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MT90224AG

产品描述ATM NETWORK INTERFACE, PBGA384, 27 X 27 MM, PLASTIC, MS-034, BGA-384
产品类别无线/射频/通信    电信电路   
文件大小873KB,共155页
制造商Microsemi
官网地址https://www.microsemi.com
下载文档 详细参数 选型对比 全文预览

MT90224AG概述

ATM NETWORK INTERFACE, PBGA384, 27 X 27 MM, PLASTIC, MS-034, BGA-384

MT90224AG规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称Microsemi
零件包装代码BGA
包装说明BGA, BGA384,26X26,40
针数384
Reach Compliance Codecompliant
应用程序ATM
JESD-30 代码S-PBGA-B384
JESD-609代码e0
长度27 mm
湿度敏感等级3
功能数量1
端子数量384
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA384,26X26,40
封装形状SQUARE
封装形式GRID ARRAY
峰值回流温度(摄氏度)225
电源2.5,3.3,5 V
认证状态Not Qualified
座面最大高度2.28 mm
标称供电电压2.5 V
表面贴装YES
电信集成电路类型ATM/SONET/SDH NETWORK INTERFACE
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn/Pb)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间30
宽度27 mm

文档预览

下载PDF文档
MT90222/3/4
4/8/16 Port IMA/TC PHY Device
Data Sheet
Features
IMA
Up to 16 T1, E1, J1, DSL links & up to 8 IMA
groups with 1 to 16 links/IMA group
1
Supports symmetrical & asymmetrical operation
CTC (common transmit) & ITC (independent
transmit) clocking modes
Pre-processing of RX ICP (IMA control protocol)
cells
IMA layer & per link statistics and alarms for
performance monitoring with MIB support
Ordering Information
MT90222AG
384 Pin PBGA Trays
MT90223AG
384 Pin PBGA Trays
MT90224AG
384 Pin PBGA Trays
MT90222AG2 384 Pin PBGA** Trays, Bake & Drypack
MT90223AG2 384 Pin PBGA** Trays
MT90224AG2 384 Pin PBGA** Trays
**Pb Free Tin/Silver/Copper
-40°C to +85°C
April 2006
HEC (header error control) verification &
generation, error detection, filler cell filtering (IMA
mode) and idle/unassigned cell filtering (TC
mode)
TC layer statistics and error counts i.e. HEC
errors with MIB support
TC and UNI
Supports mixed-mode operation: links not
assigned to an IMA group can be used in TC
mode
ATM framing using cell delineation
Standards Compliant
ATM Forum - IMA 1.1 (AF-PHY-0086.001) &
backwards compatible with IMA 1.0
ATM Forum - ATM over Fractional T1/E1 (AF-
PHY-0130.00)
ITU G.804 cell mapping & ITU I.432 cell
delineation
1. MT90222 supports up to 4 serial links with maximum 4 groups
to be used - groups 0,1,2,3.
MT90223 supports up to 8 serial links
MT90224 supports up to 16 serial links
RX External Static RAM
TDM Ring
RX
Utopia
Level 2
BUS
TX
Rx Utopia
FIFo
Internal IMA
Processors
(1 per group)
TDM
Ring
Control
S/P
T1/E1/DSL
Utopia
I/F CTRL
Cell
Delineator
CD Circuits (1 per link)
T1/E1/DSL
P/S
Tx Utopia
FIFo
Transmission
Convergence
TDM
Ring
Control
T1/E1/DSL
Serial TDM Ports
(1 per link, up to 10Mb/s
per link)
TC Circuits (1 per link)
Processor I/F
TDM Ring
Figure 1 - MT90222/3/4 Block Diagram (with Built-in IMA functions for up to 8 IMA Groups over
4/8/16 links)
1
Zarlink Semiconductor Inc.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2004-2006, Zarlink Semiconductor Inc. All Rights Reserved.

MT90224AG相似产品对比

MT90224AG MT90222AG2 MT90222AG MT90223AG2 MT90223AG MT90224AG2
描述 ATM NETWORK INTERFACE, PBGA384, 27 X 27 MM, PLASTIC, MS-034, BGA-384 ATM/SONET/SDH Segmentation and Reassembly Device, PBGA384, ATM/SONET/SDH Segmentation and Reassembly Device, PBGA384, ATM NETWORK INTERFACE, PBGA384, 27 X 27 MM, LEAD FREE, PLASTIC, MS-034, BGA-384 ATM NETWORK INTERFACE, PBGA384, 27 X 27 MM, PLASTIC, MS-034, BGA-384 ATM NETWORK INTERFACE, PBGA384, 27 X 27 MM, LEAD FREE, PLASTIC, MS-034, BGA-384
是否无铅 含铅 不含铅 含铅 不含铅 含铅 不含铅
零件包装代码 BGA BGA BGA BGA BGA BGA
针数 384 384 384 384 384 384
Reach Compliance Code compliant compliant unknown compliant compliant compli
JESD-30 代码 S-PBGA-B384 S-PBGA-B384 S-PBGA-B384 S-PBGA-B384 S-PBGA-B384 S-PBGA-B384
端子数量 384 384 384 384 384 384
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA BGA BGA BGA BGA
封装等效代码 BGA384,26X26,40 BGA384,26X26,40 BGA384,26X26,40 BGA384,26X26,40 BGA384,26X26,40 BGA384,26X26,40
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
表面贴装 YES YES YES YES YES YES
电信集成电路类型 ATM/SONET/SDH NETWORK INTERFACE ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE ATM/SONET/SDH NETWORK INTERFACE ATM/SONET/SDH NETWORK INTERFACE ATM/SONET/SDH NETWORK INTERFACE
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 BALL BALL BALL BALL BALL BALL
端子节距 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
是否Rohs认证 不符合 - 不符合 符合 不符合 符合
厂商名称 Microsemi - Microsemi Microsemi Microsemi Microsemi
包装说明 BGA, BGA384,26X26,40 - - BGA, BGA384,26X26,40 BGA, BGA384,26X26,40 BGA, BGA384,26X26,40
应用程序 ATM - - ATM ATM ATM
JESD-609代码 e0 - - e1 e0 e1
长度 27 mm - - 27 mm 27 mm 27 mm
湿度敏感等级 3 - - 3 3 3
功能数量 1 - - 1 1 1
峰值回流温度(摄氏度) 225 - - NOT SPECIFIED 225 NOT SPECIFIED
电源 2.5,3.3,5 V - 2.5,3.3,5 V 2.5,3.3,5 V 2.5,3.3,5 V 2.5,3.3,5 V
座面最大高度 2.28 mm - - 2.28 mm 2.28 mm 2.28 mm
标称供电电压 2.5 V - - 2.5 V 2.5 V 2.5 V
端子面层 Tin/Lead (Sn/Pb) - - Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb) TIN SILVER COPPER
处于峰值回流温度下的最长时间 30 - - NOT SPECIFIED 30 NOT SPECIFIED
宽度 27 mm - - 27 mm 27 mm 27 mm

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