IC DUAL OP-AMP, 3200 uV OFFSET-MAX, 5 MHz BAND WIDTH, PDSO10, MSOP-10, Operational Amplifier
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | National Semiconductor（TI ） |
| 零件包装代码 | SOIC |
| 包装说明 | TSSOP, TSSOP10,.19,20 |
| 针数 | 10 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 放大器类型 | OPERATIONAL AMPLIFIER |
| 架构 | VOLTAGE-FEEDBACK |
| 最大平均偏置电流 (IIB) | 0.00013 µA |
| 25C 时的最大偏置电流 (IIB) | 0.000115 µA |
| 标称共模抑制比 | 75 dB |
| 频率补偿 | YES |
| 最大输入失调电压 | 3200 µV |
| JESD-30 代码 | S-PDSO-G10 |
| JESD-609代码 | e3 |
| 长度 | 3 mm |
| 低-偏置 | YES |
| 低-失调 | NO |
| 微功率 | NO |
| 湿度敏感等级 | 1 |
| 负供电电压上限 | |
| 标称负供电电压 (Vsup) | |
| 功能数量 | 2 |
| 端子数量 | 10 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP10,.19,20 |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 包装方法 | TAPE AND REEL |
| 峰值回流温度（摄氏度） | 260 |
| 功率 | NO |
| 电源 | 2.7/5 V |
| 可编程功率 | NO |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 标称压摆率 | 5 V/us |
| 最大压摆率 | 3.8 mA |
| 供电电压上限 | 5.5 V |
| 标称供电电压 (Vsup) | 2.7 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 标称均一增益带宽 | 5000 kHz |
| 最小电压增益 | 6300 |
| 宽带 | NO |
| 宽度 | 3 mm |
| LMV712MM/NOPB | LMV712LDX/NOPB | LMV712MMX/NOPB | LMV712LD/NOPB | LMV712TL | LMV712TLX | |
|---|---|---|---|---|---|---|
| 描述 | IC DUAL OP-AMP, 3200 uV OFFSET-MAX, 5 MHz BAND WIDTH, PDSO10, MSOP-10, Operational Amplifier | IC DUAL OP-AMP, 3200 uV OFFSET-MAX, 5 MHz BAND WIDTH, DSO10, LLP-10, Operational Amplifier | IC DUAL OP-AMP, 3200 uV OFFSET-MAX, 5 MHz BAND WIDTH, PDSO10, MSOP-10, Operational Amplifier | IC DUAL OP-AMP, 3200 uV OFFSET-MAX, 5 MHz BAND WIDTH, DSO10, LLP-10, Operational Amplifier | IC DUAL OP-AMP, 3200 uV OFFSET-MAX, 5 MHz BAND WIDTH, PBGA10, MICRO, MO-211BD, SMD-10, Operational Amplifier | IC DUAL OP-AMP, 3200 uV OFFSET-MAX, 5 MHz BAND WIDTH, PBGA10, MICRO, MO-211BD, SMD-10, Operational Amplifier |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） |
| 零件包装代码 | SOIC | SOIC | SOIC | SOIC | BGA | BGA |
| 包装说明 | TSSOP, TSSOP10,.19,20 | VSON, SOLCC10,.19 | TSSOP, TSSOP10,.19,20 | VSON, SOLCC10,.19 | VFBGA, BGA10,3X4,20 | VFBGA, BGA10,3X4,20 |
| 针数 | 10 | 10 | 10 | 10 | 10 | 10 |
| Reach Compliance Code | compliant | compliant | compliant | compli | compli | compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| 架构 | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| 最大平均偏置电流 (IIB) | 0.00013 µA | 0.00013 µA | 0.00013 µA | 0.00013 µA | 0.00013 µA | 0.00013 µA |
| 25C 时的最大偏置电流 (IIB) | 0.000115 µA | 0.000115 µA | 0.000115 µA | 0.000115 µA | 0.000115 µA | 0.000115 µA |
| 标称共模抑制比 | 75 dB | 75 dB | 75 dB | 75 dB | 75 dB | 75 dB |
| 频率补偿 | YES | YES | YES | YES | YES | YES |
| 最大输入失调电压 | 3200 µV | 3200 µV | 3200 µV | 3200 µV | 3200 µV | 3200 µV |
| JESD-30 代码 | S-PDSO-G10 | S-XDSO-N10 | S-PDSO-G10 | S-XDSO-N10 | R-PBGA-B10 | R-PBGA-B10 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e1 | e1 |
| 长度 | 3 mm | 3 mm | 3 mm | 3 mm | 2.022 mm | 2.022 mm |
| 低-偏置 | YES | YES | YES | YES | YES | YES |
| 低-失调 | NO | NO | NO | NO | NO | NO |
| 微功率 | NO | NO | NO | NO | NO | NO |
| 湿度敏感等级 | 1 | 3 | 1 | 3 | 1 | 1 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 10 | 10 | 10 | 10 | 10 | 10 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | VSON | TSSOP | VSON | VFBGA | VFBGA |
| 封装等效代码 | TSSOP10,.19,20 | SOLCC10,.19 | TSSOP10,.19,20 | SOLCC10,.19 | BGA10,3X4,20 | BGA10,3X4,20 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 包装方法 | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 |
| 功率 | NO | NO | NO | NO | NO | NO |
| 电源 | 2.7/5 V | 2.7/5 V | 2.7/5 V | 2.7/5 V | 2.7/5 V | 2.7/5 V |
| 可编程功率 | NO | NO | NO | NO | NO | NO |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.1 mm | 0.8 mm | 1.1 mm | 0.8 mm | 0.6 mm | 0.6 mm |
| 标称压摆率 | 5 V/us | 5 V/us | 5 V/us | 5 V/us | 5 V/us | 5 V/us |
| 最大压摆率 | 3.8 mA | 3.8 mA | 3.8 mA | 3.8 mA | 3.8 mA | 3.8 mA |
| 供电电压上限 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 标称供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | GULL WING | NO LEAD | GULL WING | NO LEAD | BALL | BALL |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | 40 | 40 | 40 | NOT SPECIFIED | NOT SPECIFIED |
| 标称均一增益带宽 | 5000 kHz | 5000 kHz | 5000 kHz | 5000 kHz | 5000 kHz | 5000 kHz |
| 最小电压增益 | 6300 | 6300 | 6300 | 6300 | 6300 | 6300 |
| 宽带 | NO | NO | NO | NO | NO | NO |
| 宽度 | 3 mm | 3 mm | 3 mm | 3 mm | 1.5 mm | 1.5 mm |
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