IC,LOGIC GATE,DUAL 2-INPUT NAND,CMOS,DIP,8PIN,PLASTIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Renesas(瑞萨电子) |
| 包装说明 | DIP, DIP8,.3 |
| Reach Compliance Code | not_compliant |
| JESD-30 代码 | R-PDIP-T8 |
| 负载电容(CL) | 50 pF |
| 逻辑集成电路类型 | NAND GATE |
| 最大I(ol) | 0.014 A |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | OPEN-DRAIN |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP8,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5/15 V |
| Prop。Delay @ Nom-Sup | 200 ns |
| 认证状态 | Not Qualified |
| 施密特触发器 | NO |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 5962-01-097-7488 | CD40107BE | CD40107BEX98 | CD40107BE98 | CD40107BF3A | 5962-01-216-0722 | 5962-01-160-2382 | |
|---|---|---|---|---|---|---|---|
| 描述 | IC,LOGIC GATE,DUAL 2-INPUT NAND,CMOS,DIP,8PIN,PLASTIC | NAND GATE | CD40107BEX98 | CD40107BE98 | NAND GATE | IC,LOGIC GATE,DUAL 2-INPUT NAND,CMOS,DIP,8PIN,PLASTIC | IC,LOGIC GATE,DUAL 2-INPUT NAND,CMOS,DIP,14PIN,CERAMIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DIP, DIP8,.3 | DIP, DIP8,.3 | DIP, DIP8,.3 | DIP, DIP8,.3 | DIP, DIP14,.3 | DIP, DIP8,.3 | DIP, DIP14,.3 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| JESD-30 代码 | R-PDIP-T8 | R-PDIP-T8 | R-PDIP-T8 | R-PDIP-T8 | R-XDIP-T14 | R-PDIP-T8 | R-XDIP-T14 |
| 负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| 最大I(ol) | 0.014 A | 0.014 A | 0.014 A | 0.014 A | 0.012 A | 0.014 A | 0.012 A |
| 端子数量 | 8 | 8 | 8 | 8 | 14 | 8 | 14 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 125 °C | 85 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -55 °C | -40 °C | -55 °C |
| 输出特性 | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | CERAMIC |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP8,.3 | DIP8,.3 | DIP8,.3 | DIP8,.3 | DIP14,.3 | DIP8,.3 | DIP14,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 电源 | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
| Prop。Delay @ Nom-Sup | 200 ns | 200 ns | 200 ns | 200 ns | 200 ns | 200 ns | 200 ns |
| 施密特触发器 | NO | NO | NO | NO | NO | NO | NO |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL | MILITARY |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 厂商名称 | Renesas(瑞萨电子) | - | - | - | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| JESD-609代码 | - | e0 | e0 | e0 | e0 | - | - |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - |
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