F-217 SUPPLEMENT
YTE–110–02–G–6–500
YTE–120–03–G–5–700
YTE–114–03–M–Q–368
(2.00 mm) .0787"
YTE SERIES
HIGH-DENSITY ELEVATED SOCKET STRIP
SPECIFICATIONS
For complete specifications
see www.samtec.com?YTE
Insulator Material:
Black Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Operating Temp Range:
-55 °C to +105 °C
Plating:
Sn or Au over
50 µ" (1.27 µm) Ni
Contact Resistance:
10 mW
Insertion Depth:
(2.62 mm) .103" to
(5.03 mm) .198" with
(0.38 mm) .015" wipe
Max Cycles:
100 with 10 µ" (0.25 µm) Au
RoHS Compliant:
Yes
Lead–Free Solderable:
Wave only
Mates with:
YTT, YTW, YTE
Body Height
from (8.64 mm)
.340" to
(20.32 mm)
.800"
OTHER SOLUTIONS
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594
Paste In Hole (PIH) processing.
(Not recommended for self-nesting.)
Contact Samtec ASP Group.
(2.00 mm)
.0787"
pitch
YTE
1
NO. PINS
PER ROW
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
PLATING
OPTION
ROW
OPTION
BODY
HEIGHT
OTHER
OPTION
02 thru 50
Note:
This Series is non-standard,
non-returnable.
= 20 µ" (0.51 µm) Gold
(Recommended for
self-nesting)
–G
Other Solutions
PC/104-Plus
™
Sockets
See ESQT-368
Series.
300
= 20 µ" (0.51 µm)
Gold on contact,
Tin on tail
–M
–L
–F
= Body Height
(in inches)
(8.64 mm) .340"
min. for –Q
(9.53 mm) .375"
min. for –5 & –6
–“XXX”
–“XXX”
=Polarized
Position
(Indicate
position
number)
No. of positions x
(2.00) .0787 + (0.30) .012
06
No. of
rows x
(2.00)
.0787
295
01
= 10 µ" (0.25 µm)
Gold on contact,
Tin on tail
= Quad Row
–Q
–5
–6
Low
Profile
See YTS
& YTQ Series.
(2.00)
.0787
(6.35)
.250
A
= Gold flash
on contact,
Tin on tail
= Five Row
= Six Row
1, 2, & 3
Row
See ESQT
Series.
BODY TAIL
HEIGHT (1.27)
.050
MIN
LEAD
STYLE
A
– 02
(21.59)
.850
–03
(11.63)
.458
Press-fit
See PTHF
Series.
(0.50)
.020 SQ
(2.00)
.0787
(2.00)
.0787
MAX MAX BODY
TAIL
HEIGHT
(13.72) (20.32)
.540
.800
(3.76)
(10.36)
.148
.408
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
