电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

KM736S849H-75

产品描述ZBT SRAM, 512KX18, 4.2ns, CMOS, PBGA119, BGA-119
产品类别存储    存储   
文件大小460KB,共20页
制造商SAMSUNG(三星)
官网地址http://www.samsung.com/Products/Semiconductor/
下载文档 详细参数 全文预览

KM736S849H-75概述

ZBT SRAM, 512KX18, 4.2ns, CMOS, PBGA119, BGA-119

KM736S849H-75规格参数

参数名称属性值
厂商名称SAMSUNG(三星)
零件包装代码BGA
包装说明BGA,
针数119
Reach Compliance Codecompliant
ECCN代码3A991.B.2.A
最长访问时间4.2 ns
其他特性SELF-TIMED WRITE CYCLE; POWER DOWN OPTION
JESD-30 代码R-PBGA-B119
长度22 mm
内存密度9437184 bit
内存集成电路类型ZBT SRAM
内存宽度18
功能数量1
端子数量119
字数524288 words
字数代码512000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织512KX18
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装形状RECTANGULAR
封装形式GRID ARRAY
并行/串行PARALLEL
认证状态Not Qualified
最大供电电压 (Vsup)2.625 V
最小供电电压 (Vsup)2.375 V
标称供电电压 (Vsup)2.5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子形式BALL
端子节距1.27 mm
端子位置BOTTOM
宽度14 mm

文档预览

下载PDF文档
KM736S849
KM718S949
Document Title
256Kx36 & 512Kx18 Pipelined NtRAM
TM
256Kx36 & 512Kx18-Bit Pipelined NtRAM
TM
Revision History
Rev. No.
0.0
0.1
History
1. Initial document.
1. Changed speed bin from 167MHz to 150MHz
2. Changed DC Parameters;
I
CC
: from 400mA to 450mA , ISB : from 60mA to 20mA
I
SB2
: from 50mA to 85mA
1. Changed speed bin from 150MHz to 167MHz
2. Changed Power from 3.3V to 2.5V
3. Changed N.C pins to Power and ZZ Pin #14, #16, #64, #66
4. Changed some control pin names.
from CEN to CKE, from BWEx to BWx
5. Modify absolute maximum ratings
V
DD
; from 4.0V to 3.6V, V
IN
; from 4.6V to 3.6V
6. Changed DC parameters
I
SB
; from 20mA to 80mA, I
SB2
; from 85mA to 10mA
V
OL
; from 0.4V to 0.2V, V
OH
; from 2.4V to 2.0V
V
IL
; from 0.8V to 0.7V, V
IH
; from 2.0V to 1.7V
7. A
DD
the sleep mode timing and characteristics
CKE controlled timing and CS controlled timing
1. Removed speed bin 167MHz
2.Changed AC parameters
t
HZOE
; from 4.0 to 3.5 , t
HZC
;from 4.0 to 3.5 at -75
t
HZOE
; from 5.0 to 3.5 , t
HZC
;from 5.0 to 3.5 , t
CL/H
; 4.0 to 3.0
at -10
3.Modify Sleep Mode Waveform.
Changed Sleep Mode Electrical Characteristics .
t
PDS
;from Max 2cycle to Min 2cycle
t
PUS
; from Max 2cycle to Min 2cycle
1.Modify from ADV to ADV at timing.
2.A
DD
the Trade Mark( NtRAM
TM
)
1. Changed DC parameters
I
SB1
; from 10mA to 20mA, I
SB2
; from 10mA to 20mA
1. Changed t
CD
,t
OE
from 4.0ns to 4.2ns at -75.
1. Changed DC condition at Icc and parameters
I
CC
; from 420mA to 320mA at -67 , from 370mA to 300mA at -75
from 300mA to 250mA at -10.
I
SB
; from 70mA to 60mA at -67 , from 60mA to 50mA at -75
from 50mA to 40mA at -10.
1.Changed V
OL
Max value from 0.2V to 0.4V .
1. Add 119BGA(7x17 Ball Grid Array Package) .
1. Final spec release
Draft Date
September. 1997
November. 1997
Remark
Preliminary
Preliminary
0.2
March. 11. 1998
Preliminary
0.3
April. 11. 1998
Preliminary
0.4
June. 02. 1998
Preliminary
0.5
Aug. 19. 1998
Preliminary
0.6
0.7
Sep. 28. 1998
Nov. 10. 1998
Preliminary
Preliminary
0.8
0.9
1.0
Dec. 23. 1998
Mar. 03. 1999
April. 01. 1999
Preliminary
Preliminary
Final
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.
-1-
April 1999
Rev 1.0

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2506  2218  336  872  773  51  45  7  18  16 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved