CD74AC653ENX
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Renesas(瑞萨电子) |
Reach Compliance Code | not_compliant |
控制类型 | INDEPENDENT CONTROL |
计数方向 | BIDIRECTIONAL |
JESD-30 代码 | R-PDIP-T24 |
JESD-609代码 | e0 |
逻辑集成电路类型 | REGISTERED BUS TRANSCEIVER |
最大I(ol) | 0.024 A |
位数 | 8 |
功能数量 | 1 |
端子数量 | 24 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出特性 | OPEN-DRAIN/3-STATE |
输出极性 | INVERTED |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP24,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 3.3/5 V |
Prop。Delay @ Nom-Sup | 18.9 ns |
表面贴装 | NO |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
触发器类型 | POSITIVE EDGE |
CD74AC653ENX | CD74AC654ENX | CD74ACT653ENX | CD74AC654M96 | CD74ACT654M96 | CD74ACT654ENX | |
---|---|---|---|---|---|---|
描述 | CD74AC653ENX | CD74AC654ENX | CD74ACT653ENX | CD74AC654M96 | CD74ACT654M96 | CD74ACT654ENX |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
控制类型 | INDEPENDENT CONTROL | INDEPENDENT CONTROL | INDEPENDENT CONTROL | INDEPENDENT CONTROL | INDEPENDENT CONTROL | INDEPENDENT CONTROL |
计数方向 | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL |
JESD-30 代码 | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | R-PDSO-G24 | R-PDSO-G24 | R-PDIP-T24 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
逻辑集成电路类型 | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER |
最大I(ol) | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A |
位数 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 24 | 24 | 24 | 24 | 24 | 24 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
输出特性 | OPEN-DRAIN/3-STATE | OPEN-DRAIN/3-STATE | OPEN-DRAIN/3-STATE | OPEN-DRAIN/3-STATE | OPEN-DRAIN/3-STATE | OPEN-DRAIN/3-STATE |
输出极性 | INVERTED | TRUE | INVERTED | TRUE | TRUE | TRUE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | DIP | DIP | SOP | SOP | DIP |
封装等效代码 | DIP24,.3 | DIP24,.3 | DIP24,.3 | SOP24,.4 | SOP24,.4 | DIP24,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
电源 | 3.3/5 V | 3.3/5 V | 5 V | 3.3/5 V | 5 V | 5 V |
Prop。Delay @ Nom-Sup | 18.9 ns | 18.9 ns | 12.5 ns | 18.9 ns | 13.6 ns | 13.6 ns |
表面贴装 | NO | NO | NO | YES | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
Base Number Matches | - | 1 | 1 | 1 | 1 | - |
翻译 | - | - | N/A | N/A | N/A | N/A |
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