Microcontroller, 8-Bit, MROM, 8MHz, CMOS, PDSO28, LEAD FREE, SSOP-28
| 参数名称 | 属性值 |
| 厂商名称 | Maxim(美信半导体) |
| Objectid | 1815181920 |
| 零件包装代码 | SSOP |
| 包装说明 | LEAD FREE, SSOP-28 |
| 针数 | 28 |
| Reach Compliance Code | compliant |
| compound_id | 6761978 |
| 具有ADC | NO |
| 地址总线宽度 | |
| 位大小 | 8 |
| 最大时钟频率 | 8 MHz |
| DAC 通道 | NO |
| DMA 通道 | NO |
| 外部数据总线宽度 | |
| JESD-30 代码 | R-PDSO-G28 |
| JESD-609代码 | e3 |
| 长度 | 10.2 mm |
| I/O 线路数量 | 23 |
| 端子数量 | 28 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| PWM 通道 | NO |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| ROM可编程性 | MROM |
| 座面最大高度 | 1.99 mm |
| 速度 | 8 MHz |
| 最大供电电压 | 3.6 V |
| 最小供电电压 | 2 V |
| 标称供电电压 | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | MATTE TIN |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 5.29 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
| Z86L8108HSG | Z86L9808PSG | Z86L9808HSG | Z86L8608HSG | Z86L8608PSG | Z86L8608SSG | Z86L8108PSG | Z86L8108SSG | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Microcontroller, 8-Bit, MROM, 8MHz, CMOS, PDSO28, LEAD FREE, SSOP-28 | Microcontroller, 8-Bit, MROM, 8MHz, CMOS, PDIP28, LEAD FREE, PLASTIC, DIP-28 | Microcontroller, 8-Bit, MROM, 8MHz, CMOS, PDSO28, LEAD FREE, SSOP-28 | Microcontroller, 8-Bit, MROM, 8MHz, CMOS, PDSO28, LEAD FREE, SSOP-28 | Microcontroller, 8-Bit, MROM, 8MHz, CMOS, PDIP28, LEAD FREE, PLASTIC, DIP-28 | Microcontroller, 8-Bit, MROM, 8MHz, CMOS, PDSO28, LEAD FREE, SOIC-28 | Microcontroller, 8-Bit, MROM, 8MHz, CMOS, PDIP28, LEAD FREE, PLASTIC, DIP-28 | Microcontroller, 8-Bit, MROM, 8MHz, CMOS, PDSO28, LEAD FREE, SOIC-28 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | SSOP | DIP | SSOP | SSOP | DIP | SOIC | DIP | SOIC |
| 包装说明 | LEAD FREE, SSOP-28 | DIP, | LEAD FREE, SSOP-28 | LEAD FREE, SSOP-28 | LEAD FREE, PLASTIC, DIP-28 | SOP, | LEAD FREE, PLASTIC, DIP-28 | SOP, |
| 针数 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | unknown | compliant | unknow |
| 具有ADC | NO | NO | NO | NO | NO | NO | NO | NO |
| 位大小 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最大时钟频率 | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz |
| DAC 通道 | NO | NO | NO | NO | NO | NO | NO | NO |
| DMA 通道 | NO | NO | NO | NO | NO | NO | NO | NO |
| JESD-30 代码 | R-PDSO-G28 | R-PDIP-T28 | R-PDSO-G28 | R-PDSO-G28 | R-PDIP-T28 | R-PDSO-G28 | R-PDIP-T28 | R-PDSO-G28 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 10.2 mm | 36.83 mm | 10.2 mm | 10.2 mm | 36.83 mm | 17.89 mm | 36.83 mm | 17.89 mm |
| I/O 线路数量 | 23 | 23 | 23 | 23 | 23 | 23 | 23 | 23 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| PWM 通道 | NO | NO | NO | NO | NO | NO | NO | NO |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SSOP | DIP | SSOP | SSOP | DIP | SOP | DIP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | IN-LINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 | NOT SPECIFIED | 260 | 260 | NOT SPECIFIED | 260 | NOT SPECIFIED | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| ROM可编程性 | MROM | MROM | MROM | MROM | MROM | MROM | MROM | MROM |
| 座面最大高度 | 1.99 mm | 5.08 mm | 1.99 mm | 1.99 mm | 5.08 mm | 2.64 mm | 5.08 mm | 2.64 mm |
| 速度 | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz |
| 最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
| 表面贴装 | YES | NO | YES | YES | NO | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN |
| 端子形式 | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING |
| 端子节距 | 0.65 mm | 2.54 mm | 0.65 mm | 0.65 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | NOT SPECIFIED | 40 | 40 | NOT SPECIFIED | 40 | NOT SPECIFIED | 40 |
| 宽度 | 5.29 mm | 15.24 mm | 5.29 mm | 5.29 mm | 15.24 mm | 7.5 mm | 15.24 mm | 7.5 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
| 标称供电电压 | 3 V | 3 V | 3 V | 3 V | 3 V | - | 3 V | - |
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