SA5532D8概述

DUAL OP-AMP, 5000uV OFFSET-MAX, 10MHz BAND WIDTH, PDSO8

SA5532D8规格参数

参数名称	属性值
厂商名称	NXP(恩智浦)
Objectid	1451730180
零件包装代码	SOIC
包装说明	SOP,
针数	8
Reach Compliance Code	unknown
ECCN代码	EAR99
compound_id	5001104
放大器类型	OPERATIONAL AMPLIFIER
最大平均偏置电流 (IIB)	1 µA
标称共模抑制比	100 dB
最大输入失调电压	5000 µV
JESD-30 代码	R-PDSO-G8
长度	4.9 mm
负供电电压上限	-22 V
标称负供电电压 (Vsup)	-15 V
功能数量	2
端子数量	8
最高工作温度	85 °C
最低工作温度	-40 °C
封装主体材料	PLASTIC/EPOXY
封装代码	SOP
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE
认证状态	Not Qualified
座面最大高度	1.75 mm
标称压摆率	9 V/us
供电电压上限	22 V
标称供电电压 (Vsup)	15 V
表面贴装	YES
技术	BIPOLAR
温度等级	INDUSTRIAL
端子形式	GULL WING
端子节距	1.27 mm
端子位置	DUAL
标称均一增益带宽	10000 kHz
宽度	3.9 mm

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INTEGRATED CIRCUITS

NE/SA/SE5532/5532A

Internally-compensated dual low noise

operational amplifier

Product specification

IC11 Data Handbook

1997 Sept 29

Philips

Semiconductors

SA5532D8相似产品对比

	SA5532D8	SE5532AF	NE5532FE	SA5532AD8	SA5532AD8-T	SA5532AN	SA5532D8-T	SE5532D8-T
描述	DUAL OP-AMP, 5000uV OFFSET-MAX, 10MHz BAND WIDTH, PDSO8	DUAL OP-AMP, 3000uV OFFSET-MAX, 10MHz BAND WIDTH, CDIP8	IC DUAL OP-AMP, 5000 uV OFFSET-MAX, 10 MHz BAND WIDTH, CDIP8, Operational Amplifier	IC DUAL OP-AMP, 5000 uV OFFSET-MAX, 10 MHz BAND WIDTH, PDSO8, Operational Amplifier	IC DUAL OP-AMP, 5000 uV OFFSET-MAX, 10 MHz BAND WIDTH, PDSO8, 3.90 MM, PLASTIC, SOT-8, Operational Amplifier	DUAL OP-AMP, 5000uV OFFSET-MAX, 10MHz BAND WIDTH, PDIP8	IC DUAL OP-AMP, 5000 uV OFFSET-MAX, 10 MHz BAND WIDTH, PDSO8, 3.90 MM, PLASTIC, SOT-8, Operational Amplifier	IC DUAL OP-AMP, 3000 uV OFFSET-MAX, 10 MHz BAND WIDTH, PDSO8, 3.90 MM, PLASTIC, SOT-8, Operational Amplifier
零件包装代码	SOIC	DIP	DIP	SOIC	SOIC	DIP	SOIC	SOIC
包装说明	SOP,	DIP,	DIP,	SOP,	SOP,	DIP,	SOP,	SOP,
针数	8	8	8	8	8	8	8	8
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknow
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
放大器类型	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER
最大平均偏置电流 (IIB)	1 µA	0.7 µA	1 µA	1 µA	1 µA	1 µA	1 µA	0.7 µA
标称共模抑制比	100 dB	100 dB	100 dB	100 dB	100 dB	100 dB	100 dB	100 dB
最大输入失调电压	5000 µV	3000 µV	5000 µV	5000 µV	5000 µV	5000 µV	5000 µV	3000 µV
JESD-30 代码	R-PDSO-G8	R-GDIP-T8	R-GDIP-T8	R-PDSO-G8	R-PDSO-G8	R-PDIP-T8	R-PDSO-G8	R-PDSO-G8
长度	4.9 mm	9.955 mm	9.955 mm	4.9 mm	4.9 mm	9.5 mm	4.9 mm	4.9 mm
负供电电压上限	-22 V	-22 V	-22 V	-22 V	-22 V	-22 V	-22 V	-22 V
标称负供电电压 (Vsup)	-15 V	-15 V	-15 V	-15 V	-15 V	-15 V	-15 V	-15 V
功能数量	2	2	2	2	2	2	2	2
端子数量	8	8	8	8	8	8	8	8
最高工作温度	85 °C	125 °C	70 °C	85 °C	85 °C	85 °C	85 °C	125 °C
最低工作温度	-40 °C	-55 °C	-	-40 °C	-40 °C	-40 °C	-40 °C	-55 °C
封装主体材料	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	SOP	DIP	DIP	SOP	SOP	DIP	SOP	SOP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.75 mm	5.08 mm	5.08 mm	1.75 mm	1.75 mm	4.2 mm	1.75 mm	1.75 mm
标称压摆率	9 V/us	9 V/us	9 V/us	9 V/us	9 V/us	9 V/us	9 V/us	9 V/us
供电电压上限	22 V	22 V	22 V	22 V	22 V	22 V	22 V	22 V
标称供电电压 (Vsup)	15 V	15 V	15 V	15 V	15 V	15 V	15 V	15 V
表面贴装	YES	NO	NO	YES	YES	NO	YES	YES
技术	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
温度等级	INDUSTRIAL	MILITARY	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	MILITARY
端子形式	GULL WING	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE	GULL WING	GULL WING
端子节距	1.27 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm	1.27 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
标称均一增益带宽	10000 kHz	10000 kHz	10000 kHz	10000 kHz	10000 kHz	10000 kHz	10000 kHz	10000 kHz
宽度	3.9 mm	7.62 mm	7.62 mm	3.9 mm	3.9 mm	7.62 mm	3.9 mm	3.9 mm
厂商名称	NXP(恩智浦)	-	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)

SA5532D8

SA5532D8概述

SA5532D8规格参数

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SA5532D8相似产品对比

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