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SMBJ24ATR

产品描述600W, UNIDIRECTIONAL, SILICON, TVS DIODE, DO-214AA, PLASTIC PACKAGE-2
产品类别分立半导体    二极管   
文件大小197KB,共4页
制造商Microsemi
官网地址https://www.microsemi.com
下载文档 详细参数 全文预览

SMBJ24ATR概述

600W, UNIDIRECTIONAL, SILICON, TVS DIODE, DO-214AA, PLASTIC PACKAGE-2

SMBJ24ATR规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Microsemi
Objectid1981657396
零件包装代码DO-214AA
包装说明R-PDSO-C2
针数2
Reach Compliance Codeunknown
ECCN代码EAR99
compound_id9184791
最大击穿电压29.5 V
最小击穿电压26.7 V
击穿电压标称值28.1 V
最大钳位电压38.9 V
配置SINGLE
二极管元件材料SILICON
二极管类型TRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95代码DO-214AA
JESD-30 代码R-PDSO-C2
JESD-609代码e0
湿度敏感等级1
最大非重复峰值反向功率耗散600 W
元件数量1
端子数量2
最高工作温度150 °C
最低工作温度-65 °C
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)NOT SPECIFIED
极性UNIDIRECTIONAL
最大功率耗散1.38 W
认证状态Not Qualified
最大重复峰值反向电压24 V
表面贴装YES
技术AVALANCHE
端子面层Tin/Lead (Sn90Pb10)
端子形式C BEND
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED

文档预览

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SMBJ5.0 thru SMBJ170CA
and SMBG5.0 thru SMBG170CA
SCOTTSDALE DIVISION
SURFACE MOUNT 600 Watt
Transient Voltage Suppressor
DESCRIPTION
This SMBJ5.0-170A or SMBG5.0-170A series of surface mount 600 W
Transient Voltage Suppressors (TVSs) protects a variety of voltage-sensitive
components from destruction or degradation. It is available in J-bend design
(SMBJ) with the DO-214AA package for greater PC board mounting density
or in a Gull-wing design (SMBG) in the DO-215AA for visible solder
connections. It is also available in both unidirectional and bidirectional
configurations with a C or CA suffix part number. Their response time is
virtually instantaneous. As a result, they can be used for protection from ESD
or EFT per IEC61000-4-2 and IEC61000-4-4, or for inductive switching
environments and induced RF protection. They can also protect from
secondary lightning effects per IEC61000-4-5 and class levels defined herein.
Microsemi also offers numerous other TVS products to meet higher and lower
power demands and special applications.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
APPEARANCE
WWW .
Microsemi
.C
OM
NOTE: All SMB series are
equivalent to prior SMS package
identifications.
FEATURES
Economical surface mount design in both J-bend or
Gull-wing terminations
Available in both unidirectional and bidirectional
construction (add C or CA suffix for bidirectional)
Selections for 5.0 to 170 volts standoff voltages (V
WM
)
Suppresses transients up to 600 watts @ 10/1000 µs
(see Figure 1)
Fast response
Options for screening in accordance with MIL-PRF-
19500 for JAN, JANTX, JANTXV, and JANS are
available by adding MQ, MX, MV, or MSP prefixes
respectively to part numbers.
Axial-lead equivalent packages for thru-hole mounting
available as P6KE6.8 to P6KE200CA (consult factory
for other surface mount options)
Moisture classification is Level 1 with no dry pack
required per IPC/JEDEC J-STD-020B
APPLICATIONS / BENEFITS
Protects sensitive components such as IC’s, CMOS,
2
Bipolar, BiCMOS, ECL, DTL, T L, etc.
Protection from switching transients & induced RF
Compliant to IEC61000-4-2 and IEC61000-4-4 for
ESD and EFT protection respectively
Secondary lightning protection per IEC61000-4-5
with 42 Ohms source impedance:
Class 1: SMB 5.0 to SMB 120A or CA
Class 2: SMB 5.0 to SMB 60A or CA
Class 3: SMB 5.0 to SMB 30A or CA
Class 4: SMB 5.0 to SMB 15A or CA
Secondary lightning protection per IEC61000-4-5
with 12 Ohms source impedance:
Class 1: SMB 5.0 to SMB 36A or CA
Class 2: SMB 5.0 to SMB 18A or CA
MAXIMUM RATINGS
Peak Pulse Power dissipation at 25
º
C: 600 watts at
10/1000
µs
(also see Fig 1,2, and 3).
Impulse repetition rate (duty factor): 0.01%
t
clamping
(0 volts to
V
(BR)
min.): < 100 ps theoretical for
unidirectional and < 5 ns for bidirectional
Operating and Storage temperature: -65
º
C to +150
º
C
Thermal resistance: 25
º
C/W junction to lead, or 90
º
C/W
junction to ambient when mounted on FR4 PC board
(1oz Cu) with recommended footprint (see last page)
Steady-State Power dissipation: 5 watts at T
L
= 25
o
C,
or 1.38 watts at T
A
= 25
º
C when mounted on FR4 PC
board with recommended footprint
Forward Surge at 25ºC: 50 Amps peak impulse of 8.3
ms half-sine wave (unidirectional only)
Solder temperatures: 260
º
C for 10 s (maximum)
Copyright
2002
10-14-2003 REV C
MECHANICAL AND PACKAGING
CASE: Void-free transfer molded thermosetting
epoxy body meeting UL94V-0
TERMINALS: Gull-wing or C-bend (modified J-bend)
leads, tin-lead plated solderable per MIL-STD-750,
method 2026
POLARITY: Cathode indicated by band. No
marking on bi-directional devices
MARKING: Part number without prefix (e.g. 5.0,
5.0A, 5.0CA, 36, 36A, 36CA, etc.)
TAPE & REEL option: Standard per EIA-481-1-A
with 12 mm tape, 750 per 7 inch reel or 2500 per 13
inch reel (add “TR” suffix to part number)
WEIGHT: 0.1 grams
See package dimension on last page
SMB 5.0 – 170V
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
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