IC,MICROCONTROLLER,8-BIT,6805 CPU,CMOS,SOP,28PIN,PLASTIC
| 参数名称 | 属性值 |
| 厂商名称 | NXP(恩智浦) |
| Objectid | 2020394332 |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, |
| 针数 | 28 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| compound_id | 11084739 |
| 具有ADC | YES |
| 地址总线宽度 | |
| 位大小 | 8 |
| 最大时钟频率 | 4.2 MHz |
| DAC 通道 | NO |
| DMA 通道 | NO |
| 外部数据总线宽度 | |
| JESD-30 代码 | R-PDSO-G28 |
| 长度 | 17.925 mm |
| I/O 线路数量 | 21 |
| 端子数量 | 28 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| PWM 通道 | NO |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 认证状态 | Not Qualified |
| ROM可编程性 | MROM |
| 座面最大高度 | 2.65 mm |
| 速度 | 2.1 MHz |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | HCMOS |
| 温度等级 | AUTOMOTIVE |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 7.5 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
| MC68HC05P18AMDW | MC68HC05P18ADW | MC68HC05P18AP | MC68HC05P18ACDW | MC68HC05P18AMP | |
|---|---|---|---|---|---|
| 描述 | IC,MICROCONTROLLER,8-BIT,6805 CPU,CMOS,SOP,28PIN,PLASTIC | 8-BIT, MROM, 2.1MHz, MICROCONTROLLER, PDSO28, SOIC-28 | 8-BIT, MROM, 2.1MHz, MICROCONTROLLER, PDIP28, PLASTIC, DIP-28 | Microcontroller | IC,MICROCONTROLLER,8-BIT,6805 CPU,CMOS,DIP,28PIN,PLASTIC |
| 包装说明 | SOP, | SOP, SOP28,.4 | DIP, DIP28,.6 | , | DIP, |
| Reach Compliance Code | unknown | not_compliant | unknown | unknown | unknow |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
| 厂商名称 | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | SOIC | SOIC | DIP | - | DIP |
| 针数 | 28 | 28 | 28 | - | 28 |
| ECCN代码 | EAR99 | EAR99 | EAR99 | - | EAR99 |
| 具有ADC | YES | YES | YES | - | YES |
| 位大小 | 8 | 8 | 8 | - | 8 |
| 最大时钟频率 | 4.2 MHz | 4.2 MHz | 4.2 MHz | - | 4.2 MHz |
| DAC 通道 | NO | NO | NO | - | NO |
| DMA 通道 | NO | NO | NO | - | NO |
| JESD-30 代码 | R-PDSO-G28 | R-PDSO-G28 | R-PDIP-T28 | - | R-PDIP-T28 |
| 长度 | 17.925 mm | 17.925 mm | 36.83 mm | - | 36.83 mm |
| I/O 线路数量 | 21 | 21 | 21 | - | 21 |
| 端子数量 | 28 | 28 | 28 | - | 28 |
| 最高工作温度 | 125 °C | 70 °C | 70 °C | - | 125 °C |
| PWM 通道 | NO | NO | NO | - | NO |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | DIP | - | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | - | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| ROM可编程性 | MROM | MROM | MROM | - | MROM |
| 座面最大高度 | 2.65 mm | 2.65 mm | 5.08 mm | - | 5.08 mm |
| 速度 | 2.1 MHz | 2.1 MHz | 2.1 MHz | - | 2.1 MHz |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | - | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | - | 5 V |
| 表面贴装 | YES | YES | NO | - | NO |
| 技术 | HCMOS | HCMOS | HCMOS | - | HCMOS |
| 温度等级 | AUTOMOTIVE | COMMERCIAL | COMMERCIAL | - | AUTOMOTIVE |
| 端子形式 | GULL WING | GULL WING | THROUGH-HOLE | - | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | - | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | - | DUAL |
| 宽度 | 7.5 mm | 7.5 mm | 15.24 mm | - | 15.24 mm |
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