UNBUMPED FLIP CHIP ARRAY
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
零件包装代码 | FLIP-CHIP |
包装说明 | R-PBGA-B4 |
针数 | 4 |
Reach Compliance Code | compli |
ECCN代码 | EAR99 |
最小击穿电压 | 26.7 V |
击穿电压标称值 | 26.7 V |
最大钳位电压 | 55 V |
配置 | COMMON BIPOLAR TERMINAL, 3 ELEMENTS |
二极管元件材料 | SILICON |
二极管类型 | TRANS VOLTAGE SUPPRESSOR DIODE |
JESD-30 代码 | R-PBGA-B4 |
JESD-609代码 | e0 |
湿度敏感等级 | 1 |
最大非重复峰值反向功率耗散 | 250 W |
元件数量 | 3 |
端子数量 | 4 |
封装主体材料 | PLASTIC/EPOXY |
封装形状 | RECTANGULAR |
封装形式 | GRID ARRAY |
峰值回流温度(摄氏度) | 245 |
极性 | BIDIRECTIONAL |
认证状态 | Not Qualified |
最大重复峰值反向电压 | 24 V |
表面贴装 | YES |
技术 | AVALANCHE |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | BALL |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
Base Number Matches | 1 |
U0404FC24C | U0404FC05C | U0404FC33C | U0404FC3.3C | U0404FC36C | U0404FC15C | U0404FC08C | U0404FC12C | |
---|---|---|---|---|---|---|---|---|
描述 | UNBUMPED FLIP CHIP ARRAY | UNBUMPED FLIP CHIP ARRAY | UNBUMPED FLIP CHIP ARRAY | UNBUMPED FLIP CHIP ARRAY | UNBUMPED FLIP CHIP ARRAY | UNBUMPED FLIP CHIP ARRAY | UNBUMPED FLIP CHIP ARRAY | UNBUMPED FLIP CHIP ARRAY |
是否Rohs认证 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | FLIP-CHIP | FLIP-CHIP | - | FLIP-CHIP | FLIP-CHIP | FLIP-CHIP | FLIP-CHIP | FLIP-CHIP |
包装说明 | R-PBGA-B4 | R-PBGA-B4 | - | R-PBGA-B4 | R-PBGA-B4 | R-PBGA-B4 | R-PBGA-B4 | R-PBGA-B4 |
针数 | 4 | 4 | - | 4 | 4 | 4 | 4 | 4 |
Reach Compliance Code | compli | compli | - | compli | compli | compli | compli | compli |
ECCN代码 | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最小击穿电压 | 26.7 V | 6 V | - | 4 V | 40 V | 16.7 V | 8.5 V | 13.3 V |
击穿电压标称值 | 26.7 V | 6 V | - | 4 V | 40 V | 16.7 V | 8.5 V | 13.3 V |
最大钳位电压 | 55 V | 14.7 V | - | 12.5 V | 84 V | 35.7 V | 19.2 V | 29.7 V |
配置 | COMMON BIPOLAR TERMINAL, 3 ELEMENTS | COMMON BIPOLAR TERMINAL, 3 ELEMENTS | - | COMMON BIPOLAR TERMINAL, 3 ELEMENTS | COMMON BIPOLAR TERMINAL, 3 ELEMENTS | COMMON BIPOLAR TERMINAL, 3 ELEMENTS | COMMON BIPOLAR TERMINAL, 3 ELEMENTS | COMMON BIPOLAR TERMINAL, 3 ELEMENTS |
二极管元件材料 | SILICON | SILICON | - | SILICON | SILICON | SILICON | SILICON | SILICON |
二极管类型 | TRANS VOLTAGE SUPPRESSOR DIODE | TRANS VOLTAGE SUPPRESSOR DIODE | - | TRANS VOLTAGE SUPPRESSOR DIODE | TRANS VOLTAGE SUPPRESSOR DIODE | TRANS VOLTAGE SUPPRESSOR DIODE | TRANS VOLTAGE SUPPRESSOR DIODE | TRANS VOLTAGE SUPPRESSOR DIODE |
JESD-30 代码 | R-PBGA-B4 | R-PBGA-B4 | - | R-PBGA-B4 | R-PBGA-B4 | R-PBGA-B4 | R-PBGA-B4 | R-PBGA-B4 |
JESD-609代码 | e0 | e0 | - | e0 | e0 | e0 | e0 | e0 |
湿度敏感等级 | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 |
最大非重复峰值反向功率耗散 | 250 W | 250 W | - | 250 W | 250 W | 250 W | 250 W | 250 W |
元件数量 | 3 | 3 | - | 3 | 3 | 3 | 3 | 3 |
端子数量 | 4 | 4 | - | 4 | 4 | 4 | 4 | 4 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | GRID ARRAY | GRID ARRAY | - | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
峰值回流温度(摄氏度) | 245 | 245 | - | 245 | 245 | 245 | 245 | 245 |
极性 | BIDIRECTIONAL | BIDIRECTIONAL | - | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL |
认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大重复峰值反向电压 | 24 V | 5 V | - | 3.3 V | 36 V | 15 V | 8 V | 12 V |
表面贴装 | YES | YES | - | YES | YES | YES | YES | YES |
技术 | AVALANCHE | AVALANCHE | - | AVALANCHE | AVALANCHE | AVALANCHE | AVALANCHE | AVALANCHE |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | BALL | BALL | - | BALL | BALL | BALL | BALL | BALL |
端子位置 | BOTTOM | BOTTOM | - | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Base Number Matches | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 |
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