RISC Microprocessor, 32-Bit, 25MHz, 3.900 X 3.200 INCH, PLUG IN MODULE
参数名称 | 属性值 |
厂商名称 | IDT (Integrated Device Technology) |
零件包装代码 | MODULE |
包装说明 | , |
Reach Compliance Code | unknown |
地址总线宽度 | 32 |
位大小 | 32 |
边界扫描 | NO |
最大时钟频率 | 25 MHz |
外部数据总线宽度 | 32 |
格式 | FLOATING POINT |
集成缓存 | YES |
JESD-30 代码 | R-XXMA-X |
JESD-609代码 | e0 |
低功率模式 | NO |
封装主体材料 | UNSPECIFIED |
封装形状 | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY |
认证状态 | Not Qualified |
速度 | 25 MHz |
表面贴装 | NO |
技术 | CMOS |
端子面层 | TIN LEAD |
端子形式 | UNSPECIFIED |
端子位置 | UNSPECIFIED |
uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC |
7RS102-25A | 7RS102-20A | 7RS102-16A | 7RS102F20A | 7RS102F25A | 7RS102F16A | |
---|---|---|---|---|---|---|
描述 | RISC Microprocessor, 32-Bit, 25MHz, 3.900 X 3.200 INCH, PLUG IN MODULE | RISC Microprocessor, 32-Bit, 20MHz, 3.900 X 3.200 INCH, PLUG IN MODULE | RISC Microprocessor, 32-Bit, 16MHz, 3.900 X 3.200 INCH, PLUG IN MODULE | RISC Microprocessor, 32-Bit, 20MHz, 3.900 X 3.200 INCH, PLUG IN MODULE | RISC Microprocessor, 32-Bit, 25MHz, 3.900 X 3.200 INCH, PLUG IN MODULE | RISC Microprocessor, 32-Bit, 16MHz, 3.900 X 3.200 INCH, PLUG IN MODULE |
厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
零件包装代码 | MODULE | MODULE | MODULE | MODULE | MODULE | MODULE |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
地址总线宽度 | 32 | 32 | 32 | 32 | 32 | 32 |
位大小 | 32 | 32 | 32 | 32 | 32 | 32 |
边界扫描 | NO | NO | NO | NO | NO | NO |
最大时钟频率 | 25 MHz | 20 MHz | 16 MHz | 20 MHz | 25 MHz | 16 MHz |
外部数据总线宽度 | 32 | 32 | 32 | 32 | 32 | 32 |
格式 | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT |
集成缓存 | YES | YES | YES | YES | YES | YES |
JESD-30 代码 | R-XXMA-X | R-XXMA-X | R-XXMA-X | R-XXMA-X | R-XXMA-X | R-XXMA-X |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
低功率模式 | NO | NO | NO | NO | NO | NO |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
速度 | 25 MHz | 20 MHz | 16 MHz | 20 MHz | 25 MHz | 16 MHz |
表面贴装 | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
端子位置 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |
Base Number Matches | - | 1 | 1 | 1 | 1 | 1 |
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