Standard SRAM, 16KX4, 35ns, CMOS, CDIP24
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Pyramid Semiconductor Corporation |
包装说明 | DIP, DIP24,.3 |
Reach Compliance Code | unknown |
最长访问时间 | 35 ns |
I/O 类型 | COMMON |
JESD-30 代码 | R-XDIP-T24 |
JESD-609代码 | e0 |
内存密度 | 65536 bit |
内存集成电路类型 | STANDARD SRAM |
内存宽度 | 4 |
端子数量 | 24 |
字数 | 16384 words |
字数代码 | 16000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 16KX4 |
输出特性 | 3-STATE |
封装主体材料 | CERAMIC |
封装代码 | DIP |
封装等效代码 | DIP24,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
并行/串行 | PARALLEL |
电源 | 5 V |
认证状态 | Not Qualified |
最大待机电流 | 0.00015 A |
最小待机电流 | 2 V |
最大压摆率 | 0.1 mA |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
P4C198AL-35CC | P4C198AL-35JC | P4C198L-20LC | P4C198-17CC | P4C198-17JC | P4C198-17LC | P4C198-55CM | P4C198A-55CM | P4C198AL-20CC | |
---|---|---|---|---|---|---|---|---|---|
描述 | Standard SRAM, 16KX4, 35ns, CMOS, CDIP24 | Standard SRAM, 16KX4, 35ns, CMOS, PDSO24 | Standard SRAM, 16KX4, 20ns, CMOS, CQCC28 | Standard SRAM, 16KX4, 17ns, CMOS, CDIP24 | Standard SRAM, 16KX4, 17ns, CMOS, PDSO24 | Standard SRAM, 16KX4, 17ns, CMOS, CQCC28 | Standard SRAM, 16KX4, 55ns, CMOS, CDIP24 | Standard SRAM, 16KX4, 55ns, CMOS, CDIP24 | Standard SRAM, 16KX4, 20ns, CMOS, CDIP24 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Pyramid Semiconductor Corporation | Pyramid Semiconductor Corporation | Pyramid Semiconductor Corporation | Pyramid Semiconductor Corporation | Pyramid Semiconductor Corporation | Pyramid Semiconductor Corporation | Pyramid Semiconductor Corporation | Pyramid Semiconductor Corporation | Pyramid Semiconductor Corporation |
包装说明 | DIP, DIP24,.3 | SOJ, SOJ24,.34 | QCCN, LCC28,.35X.55 | DIP, DIP24,.3 | SOJ, SOJ24,.34 | QCCN, LCC28,.35X.55 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
最长访问时间 | 35 ns | 35 ns | 20 ns | 17 ns | 17 ns | 17 ns | 55 ns | 55 ns | 20 ns |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-XDIP-T24 | R-PDSO-J24 | R-XQCC-N28 | R-XDIP-T24 | R-PDSO-J24 | R-XQCC-N28 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
内存密度 | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
端子数量 | 24 | 24 | 28 | 24 | 24 | 28 | 24 | 24 | 24 |
字数 | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words |
字数代码 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 125 °C | 125 °C | 70 °C |
组织 | 16KX4 | 16KX4 | 16KX4 | 16KX4 | 16KX4 | 16KX4 | 16KX4 | 16KX4 | 16KX4 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
封装代码 | DIP | SOJ | QCCN | DIP | SOJ | QCCN | DIP | DIP | DIP |
封装等效代码 | DIP24,.3 | SOJ24,.34 | LCC28,.35X.55 | DIP24,.3 | SOJ24,.34 | LCC28,.35X.55 | DIP24,.3 | DIP24,.3 | DIP24,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | SMALL OUTLINE | CHIP CARRIER | IN-LINE | SMALL OUTLINE | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大待机电流 | 0.00015 A | 0.00015 A | 0.00015 A | 0.015 A | 0.015 A | 0.015 A | 0.02 A | 0.02 A | 0.00015 A |
最小待机电流 | 2 V | 2 V | 2 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 2 V |
最大压摆率 | 0.1 mA | 0.1 mA | 0.1 mA | 0.125 mA | 0.125 mA | 0.125 mA | 0.12 mA | 0.12 mA | 0.1 mA |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | YES | YES | NO | YES | YES | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | J BEND | NO LEAD | THROUGH-HOLE | J BEND | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | QUAD | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL |
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