NTC SMD Thermistors
With Nickel Barrier Termination NB 21 - NB 23
Chip thermistors are high quality and low cost devices
especially developed for surface mounting applications. They
are widely used for temperature compensation but can also
achieve temperature control of printed circuits.
A nickel barrier metallization provides outstanding qualities of
solderability and enables this chip to meet the requirements
of the most severe soldering processes.
Types
NB 21
IEC SIZE : 0603
NB 23
IEC SIZE : 0402
1.0 ± 0.1 (0.04 ± 0.004)
0.40 ± 0.1
(0.02 ±0.004)
0.60 (0.024) max
1.6 (.063) 0.2 (.008)
DIMENSIONS:
millimeters (inches)
0.8 (.031)
±0.2 (.008)
0.8 (.031)
±0.2 (.008)
0.2 (.008) min
0.2 (.008) min
0.25 (0.10) min
0.25 (0.10) min
Terminations
Marking
Climatic category
Operating temperature
Tolerance on Rn (25°C)
Maximum dissipation at 25°C
Thermal dissipation factor
Thermal time constant
Resistance - Temperature characteristics: pages 36 to 40.
Nickel Barrier
On packaging only
40/125/56
-55°C to +150°C
±5%, ±10%, ±20%
0.07 W
1 mW/°C
4s
0.06 W
0.8 mW/°C
3s
APPLICATIONS
•
•
•
•
•
•
•
•
•
LCD compensation
Battery packs
Mobile phones
CD players
Heating systems
Air-conditioning systems
Temperature control of Switch Mode Power Supplies
Compensation of pressure sensors
Protection of power transistors in various electronic circuits
HOW TO ORDER
NB 21
K0
0103
M
BB
Type
Material Code
K
(See tables page 15)
Resistance
10,000
Ω
Tolerance
M (±20%)
J (±5%)
K (±10%)
Suffix: Packaging
– –: Bulk
BB: Cardboard tape
(180mm diam. reel)
BF: Cardboard tape (1/2 reel)
BD: Cardboard tape
(330mm diam. reel)
14
NTC SMD Thermistors
With Nickel Barrier Termination NB 21 - NB 23
TABLE OF VALUES
NB 21
IEC SIZE : 0603
Types
Rn at 25°C
(Ω)
Material
Code
B (K)
NB 23
IEC SIZE : 0402
(
B/B
(1) ± 5%
(2) ± 3%
)
at 25°C
(%/°C)
Types
Rn at 25°C
(Ω)
Material
Code
B (K)
(
B/B
(1) ± 5%
(2) ± 3%
)
at 25°C
(%/°C)
NB 21 KC 0 470
NB 21 KC 0 101
NB 21 KC 0 471
NB 21 MC 0 102
NB 21 J 0 0472
NB 21 J 5 0682
NB 21 J 5 0103
NB 21 K 0 0103
NB 21 K 0 0153
NB 21 L 0 0223
NB 21 M 0 0333
NB 21 M 0 0473
NB 21 L 2 0683
NB 21 N 0 0683
NB 21 N 5 0104
NB 21 P 0 0154
NB 21 Q 0 0334
NB 21 Q 0 0474
47
100
470
1,000
4,700
6,800
10,000
10,000
15,000
22,000
33,000
47,000
68,000
68,000
100,000
150,000
330,000
470,000
NB 23 NC 0 103
KC
MC
J
J5
K
L
M
L2
N
N5
P
Q
3470 ± 5%
3910 ± 3%
3480 ± 3%
3480 ± 3%
3480 ± 3%
3630 ± 3%
3790 ± 3%
3950 ± 3%
3805 ± 3%
4080 ± 3%
4160 ± 3%
4220 ± 3%
4300 ± 3%
– 3.9
– 4.4
– 3.9
– 3.9
– 3.9
– 4.0
– 4.2
– 4.4
– 4.1
– 4.6
– 4.7
– 4.7
– 4.7
NB 23 RC 0 103
NB 23 NC 0 153
NB 23 NC 0 223
NB 23 RC 0 223
NB 23 RC 0 333
NB 23 NE 0 473
NB 23 RC 0 473
NB 23 RC 0 683
NB 23 RC 0 104
10,000
10,000
15,000
22,000
22,000
33,000
47,000
47,000
68,000
100,000
NC
RC
NC
RC
NE
RC
4080 ± 3%
4340 ± 3%
4080 ± 3%
4340 ± 3%
4100 ± 3%
4340 ± 3%
– 4.6
– 4.7
– 4.6
– 4.7
– 4.6
– 4.7
15
Packaging for Automatic Insertion
NTC Chip Thermistors / NC/NB Series
AUTOMATIC INSERTION
Super 8 Plastic Tape Packaging:
The mechanical and dimensional reel characteristics are in
accordance with the IEC publication 286-3.
