ADC, Proprietary Method, 4-Bit, 1 Func, 1 Channel, Parallel, 4 Bits Access, Bipolar, PQCC20,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Raytheon Company |
| Reach Compliance Code | unknown |
| 最大模拟输入电压 | |
| 最小模拟输入电压 | -1 V |
| 转换器类型 | ADC, PROPRIETARY METHOD |
| JESD-30 代码 | S-PQCC-J20 |
| JESD-609代码 | e0 |
| 最大线性误差 (EL) | 1.6% |
| 标称负供电电压 | -5.2 V |
| 模拟输入通道数量 | 1 |
| 位数 | 4 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出位码 | BINARY, COMPLEMENTARY BINARY, OFFSET 2\'S COMPLEMENT, COMPLEMENTARY OFFSET 2\'S COMPLEMENT |
| 输出格式 | PARALLEL, 4 BITS |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装等效代码 | LDCC20,.4SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5,-5.2 V |
| 认证状态 | Not Qualified |
| 采样速率 | 25 MHz |
| 最大压摆率 | 50 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | BIPOLAR |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| TDC1044AR4C | TDC1044AB9C | TDC1044AN9C | |
|---|---|---|---|
| 描述 | ADC, Proprietary Method, 4-Bit, 1 Func, 1 Channel, Parallel, 4 Bits Access, Bipolar, PQCC20, | ADC, Proprietary Method, 4-Bit, 1 Func, 1 Channel, Parallel, 4 Bits Access, Bipolar, CDIP16, | ADC, Proprietary Method, 4-Bit, 1 Func, 1 Channel, Parallel, 4 Bits Access, Bipolar, PDIP16, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Raytheon Company | Raytheon Company | Raytheon Company |
| Reach Compliance Code | unknown | unknown | unknown |
| 最小模拟输入电压 | -1 V | -1 V | -1 V |
| 转换器类型 | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD |
| JESD-30 代码 | S-PQCC-J20 | R-GDIP-T16 | R-PDIP-T16 |
| JESD-609代码 | e0 | e0 | e0 |
| 最大线性误差 (EL) | 1.6% | 1.6% | 1.6% |
| 标称负供电电压 | -5.2 V | -5.2 V | -5.2 V |
| 模拟输入通道数量 | 1 | 1 | 1 |
| 位数 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 |
| 端子数量 | 20 | 16 | 16 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C |
| 输出位码 | BINARY, COMPLEMENTARY BINARY, OFFSET 2\'S COMPLEMENT, COMPLEMENTARY OFFSET 2\'S COMPLEMENT | BINARY, COMPLEMENTARY BINARY, OFFSET 2\'S COMPLEMENT, COMPLEMENTARY OFFSET 2\'S COMPLEMENT | BINARY, COMPLEMENTARY BINARY, OFFSET 2\'S COMPLEMENT, COMPLEMENTARY OFFSET 2\'S COMPLEMENT |
| 输出格式 | PARALLEL, 4 BITS | PARALLEL, 4 BITS | PARALLEL, 4 BITS |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| 封装代码 | QCCJ | DIP | DIP |
| 封装等效代码 | LDCC20,.4SQ | DIP16,.25 | DIP16,.3 |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5,-5.2 V | 5,-5.2 V | 5,-5.2 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 采样速率 | 25 MHz | 25 MHz | 25 MHz |
| 最大压摆率 | 50 mA | 50 mA | 50 mA |
| 标称供电电压 | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm |
| 端子位置 | QUAD | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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