4-BIT, MICROPROGRAM SEQUENCER, CDIP28, HERMETIC SEALED, DIP-28
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | DIP, |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.2.C |
| 外部数据总线宽度 | 4 |
| JESD-30 代码 | R-GDIP-T28 |
| 端子数量 | 28 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.715 mm |
| 最大压摆率 | 130 mA |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 15.24 mm |
| uPs/uCs/外围集成电路类型 | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER |
| IDM2909ADM/883 | IDM2911ADC | IDM2909ADC | IDM2909ADM | IDM2911ADM | IDM2911ADM/883 | |
|---|---|---|---|---|---|---|
| 描述 | 4-BIT, MICROPROGRAM SEQUENCER, CDIP28, HERMETIC SEALED, DIP-28 | 4-BIT, MICROPROGRAM SEQUENCER, CDIP20, HERMETIC SEALED, DIP-20 | 4-BIT, MICROPROGRAM SEQUENCER, CDIP28, HERMETIC SEALED, DIP-28 | 4-BIT, MICROPROGRAM SEQUENCER, CDIP28, HERMETIC SEALED, DIP-28 | 4-BIT, MICROPROGRAM SEQUENCER, CDIP20, HERMETIC SEALED, DIP-20 | 4-BIT, MICROPROGRAM SEQUENCER, CDIP20, HERMETIC SEALED, DIP-20 |
| 包装说明 | DIP, | DIP, | DIP, | DIP, | DIP, | DIP, |
| Reach Compliance Code | unknown | unknow | unknow | unknown | unknow | unknow |
| 外部数据总线宽度 | 4 | 4 | 4 | 4 | 4 | 4 |
| JESD-30 代码 | R-GDIP-T28 | R-GDIP-T20 | R-GDIP-T28 | R-GDIP-T28 | R-GDIP-T20 | R-GDIP-T20 |
| 端子数量 | 28 | 20 | 28 | 28 | 20 | 20 |
| 最高工作温度 | 125 °C | 70 °C | 70 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | - | - | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.715 mm | 5.08 mm | 5.715 mm | 5.715 mm | 5.08 mm | 5.08 mm |
| 最大压摆率 | 130 mA | 130 mA | 130 mA | 130 mA | 130 mA | 130 mA |
| 最大供电电压 | 5.5 V | 5.25 V | 5.25 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.75 V | 4.75 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 15.24 mm | 7.62 mm | 15.24 mm | 15.24 mm | 7.62 mm | 7.62 mm |
| uPs/uCs/外围集成电路类型 | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER |
| 厂商名称 | Texas Instruments(德州仪器) | - | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| ECCN代码 | 3A001.A.2.C | - | - | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
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