DDR DRAM, 8MX32, 0.55ns, CMOS, PBGA144, ROHS COMPLIANT, BGA-144
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | ProMOS Technologies Inc |
Objectid | 2034408049 |
零件包装代码 | BGA |
包装说明 | ROHS COMPLIANT, BGA-144 |
针数 | 144 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
compound_id | 6571031 |
访问模式 | FOUR BANK PAGE BURST |
最长访问时间 | 0.55 ns |
其他特性 | AUTO/SELF REFRESH |
最大时钟频率 (fCLK) | 275 MHz |
I/O 类型 | COMMON |
交错的突发长度 | 2,4,8 |
JESD-30 代码 | S-PBGA-B144 |
长度 | 12 mm |
内存密度 | 268435456 bit |
内存集成电路类型 | DDR DRAM |
内存宽度 | 32 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 144 |
字数 | 8388608 words |
字数代码 | 8000000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 8MX32 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LFBGA |
封装等效代码 | BGA144,12X12,32 |
封装形状 | SQUARE |
封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 2.5 V |
认证状态 | Not Qualified |
刷新周期 | 4096 |
座面最大高度 | 1.4 mm |
自我刷新 | YES |
连续突发长度 | 2,4,8 |
最大供电电压 (Vsup) | 2.63 V |
最小供电电压 (Vsup) | 2.38 V |
标称供电电压 (Vsup) | 2.5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | BALL |
端子节距 | 0.8 mm |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 12 mm |
V58C2256324SAH-36 | V58C2256324SAH-33 | V58C2256324SAH-28 | V58C2256324SAH-4A | V58C2256324SAH-5 | V58C2256324SAH-4 | |
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描述 | DDR DRAM, 8MX32, 0.55ns, CMOS, PBGA144, ROHS COMPLIANT, BGA-144 | 8MX32 DDR DRAM, 0.5ns, PBGA144, ROHS COMPLIANT, BGA-144 | DDR DRAM, 8MX32, 0.5ns, CMOS, PBGA144, ROHS COMPLIANT, BGA-144 | DDR DRAM, 8MX32, 0.6ns, CMOS, PBGA144, ROHS COMPLIANT, BGA-144 | 8MX32 DDR DRAM, 0.65ns, PBGA144, ROHS COMPLIANT, BGA-144 | 8MX32 DDR DRAM, 0.6ns, PBGA144, ROHS COMPLIANT, BGA-144 |
厂商名称 | ProMOS Technologies Inc | ProMOS Technologies Inc | ProMOS Technologies Inc | ProMOS Technologies Inc | ProMOS Technologies Inc | ProMOS Technologies Inc |
零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA |
包装说明 | ROHS COMPLIANT, BGA-144 | LFBGA, BGA144,12X12,32 | ROHS COMPLIANT, BGA-144 | ROHS COMPLIANT, BGA-144 | ROHS COMPLIANT, BGA-144 | LFBGA, |
针数 | 144 | 144 | 144 | 144 | 144 | 144 |
Reach Compliance Code | compliant | unknown | compliant | compliant | unknown | unknown |
访问模式 | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
最长访问时间 | 0.55 ns | 0.5 ns | 0.5 ns | 0.6 ns | 0.65 ns | 0.6 ns |
其他特性 | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
JESD-30 代码 | S-PBGA-B144 | S-PBGA-B144 | S-PBGA-B144 | S-PBGA-B144 | S-PBGA-B144 | S-PBGA-B144 |
长度 | 12 mm | 12 mm | 12 mm | 12 mm | 12 mm | 12 mm |
内存密度 | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit |
内存集成电路类型 | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM |
内存宽度 | 32 | 32 | 32 | 32 | 32 | 32 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 144 | 144 | 144 | 144 | 144 | 144 |
字数 | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words |
字数代码 | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 8MX32 | 8MX32 | 8MX32 | 8MX32 | 8MX32 | 8MX32 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm |
最大供电电压 (Vsup) | 2.63 V | 2.63 V | 2.63 V | 2.63 V | 2.63 V | 2.63 V |
最小供电电压 (Vsup) | 2.38 V | 2.38 V | 2.38 V | 2.38 V | 2.38 V | 2.38 V |
标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | BALL | BALL | BALL | BALL | BALL | BALL |
端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
宽度 | 12 mm | 12 mm | 12 mm | 12 mm | 12 mm | 12 mm |
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