IC 4M X 16 EDO DRAM, 50 ns, PDSO50, 0.400 INCH, PLASTIC, TSOP-50, Dynamic RAM
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Toshiba(东芝) |
零件包装代码 | TSOP2 |
包装说明 | 0.400 INCH, 0.80 MM PITCH, PLASTIC, TSOP2-50 |
针数 | 50 |
Reach Compliance Code | unknown |
访问模式 | FAST PAGE WITH EDO |
最长访问时间 | 50 ns |
其他特性 | CAS BEFORE RAS/HIDDEN REFRESH |
JESD-30 代码 | R-PDSO-G50 |
JESD-609代码 | e0 |
长度 | 20.95 mm |
内存密度 | 67108864 bit |
内存集成电路类型 | EDO DRAM |
内存宽度 | 16 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 50 |
字数 | 4194304 words |
字数代码 | 4000000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 4MX16 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSOP2 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
认证状态 | Not Qualified |
刷新周期 | 4096 |
座面最大高度 | 1.2 mm |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 3 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | TIN LEAD |
端子形式 | GULL WING |
端子节距 | 0.8 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 10.16 mm |
TC5164165AFT-50 | TC5164165AFT-60 | TC5164165AJ-60 | TC5164165AJ-40 | TC5164165AFT-40 | TC5164165AJ-50 | |
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描述 | IC 4M X 16 EDO DRAM, 50 ns, PDSO50, 0.400 INCH, PLASTIC, TSOP-50, Dynamic RAM | IC 4M X 16 EDO DRAM, 60 ns, PDSO50, 0.400 INCH, PLASTIC, TSOP-50, Dynamic RAM | IC 4M X 16 EDO DRAM, 60 ns, PDSO50, 0.400 INCH, PLASTIC, SOJ-50, Dynamic RAM | IC 4M X 16 EDO DRAM, 40 ns, PDSO50, 0.400 INCH, PLASTIC, SOJ-50, Dynamic RAM | IC 4M X 16 EDO DRAM, 40 ns, PDSO50, 0.400 INCH, PLASTIC, TSOP-50, Dynamic RAM | IC 4M X 16 EDO DRAM, 50 ns, PDSO50, 0.400 INCH, PLASTIC, SOJ-50, Dynamic RAM |
厂商名称 | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) |
零件包装代码 | TSOP2 | TSOP | SOJ | SOJ | TSOP2 | SOJ |
包装说明 | 0.400 INCH, 0.80 MM PITCH, PLASTIC, TSOP2-50 | TSOP2, | SOJ, | SOJ, | 0.400 INCH, 0.80 MM PITCH, PLASTIC, TSOP2-50 | SOJ, |
针数 | 50 | 50 | 50 | 50 | 50 | 50 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknow |
访问模式 | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO |
最长访问时间 | 50 ns | 60 ns | 60 ns | 40 ns | 40 ns | 50 ns |
其他特性 | CAS BEFORE RAS/HIDDEN REFRESH | CAS BEFORE RAS/HIDDEN REFRESH | CAS BEFORE RAS/HIDDEN REFRESH | CAS BEFORE RAS/HIDDEN REFRESH | CAS BEFORE RAS/HIDDEN REFRESH | CAS BEFORE RAS/HIDDEN REFRESH |
JESD-30 代码 | R-PDSO-G50 | R-PDSO-G50 | R-PDSO-J50 | R-PDSO-J50 | R-PDSO-G50 | R-PDSO-J50 |
长度 | 20.95 mm | 20.95 mm | 20.96 mm | 20.96 mm | 20.95 mm | 20.96 mm |
内存密度 | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bi |
内存集成电路类型 | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 50 | 50 | 50 | 50 | 50 | 50 |
字数 | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words |
字数代码 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 4MX16 | 4MX16 | 4MX16 | 4MX16 | 4MX16 | 4MX16 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSOP2 | TSOP2 | SOJ | SOJ | TSOP2 | SOJ |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
刷新周期 | 4096 | 4096 | 4096 | 4096 | 4096 | 4096 |
座面最大高度 | 1.2 mm | 1.2 mm | 3.7 mm | 3.7 mm | 1.2 mm | 3.7 mm |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | GULL WING | GULL WING | J BEND | J BEND | GULL WING | J BEND |
端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm |
ECCN代码 | - | EAR99 | EAR99 | EAR99 | - | EAR99 |
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