Buffer/Inverter Based Peripheral Driver, 1.5A, CDIP16, HERMETIC SEALED, CERDIP-16
参数名称 | 属性值 |
厂商名称 | Allegro |
Objectid | 1543842500 |
零件包装代码 | DIP |
包装说明 | DIP, |
针数 | 16 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
compound_id | 11053354 |
内置保护 | TRANSIENT |
接口集成电路类型 | BUFFER OR INVERTER BASED PERIPHERAL DRIVER |
JESD-30 代码 | R-GDIP-T16 |
长度 | 19.05 mm |
功能数量 | 1 |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出电流流向 | SINK |
标称输出峰值电流 | 1.5 A |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
认证状态 | Not Qualified |
筛选级别 | MIL-STD-883 Class B |
座面最大高度 | 5.46 mm |
标称供电电压 | 5 V |
表面贴装 | NO |
温度等级 | MILITARY |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
断开时间 | 1.5 µs |
接通时间 | 1 µs |
宽度 | 7.62 mm |
ULS-2068R | ULS-2070R | ULS-2071R | ULS-2069R | |
---|---|---|---|---|
描述 | Buffer/Inverter Based Peripheral Driver, 1.5A, CDIP16, HERMETIC SEALED, CERDIP-16 | Buffer/Inverter Based Peripheral Driver, 1.5A, CDIP16, HERMETIC SEALED, CERDIP-16 | Buffer/Inverter Based Peripheral Driver, 1.5A, CDIP16, HERMETIC SEALED, CERDIP-16 | Buffer/Inverter Based Peripheral Driver, 1.5A, CDIP16, HERMETIC SEALED, CERDIP-16 |
厂商名称 | Allegro | Allegro | Allegro | Allegro |
零件包装代码 | DIP | DIP | DIP | DIP |
包装说明 | DIP, | DIP, | DIP, | DIP, |
针数 | 16 | 16 | 16 | 16 |
Reach Compliance Code | unknown | unknown | unknown | unknow |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
内置保护 | TRANSIENT | TRANSIENT | TRANSIENT | TRANSIENT |
接口集成电路类型 | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | BUFFER OR INVERTER BASED PERIPHERAL DRIVER |
JESD-30 代码 | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 |
长度 | 19.05 mm | 19.05 mm | 19.05 mm | 19.05 mm |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 16 | 16 | 16 | 16 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
输出电流流向 | SINK | SINK | SINK | SINK |
标称输出峰值电流 | 1.5 A | 1.5 A | 1.5 A | 1.5 A |
封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
封装代码 | DIP | DIP | DIP | DIP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
筛选级别 | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B |
座面最大高度 | 5.46 mm | 5.46 mm | 5.46 mm | 5.46 mm |
标称供电电压 | 5 V | 12 V | 12 V | 5 V |
表面贴装 | NO | NO | NO | NO |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
断开时间 | 1.5 µs | 1.5 µs | 1.5 µs | 1.5 µs |
接通时间 | 1 µs | 1 µs | 1 µs | 1 µs |
宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
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