Microcontroller, 4-Bit, MROM, E0C6200/SMC6200 CPU, CMOS, PQFP80
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Seiko Epson Corporation |
| Objectid | 1164787847 |
| 包装说明 | QFP, QFP80,.55SQ,20 |
| Reach Compliance Code | unknown |
| compound_id | 219578053 |
| 位大小 | 4 |
| CPU系列 | E0C6200/SMC6200 |
| JESD-30 代码 | S-PQFP-G80 |
| JESD-609代码 | e0 |
| 负电源额定电压 | -1.5 V |
| 端子数量 | 80 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | -20 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QFP |
| 封装等效代码 | QFP80,.55SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK |
| 电源 | -1.5 V |
| 认证状态 | Not Qualified |
| RAM（字节） | 112 |
| ROM（单词） | 2048 |
| ROM可编程性 | MROM |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| E0C62L82Q14 | E0C6282Q5 | E0C6282Q14 | E0C62L82Q5 | |
|---|---|---|---|---|
| 描述 | Microcontroller, 4-Bit, MROM, E0C6200/SMC6200 CPU, CMOS, PQFP80 | IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,80PIN,PLASTIC | IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,80PIN,PLASTIC | IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,80PIN,PLASTIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Seiko Epson Corporation | Seiko Epson Corporation | Seiko Epson Corporation | Seiko Epson Corporation |
| 包装说明 | QFP, QFP80,.55SQ,20 | QFP, QFP80,.75X1,32 | QFP, QFP80,.55SQ,20 | QFP, QFP80,.75X1,32 |
| Reach Compliance Code | unknown | unknown | unknown | unknow |
| 位大小 | 4 | 4 | 4 | 4 |
| CPU系列 | E0C6200/SMC6200 | E0C6200/SMC6200 | E0C6200/SMC6200 | E0C6200/SMC6200 |
| JESD-30 代码 | S-PQFP-G80 | R-PQFP-G80 | S-PQFP-G80 | R-PQFP-G80 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 负电源额定电压 | -1.5 V | -3 V | -3 V | -1.5 V |
| 端子数量 | 80 | 80 | 80 | 80 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
| 最低工作温度 | -20 °C | -20 °C | -20 °C | -20 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QFP | QFP | QFP | QFP |
| 封装等效代码 | QFP80,.55SQ,20 | QFP80,.75X1,32 | QFP80,.55SQ,20 | QFP80,.75X1,32 |
| 封装形状 | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
| 电源 | -1.5 V | -3 V | -3 V | -1.5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字节） | 112 | 112 | 112 | 112 |
| ROM（单词） | 2048 | 2048 | 2048 | 2048 |
| ROM可编程性 | MROM | MROM | MROM | MROM |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.8 mm | 0.5 mm | 0.8 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD |
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