Preliminary
Datasheet
RJK0243DNS
25V, 25A, 9.6mΩmax.
N Channel Power MOS FET
High Speed Power Switching
Features
•
•
•
•
•
•
•
Very high speed switching
Capable of 4.5 V gate drive
Low drive current
High density mounting
Low on-resistance
Pb-free
Halogen-free
R07DS1074EJ0110
Rev1.10
Mar 28, 2013
Outline
RENESAS Package code: PWSN0008JB-A
(Package name: HWSON-8)
5 6 7 8
D D D D
5 6 7 8
4
G
4 3 2 1
1, 2, 3
Source
4
Gate
5, 6, 7, 8 Drain
S S S
1 2 3
Absolute Maximum Ratings
(Ta = 25°C)
Item
Drain to source voltage
Gate to source voltage
Drain current
Drain peak current
Body-drain diode reverse drain current
Avalanche current
Avalanche energy
Channel dissipation
Channel to case thermal impedance
Channel temperature
Storage temperature
Notes: 1. PW
≤
10
μs,
duty cycle
≤
1%
2. Value at Tch = 25°C, Rg
≥
50
Ω
3. Tc = 25°C
Symbol
V
DSS
V
GSS
I
D
I
D(pulse)Note1
I
DR
I
AP Note 2
E
AS Note 2
Pch
Note3
θch-c
Note3
Tch
Tstg
Ratings
25
+10,-8
25
100
25
17
36
20
6.25
150
–55 to +150
Unit
V
V
A
A
A
A
mJ
W
°C/W
°C
°C
R07DS1074EJ0110 Rev1.10
Mar 28, 2013
Page 1 of 6
RJK0243DNS
Electrical Characteristics
(Ta = 25°C)
Item
Drain to source breakdown voltage
Gate to source leak current
Zero gate voltage drain current
Gate to source cutoff voltage
Static drain to source on state
resistance
Forward transfer admittance
Input capacitance
Output capacitance
Reverse transfer capacitance
Gate Resistance
Total gate charge
Gate to source charge
Gate to drain charge
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Body–drain diode forward voltage
Body–drain diode reverse recovery
time
Notes: 4. Pulse test
Symbol
V
(BR)DSS
I
GSS
I
DSS
V
GS(off)
R
DS(on)
R
DS(on)
|y
fs
|
Ciss
Coss
Crss
Rg
Qg
Qgs
Qgd
t
d(on)
t
r
t
d(off)
t
f
V
DF
t
rr
Min
25
—
—
0.9
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Typ
—
—
—
—
7.9
8.8
50
735
600
45
0.75
5.1
1.3
1.0
2.7
1.6
9.5
1.9
0.85
9.4
Max
—
±0.1
1
1.4
9.6
11
—
1030
—
—
1.8
—
—
—
—
—
—
—
1.1
—
Unit
V
μA
μA
V
mΩ
mΩ
S
pF
pF
pF
Ω
nC
nC
nC
ns
ns
ns
ns
V
ns
Test Conditions
I
D
= 10 mA, V
GS
= 0
V
GS
= +10/-8 V, V
DS
= 0
V
DS
= 20 V, V
GS
= 0
V
DS
= 10 V, I
D
= 1 mA
I
D
= 12.5 A, V
GS
= 8 V
Note4
I
D
= 12.5 A, V
GS
= 4.5 V
Note4
I
D
= 12.5 A, V
DS
= 5 V
Note4
V
DS
= 10 V
V
GS
= 0
f = 1 MHz
V
DD
= 10 V
V
GS
= 4.5 V
I
D
= 25 A
V
GS
= 8 V, I
D
= 12.5 A
V
DD
≅
10 V
R
L
= 0.8Ω
Rg = 4.7
Ω
I
F
= 25 A, V
GS
= 0
Note4
I
F
= 25 A, V
GS
= 0
di
F
/ dt = 500 A/
μs
R07DS1074EJ0110 Rev1.10
Mar 28, 2013
Page 2 of 6
RJK0243DNS
Main Characteristics
Power vs. Temperature Derating
40
1000
Maximum Safe Operation Area
Channel Dissipation Pch (W)
Drain Current I
D
(A)
30
100
1m
10
PW = 10 ms
1
s
20
10
Operation in
this area is
limited by R
DS(on)
DC
Op
er
at
ion
0
50
100
150
200
Tc = 25 °C
0.1
1 shot Pulse
0.1
1
10
100
Case Temperature Tc (°C)
Drain to Source Voltage V
DS
(V)
Typical Output Characteristics
50
4.5 V
8V
50
Typical Transfer Characteristics
V
DS
= 5 V
Pulse Test
Pulse Test
2.4 V
Drain Current I
D
(A)
30
2.2 V
Drain Current I
D
(A)
40
40
30
20
2.0 V
10
20
10
Tc = 75°C
25°C
–25°C
V
GS
= 1.8 V
0
2
4
6
8
10
0
1
2
3
4
5
Drain to Source Voltage V
DS
(V)
Drain to Source Saturation Voltage vs.
