Peripheral Driver, 4 Driver, CMOS, CDIP14,
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | TelCom Semiconductor, Inc. (Microchip Technology) |
Objectid | 1435569831 |
Reach Compliance Code | unknown |
compound_id | 294150752 |
驱动器位数 | 4 |
JESD-30 代码 | R-XDIP-T14 |
JESD-609代码 | e0 |
端子数量 | 14 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
最大输出电流 | 0.3 A |
封装主体材料 | CERAMIC |
封装代码 | DIP |
封装等效代码 | DIP14,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 4.5/18 V |
认证状态 | Not Qualified |
表面贴装 | NO |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
TC4458EJD | TC4458COE | TC4458CPD | TC4458EOE | TC4458EPD | TC4458MJD | |
---|---|---|---|---|---|---|
描述 | Peripheral Driver, 4 Driver, CMOS, CDIP14, | Peripheral Driver, 4 Driver, CMOS, PDSO16, | Peripheral Driver, 4 Driver, CMOS, PDIP14, | Peripheral Driver, 4 Driver, CMOS, PDSO16, | Peripheral Driver, 4 Driver, CMOS, PDIP14, | Peripheral Driver, 4 Driver, CMOS, CDIP14, |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | TelCom Semiconductor, Inc. (Microchip Technology) | TelCom Semiconductor, Inc. (Microchip Technology) | TelCom Semiconductor, Inc. (Microchip Technology) | TelCom Semiconductor, Inc. (Microchip Technology) | TelCom Semiconductor, Inc. (Microchip Technology) | TelCom Semiconductor, Inc. (Microchip Technology) |
Reach Compliance Code | unknown | unknow | unknow | unknow | unknow | unknow |
驱动器位数 | 4 | 4 | 4 | 4 | 4 | 4 |
JESD-30 代码 | R-XDIP-T14 | R-PDSO-G16 | R-PDIP-T14 | R-PDSO-G16 | R-PDIP-T14 | R-XDIP-T14 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
端子数量 | 14 | 16 | 14 | 16 | 14 | 14 |
最高工作温度 | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C | 125 °C |
最低工作温度 | -40 °C | - | - | -40 °C | -40 °C | -55 °C |
最大输出电流 | 0.3 A | 0.3 A | 0.3 A | 0.3 A | 0.3 A | 0.3 A |
封装主体材料 | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
封装代码 | DIP | SOP | DIP | SOP | DIP | DIP |
封装等效代码 | DIP14,.3 | SOP16,.4 | DIP14,.3 | SOP16,.4 | DIP14,.3 | DIP14,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE |
电源 | 4.5/18 V | 4.5/18 V | 4.5/18 V | 4.5/18 V | 4.5/18 V | 4.5/18 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | NO | YES | NO | YES | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
ECCN代码 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
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