FIFO, 512KX9, 6.5ns, Synchronous, PQFP80, PLASTIC, TQFP-80
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | QFP |
| 包装说明 | PLASTIC, TQFP-80 |
| 针数 | 80 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 最长访问时间 | 6.5 ns |
| 其他特性 | CAN ALSO BE CONFIGURED AS 262,144X18 |
| 周期时间 | 10 ns |
| JESD-30 代码 | S-PQFP-G80 |
| JESD-609代码 | e0 |
| 长度 | 14 mm |
| 内存密度 | 4718592 bit |
| 内存宽度 | 9 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 80 |
| 字数 | 524288 words |
| 字数代码 | 512000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 512KX9 |
| 可输出 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LQFP |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 240 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.6 mm |
| 最大供电电压 (Vsup) | 3.45 V |
| 最小供电电压 (Vsup) | 3.15 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 20 |
| 宽度 | 14 mm |
| IDT72V113L10PF | IDT72V113L7.5PF | IDT72V103L10PF | IDT72V113L15PF | IDT72V103L15PF | IDT72V103L7.5PF | |
|---|---|---|---|---|---|---|
| 描述 | FIFO, 512KX9, 6.5ns, Synchronous, PQFP80, PLASTIC, TQFP-80 | FIFO, 512KX9, 5ns, Synchronous, PQFP80, PLASTIC, TQFP-80 | FIFO, 256KX9, 6.5ns, Synchronous, PQFP80, PLASTIC, TQFP-80 | FIFO, 512KX9, 10ns, Synchronous, PQFP80, PLASTIC, TQFP-80 | FIFO, 256KX9, 10ns, Synchronous, PQFP80, PLASTIC, TQFP-80 | FIFO, 256KX9, 5ns, Synchronous, PQFP80, PLASTIC, TQFP-80 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 零件包装代码 | QFP | QFP | QFP | QFP | QFP | QFP |
| 包装说明 | PLASTIC, TQFP-80 | PLASTIC, TQFP-80 | PLASTIC, TQFP-80 | PLASTIC, TQFP-80 | PLASTIC, TQFP-80 | PLASTIC, TQFP-80 |
| 针数 | 80 | 80 | 80 | 80 | 80 | 80 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compli | compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 6.5 ns | 5 ns | 6.5 ns | 10 ns | 10 ns | 5 ns |
| 其他特性 | CAN ALSO BE CONFIGURED AS 262,144X18 | CAN ALSO BE CONFIGURED AS 262,144X18 | CAN ALSO BE CONFIGURED AS 131,072X18 | CAN ALSO BE CONFIGURED AS 262,144X18 | CAN ALSO BE CONFIGURED AS 131,072X18 | CAN ALSO BE CONFIGURED AS 131,072X18 |
| 周期时间 | 10 ns | 7.5 ns | 10 ns | 15 ns | 15 ns | 7.5 ns |
| JESD-30 代码 | S-PQFP-G80 | S-PQFP-G80 | S-PQFP-G80 | S-PQFP-G80 | S-PQFP-G80 | S-PQFP-G80 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |
| 内存密度 | 4718592 bit | 4718592 bit | 2359296 bit | 4718592 bit | 2359296 bi | 2359296 bi |
| 内存宽度 | 9 | 9 | 9 | 9 | 9 | 9 |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 80 | 80 | 80 | 80 | 80 | 80 |
| 字数 | 524288 words | 524288 words | 262144 words | 524288 words | 262144 words | 262144 words |
| 字数代码 | 512000 | 512000 | 256000 | 512000 | 256000 | 256000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 512KX9 | 512KX9 | 256KX9 | 512KX9 | 256KX9 | 256KX9 |
| 可输出 | YES | YES | YES | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 240 | 240 | 240 | 240 | 240 | 240 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
| 最大供电电压 (Vsup) | 3.45 V | 3.45 V | 3.45 V | 3.45 V | 3.45 V | 3.45 V |
| 最小供电电压 (Vsup) | 3.15 V | 3.15 V | 3.15 V | 3.15 V | 3.15 V | 3.15 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | 20 | 20 | 20 | 20 | 20 | 20 |
| 宽度 | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |
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