Gate to Source Voltage
Drain to Source Saturation Voltage
V
DS(on)
(mV)
200
Gate to Source Voltage V
GS
(V)
Static Drain to Source On State Resistance
vs. Drain Current
100
Pulse Test
30
Pulse Test
150
100
10
V
GS
= 4.5 V
8V
I
D
= 10 A
50
3
5A
2A
0
2
4
6
8
10
1
1
3
10
30
100
300 1000
Gate to Source Voltage V
GS
(V)
Drain Current I
D
(A)
R07DS1074EJ0110 Rev1.10
Mar 28, 2013
Page 3 of 6
RJK0243DNS
Static Drain to Source On State Resistance
vs. Temperature
20
Pulse Test
10000
3000
I
D
= 2 A, 5 A, 10A
12
V
GS
= 4.5 V
8
8V
4
0
–25
2 A, 5 A, 10A
Typical Capacitance vs.
Drain to Source Voltage
V
GS
= 0
f = 1 MHz
Capacitance C (pF)
16
1000
300
100
Ciss
Coss
Crss
30
10
0
0
25
50
75
100 125 150
10
20
25
Case Temperature Tc (°C)
Drain to Source Voltage V
DS
(V)
Dynamic Input Characteristics
Drain to Source Voltage V
DS
(V)
Gate to Source Voltage V
GS
(V)
50
Reverse Drain Current vs.
Source to Drain Voltage
10
50
Reverse Drain Current I
DR
(A)
I
D
= 25 A
V
GS
8V
40
5V
Pulse Test
40
V
DD
= 20 V
10 V
V
DS
8
30
6
30
20
4
20
V
GS
= 0, –5 V
10
V
DD
= 20 V
10 V
0
2
4
6
8
2
10
0
0
10
0
0.4
0.8
1.2
1.6
2.0
Gate Charge Qg (nc)
Source to Drain Voltage V
SD
(V)
Maximum Avalanche Energy vs.
Channel Temperature Derating
50
I
AP
= 17 A
V
DD
= 15 V
duty < 0.1%
Rg
≥
50
Ω
Avalanche Energy E
AS
(mJ)
40
30
20
10
0
25
50
75
100
125
150
Channel Temperature Tch (°C)
R07DS1074EJ0110 Rev1.10
Mar 28, 2013
Page 4 of 6
RJK0243DNS
Normalized Transient Thermal Impedance vs. Pulse Width
3
1
D=1
0.5
0.3
0.2
0.1
0.1
0.05
0.03
2
0.0
1
0.0
1s
P
DM
D=
PW
T
ho
u
tp
ls
e
PW
T
0.01
1m
10 m
100 m
1
10
Pulse Width PW (S)
Avalanche Test Circuit
Avalanche Waveform
1
2
L
•
I
AP2
•
V
DSS
V
DSS
– V
DD
V
(BR)DSS
I
AP
Rg
D. U. T
V
DD
V
DS
V
DS
Monitor
L
I
AP
Monitor
E
AS
=
I
D
Vin
8V
0
V
DD
Switching Time Test Circuit
Vin Monitor
D.U.T.
Rg
R
L
V
DS
= 10 V
Vin
Vout
Vin
8V
Vout
Monitor
Switching Time Waveform
90%
10%
10%
10%
90%
td(on)
tr
90%
td(off)
tf
R07DS1074EJ0110 Rev1.10
Mar 28, 2013
Page 5 of 6
无线连接
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
