Standard SRAM, 256KX8, 300ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32
| 参数名称 | 属性值 |
| 厂商名称 | SAMSUNG(三星) |
| 零件包装代码 | TSOP1 |
| 包装说明 | TSSOP, |
| 针数 | 32 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A991.B.2.A |
| 最长访问时间 | 300 ns |
| JESD-30 代码 | R-PDSO-G32 |
| 长度 | 18.4 mm |
| 内存密度 | 2097152 bit |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 32 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 256KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 2.7 V |
| 最小供电电压 (Vsup) | 1.8 V |
| 标称供电电压 (Vsup) | 2 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 宽度 | 8 mm |

| KM68FR2000T-3000 | KM68FV2000T-8000 | KM68FS2000TI-120 | KM68FS2000T-1200 | KM68FR2000TI-300 | KM68FV2000TI-800 | KM68FV2000T-7000 | KM68FV2000TI-700 | KM68FS2000T-1500 | KM68FS2000TI-150 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Standard SRAM, 256KX8, 300ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32 | Standard SRAM, 256KX8, 85ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32 | Standard SRAM, 256KX8, 120ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32 | Standard SRAM, 256KX8, 120ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32 | Standard SRAM, 256KX8, 300ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32 | Standard SRAM, 256KX8, 85ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32 | Standard SRAM, 256KX8, 70ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32 | Standard SRAM, 256KX8, 70ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32 | Standard SRAM, 256KX8, 150ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32 | Standard SRAM, 256KX8, 150ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32 |
| 零件包装代码 | TSOP1 | TSOP1 | TSOP1 | TSOP1 | TSOP1 | TSOP1 | TSOP1 | TSOP1 | TSOP1 | TSOP1 |
| 包装说明 | TSSOP, | TSSOP, | TSSOP, | TSSOP, | TSSOP, | TSSOP, | TSSOP, | TSSOP, | TSSOP, | TSSOP, |
| 针数 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
| 最长访问时间 | 300 ns | 85 ns | 120 ns | 120 ns | 300 ns | 85 ns | 70 ns | 70 ns | 150 ns | 150 ns |
| JESD-30 代码 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 |
| 长度 | 18.4 mm | 18.4 mm | 18.4 mm | 18.4 mm | 18.4 mm | 18.4 mm | 18.4 mm | 18.4 mm | 18.4 mm | 18.4 mm |
| 内存密度 | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C |
| 组织 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 2.7 V | 3.6 V | 3.3 V | 3.3 V | 2.7 V | 3.6 V | 3.6 V | 3.6 V | 3.3 V | 3.3 V |
| 最小供电电压 (Vsup) | 1.8 V | 3 V | 2.3 V | 2.3 V | 1.8 V | 3 V | 3 V | 3 V | 2.3 V | 2.3 V |
| 标称供电电压 (Vsup) | 2 V | 3.3 V | 2.5 V | 2.5 V | 2 V | 3.3 V | 3.3 V | 3.3 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm |
| 厂商名称 | SAMSUNG(三星) | - | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) |
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