5.5 (.217)
±0.2
(.008)
Cover Tape
Max
3°
B0
Max
3°
30µ
±
5µ
T
K
R = 0.3 (.012) Max.
B1
F
D0
P2
P0
Max
3°
Max
3°
A0
Direction of
unreeling
Hole
A1
W
1 (.039)
-0
+0.2 (.008)
E
Designation
Tape width
Tape thickness
Pitch of the sprocket holes
Diameter of the sprocket holes
Distance
Distance (center to center)
Distance (center to center)
Sizes of the
NC 12 (0805)
cavities
Symbol
W
T
P0
D0
E
F
P2
A0
B0
K
Value
8
0.4 max.
4
1.5
-0
1.75
3.5
2
1.5
2.4
1.4 max.
Tolerance
±0.2
±0.1
±0.1
±0.1
±0.05
±0.1
±0.1
±0.1
K ±0.1
(size is adjustable)
(K = t1 +0.2)
±0.1
±0.1
K ±0.1
(size is adjustable)
(K = t1 +0.2)
NC 20 (1206)
A0
B0
K
1.95
3.55
1.5 max.
ø180 (7.09)
- 2 (.079)
+0
Direction of unreeling
ø 12.75 (.502)
- 0
ø 62 (2.44)
±
1.5 (.059)
+ 0.15 (.006)
Reel
Upper side
8.4 (.331)
14.4 (.567)
max.
+0.15 (.006)
Reel
according to
ISO/DIS 3639-2
+ 0.5 (.020)
Bottom side
ø 20.5 (.087)
- 0
QUANTITY PER REEL
Type
NC - NB 12
NC 20 - NB 20
Suffix
BA
BE
BA
BE
Qty Per Reel
4000
2000
3000
1500
16
Packaging for Automatic Insertion
NTC Chip Thermistors / NC/NB Series
AUTOMATIC INSERTION
8mm Paper Tape Packaging:
The mechanical and dimensional reel characteristics
are in accordance with the IEC publication 286-3.
BOTTOM
COVER
TAPE
T
D
0
P
2
P
0
10 PITCHES CUMULATIVE
TOLERANCE ON TAPE
0.20mm (0.008)
E
1
TOP
COVER
TAPE
B
0
G
T
1
T
1
CAVITY SIZE
SEE NOTE 1
A
0
CENTER LINES
OF CAVITY
P
1
User Direction of Feed
F
E
2
W
Designation
Tape width
Tape thickness
Pitch of the sprocket holes
Diameter of the sprocket holes
Distance
Distance (center to center)
Distance (center to center)
Cover tape thickness
Distance
Distance
Component pitch
0805/0603
0402
Symbol
W
T
P
0
D
0
E
1
F
P
2
T
1
E
2
G
P
1
Value
8
1.1 max.
4
1.5
-0/+0.1
1.75
3.5
2
0.10 max.
6.25 min.
0.75 min.
