电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

4311T-106-8761BA

产品描述Array/Network Resistor, Divider, Thin Film, 1.38W, 50V, 0.1% +/-Tol, 100ppm/Cel, Through Hole Mount, SIP
产品类别无源元件    电阻器   
文件大小198KB,共2页
制造商Bourns
官网地址http://www.bourns.com
下载文档 详细参数 全文预览

4311T-106-8761BA概述

Array/Network Resistor, Divider, Thin Film, 1.38W, 50V, 0.1% +/-Tol, 100ppm/Cel, Through Hole Mount, SIP

4311T-106-8761BA规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称Bourns
包装说明SIP
Reach Compliance Codenot_compliant
ECCN代码EAR99
元件功耗0.1 W
第一元件电阻8760 Ω
JESD-609代码e0
制造商序列号4300T
安装特点THROUGH HOLE MOUNT
网络类型DIVIDER
元件数量10
功能数量1
端子数量11
最高工作温度125 °C
最低工作温度-55 °C
封装形状RECTANGULAR PACKAGE
额定功率耗散 (P)1.38 W
额定温度70 °C
电阻器类型ARRAY/NETWORK RESISTOR
第二/最后一个元素电阻100000 Ω
表面贴装NO
技术THIN FILM
温度系数100 ppm/°C
温度系数跟踪5 ppm/°C
端子面层Tin/Lead (Sn/Pb)
端子形状FLAT
容差0.1%
工作电压50 V

文档预览

下载PDF文档
oH
VE S CO
AV R M
AI SIO PL
LA N IA
BL S NT
E
Features
RoHS compliant* (see How to Order
“Termination” option)
Low profile provides compatibility with
DIPs
Also available in medium profile (4300S -
.250 ”) and high profile (4300K - .350 ”)
Marking on contrasting background
Custom circuits available per factory
*R
4300T, S, K Series - Thin Film Molded SIP
Product Characteristics
Resistance Range
Bussed ...................49.9 to 100K ohms
Isolated ......................20 to 200K ohms
Series.........................20 to 100K ohms
Resistance Tolerance
.........................±0.1 %, ±0.5 %, ±1 %
Temperature Coefficient
..................±100 ppm/°C, ±50 ppm/°C,
±25 ppm/°C
Temperature Range ....-55 °C to +125 °C
Insulation Resistance
..................10,000 megohms minimum
TCR Tracking .........................±5 ppm/°C
Maximum Operating Voltage............50 V
Environmental Characteristics
Thermal Shock and
Power Conditioning ...................... 0.1 %
Short Time Overload ..................... 0.1 %
Terminal Strength ........................ 0.25 %
Resistance to Soldering Heat ....... 0.1 %
Moisture Resistance ..................... 0.1 %
Life .............................................. 0.50 %
Physical Characteristics
Body Material Flammability
...........................Conforms to UL94V-0
Lead Frame Material
..........................Copper, solder coated
Body Material ..................Novolac epoxy
How To Order
Package Power Temp. Derating Curve
(Low Profile, 4300T)
(
)
1.75
1.50
4311T
WATTS
1.25
1.00
.75
.50
.25
4310T
4309T
4308T
4306T
Product Dimensions
27.53
MAX.
(1.084)
22.45
MAX.
(.884)
14.83 MAX.
(.584)
24.99
MAX.
(.984)
19.92
MAX.
(.784)
PIN #1 REF.
4.95
(.195)
MAX.
.381 + .127/ - .000
(.015 + .005/ - 000)
2.54
±
.07
(.100
±
.003*)
TYP.
NON-ACCUM.
3.43 + .38/ - .25
(.135 + .015/ - .010)
1.02
±
.12
(.040
±
.005)
.483
±
.050
TYP.
(.020
±
.002)
2.16
±
.10
(.085
±
.004)
25
70
150
125
AMBIENT TEMPERATURE (
°
C )
0
Package Power Ratings at 70°C
T
S
K
4304 .......... ............ 0.60...... 0.80 watts
4306 ...... 0.75.......... 0.90...... 1.20 watts
4308 ...... 1.00.......... 1.20...... 1.60 watts
4309 ...... 1.13 ................................watts
4310 ...... 1.25.......... 1.50...... 2.00 watts
4311 ...... 1.38 ................................watts
1.02
±
.05
(.0425
±
.002)
.254
±
.050
(.010
±
.002)
Governing dimensions are in metric. Dimensions in parentheses
are inches and are approximate.
*Terminal centerline to centerline measurements made at point of
emergence of the lead from the body.
43 11 T - 101 - 2222 F A B __
Model
(43 = Molded SIP)
Number of Pins
Physical Config.
•T = Low Profile Thin Film
•S = Med. Profile Thin Film
•K = High Profile Thin Film
Electrical Configuration
•101 = Bussed
•102 = Isolated
•106 = Series
Resistance Code
•First 3 digits are significant
•Fourth digit represents the
number of zeros to follow.
Absolute Tolerance Code
•B = ±0.1%
•F = ±1%
•D = ±0.5%
Temperature Coefficient Code
•A = ±100ppm/°C •C = ±25ppm/°C
•B = ±50ppm/°C
Ratio Tolerance (Optional)
•A = ±0.05% to R1 •D = ±0.5% to R1
•B = ±0.1% to R1
Terminations
• L = Tin-plated (RoHS compliant version)
• Blank = Tin/Lead-plated
Consult factory for other available options.
Typical Part Marking
Represents total content. Layout may vary.
PART
NUMBER
4311T-101-
1003BB
YYWW
CIRCUIT
RESISTANCE
CODE
DATE CODE
PIN ONE
INDICATOR
MANUFACTURER'S
TRADEMARK
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
具体谈谈中国LED和国外LED封装的差异之五---封装工艺差异
LED封装工艺同样是非常重要的环节。例如固晶机的胶量控制,焊线机的焊线温度和压力,烤箱的温度、时间及温度曲线,封胶机的气泡和卡位管控等等,均是重点工艺控制点。即使是芯片质量好、辅材匹配好 ......
探路者 LED专区
PCB下元器件重叠放置
这里指的是同层元件重叠,即在大的器件下放置小的器件;虽然程序设计规则默认同层元件重叠是错误的,但是在实际设计中,同层元件重叠却经常使用。以Altium Designer9.0为例:不过好像规则里并没 ......
regove 分立器件
上次EDN网上研讨会的奖品是否已发出?
网站上说最晚2月28日发出,为何我还没收到奖品呢?不知道其他人收到了否?...
daviu1234 stm32/stm8
基于MapX的GIS动态操作与实现
分析了GIS和MapX的基本技术,提出了GIS信息显示系统中地图对象动态添加、删除以及地图整体显示效果适时变化的实现方法。结合基于MapX的电力网络配置显示系统来说明这些技术。...
fighting 嵌入式系统
msp430操作t5557
谁能给个分立元件的原理图,谢谢...
liangjizeng 微控制器 MCU
LPCXpress-cn学习版用MLink 下载程序后显示 fail to load flash loader
如下图,用的IDE是 iar ewarm 6.10.1147557147558 ...
francescoli NXP MCU

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1901  1532  683  1653  2331  52  44  56  15  58 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved