Power Supply Support Circuit, Fixed, 1 Channel, PDSO3, TO-236AB, SOT-23, 3 PIN
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | SIPEX |
包装说明 | TO-236AB, SOT-23, 3 PIN |
Reach Compliance Code | unknown |
其他特性 | RESET THRESHOLD VOLTAGE IS 4.6V |
可调阈值 | NO |
模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 | R-PDSO-G3 |
JESD-609代码 | e0 |
长度 | 2.9 mm |
湿度敏感等级 | 1 |
信道数量 | 1 |
功能数量 | 1 |
端子数量 | 3 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 240 |
认证状态 | Not Qualified |
座面最大高度 | 1.12 mm |
最大供电电压 (Vsup) | 6 V |
最小供电电压 (Vsup) | 0.9 V |
表面贴装 | YES |
温度等级 | INDUSTRIAL |
端子面层 | TIN LEAD |
端子形式 | GULL WING |
端子节距 | 0.95 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 1.3 mm |
SP810EK-4.6 | SP810EK-4.0/TR | SP810EK-4.4 | SP810EK-4.4/TR | |
---|---|---|---|---|
描述 | Power Supply Support Circuit, Fixed, 1 Channel, PDSO3, TO-236AB, SOT-23, 3 PIN | Power Supply Support Circuit, Fixed, 1 Channel, PDSO3, TO-236AB, SOT-23, 3 PIN | Power Supply Support Circuit, Fixed, 1 Channel, PDSO3, TO-236AB, SOT-23, 3 PIN | Power Supply Support Circuit, Fixed, 1 Channel, PDSO3, TO-236AB, SOT-23, 3 PIN |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | SIPEX | SIPEX | SIPEX | SIPEX |
包装说明 | TO-236AB, SOT-23, 3 PIN | TO-236AB, SOT-23, 3 PIN | TO-236AB, SOT-23, 3 PIN | TO-236AB, SOT-23, 3 PIN |
Reach Compliance Code | unknown | unknown | unknown | unknown |
其他特性 | RESET THRESHOLD VOLTAGE IS 4.6V | RESET THRESHOLD VOLTAGE IS 4V | RESET THRESHOLD VOLTAGE IS 4.4V | RESET THRESHOLD VOLTAGE IS 4.4V |
可调阈值 | NO | NO | NO | NO |
模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 | R-PDSO-G3 | R-PDSO-G3 | R-PDSO-G3 | R-PDSO-G3 |
JESD-609代码 | e0 | e0 | e0 | e0 |
长度 | 2.9 mm | 2.9 mm | 2.9 mm | 2.9 mm |
湿度敏感等级 | 1 | 1 | 1 | 1 |
信道数量 | 1 | 1 | 1 | 1 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 3 | 3 | 3 | 3 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | TSSOP | TSSOP | TSSOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 240 | 240 | 240 | 240 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.12 mm | 1.12 mm | 1.12 mm | 1.12 mm |
最大供电电压 (Vsup) | 6 V | 6 V | 6 V | 6 V |
最小供电电压 (Vsup) | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
表面贴装 | YES | YES | YES | YES |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.95 mm | 0.95 mm | 0.95 mm | 0.95 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 |
宽度 | 1.3 mm | 1.3 mm | 1.3 mm | 1.3 mm |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved