S2
ABSOLUTE MAXIMUM RATINGS
(Tcase
=
25
°
C)
Symbol
Parameter
Value
Unit
V
S1
, V
S 2
, V
S 3
DC Supply Voltage
P
IN
P
OUT
T
S TG
T
C
RF Input Power
RF Output Power
Storage Temperature
Operating Case Temperature
16
400
25
−
30 to +100
−
30 to +100
Vdc
mW
W
°
C
°
C
TSTM872-20
APPLICATIONS RECOMMENDATIONS
OPERATION LIMITS
The TSTM872-20 power module should never be
operated under any condition which exceeds the
Absolute Maximum Ratings presented on this
data sheet. Nor should the module be operated
continuously at any of the specified maximum rat-
ings. If the module is to be subjected to one or
more of the maximum rating conditions, care
must be taken to monitor other parameters which
may be affected.
DECOUPLING
Failure to properly decouple any of the voltage
supply pins will result in oscillations at certain op-
erating frequencies. Therefore, it is recommended
that these pins be bypassed as indicated in the
Module DC and Test Fixture Configuration draw-
ing of this data sheet.
MODULE MOUNTING
To insure adequate thermal transfer from the
module to the heatsink, it is recommended that a
satisfactory thermal compound such as Dow
Corning 340, Wakefield 120-2 or equivalent be
applied between the module flange and the
heatsink.
The heatsink mounting surface under the module
should be flat to within +/- 0.05 mm (+/- 0.002
inch). The module should be mounted to the
heatsink using 3.5 mm (or 6-32) or equivalent
screws torques to 5-6 kg-cm (4-6 in-lb).
The module leads should be attached to equip-
ment PC board using 180°C solder applied to the
leads with a properly grounded soldering iron tip,
not to exceed 195°C, applied a minimum of 2 mm
(0.080”) from the body of the module for a dura-
tion not to exceed 15 seconds per lead. It is im-
perative that no other portion of the module, other
than the leads, be subjected to temperatures in
excess of 100°C (maximum storage temperature),
for any period of time, as the plastic moulded
cover, internal components and sealing adhesives
may be adversely affected by such conditions.
Due to the construction techniques and materials
used within the module, reflow soldering of the
flange heatsink or leads, is not recommended.
TSTM872-20
PACKAGE MECHANICAL DATA
Ref.: Dwg. No. M12-030 rev. C
Information furnished is believed to be accurate and reli able. However, SGS-THOMSON Microelectr onics assumes no respon-
sibili ty for the consequences of use of such information nor for any infringement of patents or other rights of third parties which
may result fr om its use. No license is granted by implication or otherwise under any patent or patent rights of S GS-T HOMSON
Microelectronics. Specifications mentioned in this publication are subject to change wi thout notice. This publi cati on super sedes
and replaces all information previously supplied. SGS-T HOMSON Microelectronics products are not authorized for use as criti cal
components in life support devices or systems without express written approval of SGS-THOMSON Mi croelectr onics.
©1995
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SGS -T HOMSON Microelectronics GROUP OF COMPANIES
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