4
2
Tolerance
-.0.1/+0.3
±0.1
±0.1
±0.1
±0.05
±0.05
±0.1
±0.1
ø180 (7.09)
- 2 (.079)
+0
Direction of unreeling
ø 12.75 (.502)
- 0
ø 62 (2.44)
±
1.5 (.059)
+ 0.15 (.006)
Reel
Upper side
8.4 (.331)
14.4 (.567)
max.
+0.15 (.006)
Reel
according to
ISO/DIS 3639-2
+ 0.5 (.020)
Bottom side
ø 20.5 (.087)
- 0
QUANTITY PER REEL
Type
NB - NC 12
NB 21
NB 23
Suffix
BB
BF
BB
BF
Qty Per Reel
4000
2000
10000
5000
17
Surface Mounting Guide
Chip Thermistor – Application Notes
STORAGE
Good solderability is maintained for at least twelve months,
provided the components are stored in their “as received”
packaging at less than 40°C and 70% RH.
Wave
300
Preheat
250
200
150
100
50
Natural
Cooling
SOLDERABILITY / LEACHING
Terminations to be well soldered after immersion in a 60/40
tin/lead solder bath at 235 ± 5°C for 2 ± 1 seconds.
Terminations will resist leaching for at least the immersion
times and conditions recommendations shown below.
P/N
NC
NB
Termination
Type
AgPdPt
Nickel Barrier
Solder
Tin/Lead
60/40
60/40
Solder
Temp ºC
260 ± 5
260 ± 5
Immersion
Time Seconds
15 max
30 ± 1
Solder Temp.
T
230ºC
to
250ºC
0
1 to 2 min
3 sec. max
(Preheat chips before soldering)
T/maximum 150°C
NB products are compatible with a wide range of soldering
conditions consistent with good manufacturing practice for
surface mount components. This includes Pb free reflow
processes with peak temperatures up to 270ºC.
Recommended profiles for reflow and wave soldering are
shown below for reference.
NC products are recommended for lead soldering application
or gluing techniques.
a) The visual standards used for evaluation of solder joints
will need to be modified as lead free joints are not as bright
as with tin-lead pastes and the fillet may not be as large.
b) Resin color may darken slightly due to the increase in
temperature required for the new pastes.
c) Lead-free solder pastes do not allow the same self align-
ment as lead containing systems. Standard mounting
pads are acceptable, but machine set up may need to be
modified.
D2
Reflow
300
250
200
150
100
50
220ºC
to
250ºC
Preheat
Natural
Cooling
RECOMMENDED
SOLDERING PAD
LAYOUT
D1
D3
Solder Temp.
Dimensions in
mm (inches)
D4
D5
REFLOW SOLDERING
Case
Size
0402
1min
1min
10 sec. max
(Minimize soldering time)
P/N
NB23
NB21
NB12
NB20
D1
1.70
(.067)
2.30
(.091)
3.00
(.118)
4.00
(.157)
D2
0.60
(.024)
0.80
(.031)
1.00
(.039)
1.00
(.039)
D3
0.50
(.020)
0.70
(.028)
1.00
(.039)
2.00
(.079)
D4
0.60
(.024)
0.80
(0.31)
1.00
(.039)
1.00
(.039)
D5
0.50
(.020)
0.75
(.030)
1.25
(.049)
2.50
(.098)
0
0603
0805
300
250
200
150
100
50
0
0
1206
Temperature °C
WAVE SOLDERING
Case
Size
50
100
150
200
250
Time (s)
300
0603
0805
1206
P/N
NB21
NB12
NB20
D1
3.10
(.122)
4.00
(.157)
5.00
(.197)
D2
1.20
(.047)
1.50
(.059)
1.50
(.059)
D3
0.70
(.028)
1.00
(.039)
2.00
(.079)
D4
1.20
(.047)
1.50
(.059)
1.50
(.059)
D5
0.75
(.030)
1.25
(.049)
1.60
(.063)
• Pre-heating: 150°C ±15°C / 60-90s
• Max. Peak Gradient: 2.5°C/s
• Peak Temperature: 245°C ±5°C
• Time at >230°C: 40s Max.
18
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