This product complies with RoHS Directive (EU 2002/95/EC).
Fast Recovery Diodes (FRD)
MA24F41
Silicon epitaxial planar type
For high speed switching circuits
Features
Super high speed switching characteristic (t
rr
= 15 nsec typ.)
At the same time as lowering the wiring inductance and increasing the peak
surge forward current, the resistance to surge damage at power on has been
increased by adopting clip connection package (TMP).
1
2.40
±0.10
Unit: mm
0.15
±0.05
M
ain
Di
sc te
on na
tin nc
ue e/
d
Absolute Maximum Ratings
T
a
= 25°C
Parameter
Repetitive peak reverse voltage
Forward current
*1
2
1.75
±0.05
3.80
±0.05
4.70
±0.10
Symbol
V
RRM
V
RSM
I
F
I
FSM
T
j
T
stg
Non-repetitive peak reverse surge voltage
Non-repetitive peak forward surge current
*2
Junction temperature
Storage temperature
–40 to +150
–40 to +150
Note) *1: Mounted on an alumina PC board
*2: 50 Hz sine wave 1 cycle (Non-repetitive peak current)
Electrical Characteristics
T
a
= 25°C±3°C
Parameter
Forward voltage
Reverse current
V
F
C
t
t
rr
di
Symbol
I
RRM
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Rating
400
1.0
20
400
Unit
V
V
5°
0.450
±0.05
5°
A
°C
°C
1 : Anode
2 : Cathode
0 to 0.03
A
0.90MAX
TMiniP2-F1 Package
Marking Symbol: G2
Conditions
Min
Typ
1.0
30
15
Max
1.3
20
0 to 0.40
Unit
V
mA
pF
ns
tin
isc
Terminal capacitance
on
2. Absolute frequency of input and output is 10 MHz.
3. *: t
rr
measurement circuit
Ma
int
en
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.
50
Ω
an
ce
Reverse recovery time
*
/D
ue
I
F
= 800 mA
V
RRM
= 400 V
V
R
= 0 V, f = 1 MHz
I
F
= 0.5 A, I
R
= 1.0 A
I
rr
= 0.25 A
45
50
Ω
Pl
t
rr
D.U.T
5.5
Ω
I
F
I
R
0.25
×
I
R
Publication date: February 2007
SKJ00018AED
1
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1)
If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
–
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
–
Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.
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int
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ain
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isc
on
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