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W1D256M72R8A-3.75AR-HA2

产品描述256MX8 DDR DRAM MODULE, 0.5ns, DMA240, MO-237, DIMM-240
产品类别存储    存储   
文件大小255KB,共11页
制造商XILINX(赛灵思)
官网地址https://www.xilinx.com/
下载文档 详细参数 全文预览

W1D256M72R8A-3.75AR-HA2概述

256MX8 DDR DRAM MODULE, 0.5ns, DMA240, MO-237, DIMM-240

W1D256M72R8A-3.75AR-HA2规格参数

参数名称属性值
厂商名称XILINX(赛灵思)
零件包装代码DIMM
包装说明DIMM,
针数240
Reach Compliance Codeunknown
访问模式SINGLE BANK PAGE BURST
最长访问时间0.5 ns
其他特性AUTO/SELF REFRESH
JESD-30 代码R-XDMA-N240
JESD-609代码e4
长度133.35 mm
内存密度2147483648 bit
内存集成电路类型DDR DRAM MODULE
内存宽度8
功能数量1
端口数量1
端子数量240
字数268435456 words
字数代码256000000
工作模式SYNCHRONOUS
最高工作温度55 °C
最低工作温度
组织256MX8
封装主体材料UNSPECIFIED
封装代码DIMM
封装形状RECTANGULAR
封装形式MICROELECTRONIC ASSEMBLY
认证状态Not Qualified
座面最大高度2.7 mm
最大供电电压 (Vsup)1.9 V
最小供电电压 (Vsup)1.7 V
标称供电电压 (Vsup)1.8 V
表面贴装NO
温度等级COMMERCIAL
端子面层GOLD
端子形式NO LEAD
端子节距1.27 mm
端子位置DUAL
宽度30 mm

文档预览

下载PDF文档
DDR2-400, 533
Single Rank, x8 Registered SDRAM DIMMs
256MB
512MB
1GB
2GB
-
-
-
-
W1D32M72R8
W1D64M72R8
W1D128M72R8
W1D256M72R8 (Preliminary*)
Figure 1: Available layouts
Layout A:
1.181"
Features:
240-pin Registered ECC DDR2 SDRAM Dual-In-
Line Memory Module for DDR2-400 and DDR2-533
JEDEC standard VDD=1.8V (+/- 0.1V) power
supply
One rank 256MB, 512MB, 1GB, and 2GB
Modules are built with 18 x8 DDR2 SDRAM
devices in a 60-ball FBGA package
ECC error detection and correction
Programmable CAS Latency of 3 and 4; Burst
Length of 4 and 8
Auto Refresh and Self Refresh Mode
OCD (Off-Chip Driver Impedance Adjustment) and
ODT (On-Die Termination)
SPD (Serial Presence Detect) with EEPROM
All input/output are SSTL_18 compatible
All contacts are gold plated
One clock delay for register
Layout B:
1.0"
Front view of double-sided DIMM (see detail physical dimensions
at the back)
Speed Grades:
-5
-3.75
Units
Module Speed Grade
PC2-3200 PC2-4200
Speed @ CL3
400
-
MHz
Speed @ CL4
400
533
MHz
Speed @ CL5
-
533
MHz
Note: See Product ordering for full naming guide
Speed Grade
Description:
The following specification covers the W1D32M72R8, W1D64M72R8, W1D128M72R8, and W1D256M72R8
family of Single-Rank Registered ECC DDR2 modules using x8 FBGA SDRAMs. Please reference Figure 1 for
available layout configurations and the product ordering guide on the final page of this specification for available
options including speed grade and silicon manufacturer.
Address Summary Table:
Module Configuration
Refresh
Device Configuration
Row Addressing
Column Addressing
Module Rank
256MB
32M x 72
8k
32M x 8
(9 components)
A0-A13
A0-A9
1
512MB
64M x 72
8K
64M x 8
(9 components)
A0-A13
A0-A9
1
1GB
128M x 72
8K
128M x 8
(9 components)
A0-A14
A0-A9
1
2GB
256M x 72
8K
256M x 8
(9 components)
A0-A14
A0-A9
1
*Specifications are for reference purposes only and are subject to change by Wintec without notice.
DDR2_RDIMM_1 rank_x8_spec
Rev. 1.0 - December, 04
Wintec Industries, Inc., reserves the right to change datasheets and/or products without any notice.
2004 Wintec Industries, Inc.
1

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