Analog Circuit, CDIP24,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Raytheon Company |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-XDIP-T24 |
| JESD-609代码 | e0 |
| 端子数量 | 24 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5,-5.2 V |
| 认证状态 | Not Qualified |
| 表面贴装 | NO |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| TDC1035B7C | TDC1035B7V | TDC1035R3C | TDC1035 | |
|---|---|---|---|---|
| 描述 | Analog Circuit, CDIP24, | Analog Circuit, CDIP24, | Analog Circuit, PQCC28, | Analog Circuit, CDIP24, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-XDIP-T24 | R-XDIP-T24 | S-PQCC-J28 | R-XDIP-T24 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 端子数量 | 24 | 24 | 28 | 24 |
| 最高工作温度 | 70 °C | 125 °C | 70 °C | 70 °C |
| 封装主体材料 | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC |
| 封装代码 | DIP | DIP | QCCJ | DIP |
| 封装等效代码 | DIP24,.6 | DIP24,.6 | LDCC28,.5SQ | DIP24,.6 |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE |
| 电源 | 5,-5.2 V | 5,-5.2 V | 5,-5.2 V | 5,-5.2 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | NO | YES | NO |
| 温度等级 | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | QUAD | DUAL |
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