EEPROM, 256X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8
| 参数名称 | 属性值 |
| 厂商名称 | Xicor Inc |
| 包装说明 | PLASTIC, SOIC-8 |
| Reach Compliance Code | unknown |
| 其他特性 | PAGE WRITE |
| 最大时钟频率 (fCLK) | 0.4 MHz |
| JESD-30 代码 | R-PDSO-G8 |
| 长度 | 4.9 mm |
| 内存密度 | 2048 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 256 words |
| 字数代码 | 256 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 256X8 |
| 输出特性 | OPEN-DRAIN |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | SERIAL |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 串行总线类型 | I2C |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 3.9 mm |
| 最长写入周期时间 (tWC) | 10 ms |
| X24C02S8I-2.7T1 | X24C02S8-2.7T2 | X24C02S8I-2.7T2 | X24C02S8-2.7T4 | X24C02S8-2.7T1 | X24C02S8I-2.7T4 | |
|---|---|---|---|---|---|---|
| 描述 | EEPROM, 256X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 | EEPROM, 256X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 | EEPROM, 256X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 | EEPROM, 256X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 | EEPROM, 256X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 | EEPROM, 256X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 |
| 包装说明 | PLASTIC, SOIC-8 | PLASTIC, SOIC-8 | PLASTIC, SOIC-8 | PLASTIC, SOIC-8 | PLASTIC, SOIC-8 | PLASTIC, SOIC-8 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknow |
| 其他特性 | PAGE WRITE | PAGE WRITE | PAGE WRITE | PAGE WRITE | PAGE WRITE | PAGE WRITE |
| 最大时钟频率 (fCLK) | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| 长度 | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm |
| 内存密度 | 2048 bit | 2048 bit | 2048 bit | 2048 bit | 2048 bit | 2048 bi |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words |
| 字数代码 | 256 | 256 | 256 | 256 | 256 | 256 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C |
| 组织 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 |
| 输出特性 | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | SOP | SOP | SOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm |
| 串行总线类型 | I2C | I2C | I2C | I2C | I2C | I2C |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm |
| 最长写入周期时间 (tWC) | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms |
| 厂商名称 | Xicor Inc | - | Xicor Inc | Xicor Inc | Xicor Inc | Xicor Inc |
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