Standard SRAM, 128KX8, 85ns, CMOS, PDSO32
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Brilliance |
包装说明 | TSSOP, TSSOP32,.8,20 |
Reach Compliance Code | unknown |
最长访问时间 | 85 ns |
I/O 类型 | COMMON |
JESD-30 代码 | R-PDSO-G32 |
JESD-609代码 | e0 |
内存密度 | 1048576 bit |
内存集成电路类型 | STANDARD SRAM |
内存宽度 | 8 |
湿度敏感等级 | 3 |
端子数量 | 32 |
字数 | 131072 words |
字数代码 | 128000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 128KX8 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装等效代码 | TSSOP32,.8,20 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | 240 |
电源 | 2/3 V |
认证状态 | Not Qualified |
最大待机电流 | 2e-7 A |
最小待机电流 | 1.2 V |
最大压摆率 | 0.013 mA |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
BS62UV1027TC85 | BS62UV1027PI10 | BS62UV1027SI85 | BS62UV1027STC10 | BS62UV1027PC85 | BS62UV1027JI10 | BS62UV1027JI85 | BS62UV1027SC85 | BS62UV1027SI10 | BS62UV1027STI10 | |
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描述 | Standard SRAM, 128KX8, 85ns, CMOS, PDSO32 | Standard SRAM, 128KX8, 100ns, CMOS, PDIP32 | Standard SRAM, 128KX8, 85ns, CMOS, PDSO32 | Standard SRAM, 128KX8, 100ns, CMOS, PDSO32 | Standard SRAM, 128KX8, 85ns, CMOS, PDIP32 | Standard SRAM, 128KX8, 100ns, CMOS, PDSO32 | Standard SRAM, 128KX8, 85ns, CMOS, PDSO32 | Standard SRAM, 128KX8, 85ns, CMOS, PDSO32 | Standard SRAM, 128KX8, 100ns, CMOS, PDSO32 | Standard SRAM, 128KX8, 100ns, CMOS, PDSO32 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | TSSOP, TSSOP32,.8,20 | DIP, DIP32,.6 | SOP, SOP32,.56 | TSSOP, TSSOP32,.56,20 | DIP, DIP32,.6 | SOJ, SOJ32,.34 | SOJ, SOJ32,.34 | SOP, SOP32,.56 | SOP, SOP32,.56 | TSSOP, TSSOP32,.56,20 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
最长访问时间 | 85 ns | 100 ns | 85 ns | 100 ns | 85 ns | 100 ns | 85 ns | 85 ns | 100 ns | 100 ns |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-PDSO-G32 | R-PDIP-T32 | R-PDSO-G32 | R-PDSO-G32 | R-PDIP-T32 | R-PDSO-J32 | R-PDSO-J32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
内存密度 | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
端子数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
字数 | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
字数代码 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 85 °C | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C | 85 °C | 85 °C |
最低工作温度 | - | -40 °C | -40 °C | - | - | -40 °C | -40 °C | - | -40 °C | -40 °C |
组织 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | DIP | SOP | TSSOP | DIP | SOJ | SOJ | SOP | SOP | TSSOP |
封装等效代码 | TSSOP32,.8,20 | DIP32,.6 | SOP32,.56 | TSSOP32,.56,20 | DIP32,.6 | SOJ32,.34 | SOJ32,.34 | SOP32,.56 | SOP32,.56 | TSSOP32,.56,20 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | 240 | 240 | 240 | 240 | 240 | 240 | 240 | 240 | 240 | 240 |
电源 | 2/3 V | 2/3 V | 2/3 V | 2/3 V | 2/3 V | 2/3 V | 2/3 V | 2/3 V | 2/3 V | 2/3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大待机电流 | 2e-7 A | 3e-7 A | 3e-7 A | 2e-7 A | 2e-7 A | 3e-7 A | 3e-7 A | 2e-7 A | 3e-7 A | 3e-7 A |
最小待机电流 | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
最大压摆率 | 0.013 mA | 0.015 mA | 0.015 mA | 0.013 mA | 0.013 mA | 0.015 mA | 0.015 mA | 0.013 mA | 0.015 mA | 0.015 mA |
表面贴装 | YES | NO | YES | YES | NO | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | J BEND | J BEND | GULL WING | GULL WING | GULL WING |
端子节距 | 0.5 mm | 2.54 mm | 1.27 mm | 0.5 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.5 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
厂商名称 | Brilliance | - | - | - | Brilliance | Brilliance | Brilliance | Brilliance | Brilliance | Brilliance |
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