Inverter, CMOS,
| 参数名称 | 属性值 |
| 厂商名称 | RCA |
| 包装说明 | , DIE OR CHIP |
| Reach Compliance Code | unknown |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | INVERTER |
| 最大I（ol） | 0.00036 A |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装等效代码 | DIE OR CHIP |
| 电源 | 5/15 V |
| Prop。Delay @ Nom-Sup | 162 ns |
| 认证状态 | Not Qualified |
| 施密特触发器 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 总剂量 | 1M Rad(Si) V |
| CD4049UBH | CD4049UBE | CD4050BE | CD4050BD | CD4049UBF | CD4049UBK | CD4050BF | CD4050BH | CD4050BK | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Inverter, CMOS, | Inverter, CMOS, PDIP16, | Buffer, CMOS, PDIP16, | Buffer, CMOS, CDIP16, | Inverter, CMOS, CDIP16, | Inverter, CMOS, CDFP16, | Buffer, CMOS, CDIP16, | Buffer, CMOS, | Buffer, CMOS, CDFP16, |
| 包装说明 | , DIE OR CHIP | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DFP, FL16,.3 | DIP, DIP16,.3 | , DIE OR CHIP | DFP, FL16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknow | unknown | unknown | unknown |
| 逻辑集成电路类型 | INVERTER | INVERTER | BUFFER | BUFFER | INVERTER | INVERTER | BUFFER | BUFFER | BUFFER |
| 最高工作温度 | 125 °C | 85 °C | 85 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -40 °C | -40 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装等效代码 | DIE OR CHIP | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | FL16,.3 | DIP16,.3 | DIE OR CHIP | FL16,.3 |
| 电源 | 5/15 V | 4.5/15 V | 5/15 V | 5/15 V | 4.5/15 V | 4.5/15 V | 5/15 V | 5/15 V | 5/15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 施密特触发器 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 厂商名称 | RCA | - | RCA | RCA | RCA | RCA | RCA | RCA | RCA |
| 是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - | 不符合 |
| JESD-30 代码 | - | R-PDIP-T16 | R-PDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDFP-F16 | R-XDIP-T16 | - | R-XDFP-F16 |
| JESD-609代码 | - | e0 | e0 | e0 | e0 | e0 | e0 | - | e0 |
| 端子数量 | - | 16 | 16 | 16 | 16 | 16 | 16 | - | 16 |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC | - | CERAMIC |
| 封装代码 | - | DIP | DIP | DIP | DIP | DFP | DIP | - | DFP |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | - | IN-LINE | IN-LINE | IN-LINE | IN-LINE | FLATPACK | IN-LINE | - | FLATPACK |
| 表面贴装 | - | NO | NO | NO | NO | YES | NO | - | YES |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| 端子形式 | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | THROUGH-HOLE | - | FLAT |
| 端子节距 | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | - | 1.27 mm |
| 端子位置 | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | - | DUAL |
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