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NANDA9R4N4CZBA5F

产品描述Memory Circuit, Flash+SDRAM, PBGA149,
产品类别存储    存储   
文件大小1MB,共52页
制造商Micron Technology
官网地址http://www.mdtic.com.tw/
标准
下载文档 详细参数 全文预览

NANDA9R4N4CZBA5F概述

Memory Circuit, Flash+SDRAM, PBGA149,

NANDA9R4N4CZBA5F规格参数

参数名称属性值
是否Rohs认证符合
厂商名称Micron Technology
Objectid110479604
包装说明FBGA, BGA149,12X16,32
Reach Compliance Codecompliant
compound_id181395884
JESD-30 代码R-PBGA-B149
内存集成电路类型MEMORY CIRCUIT
混合内存类型FLASH+SDRAM
端子数量149
最高工作温度85 °C
最低工作温度-30 °C
封装主体材料PLASTIC/EPOXY
封装代码FBGA
封装等效代码BGA149,12X16,32
封装形状RECTANGULAR
封装形式GRID ARRAY, FINE PITCH
电源1.8 V
认证状态Not Qualified
标称供电电压 (Vsup)1.8 V
表面贴装YES
温度等级OTHER
端子形式BALL
端子节距0.8 mm
端子位置BOTTOM

文档预览

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NANDxxxxNx
Large page NAND flash memory and
low power SDRAM, 1.8/2.6 V MCP and PoP
Features
FBGA
n
MCP (multichip package) and PoP (package
on package)
– NAND flash memory
– 1-, 2-, 4-, 2x2-Gbit large page size NAND
flash memory
– 256-, 512-, 2x512-, 128+256/512-Mbit or
1-Gbit (x16/x32) SDR/DDR LPSDRAM
Temperature range: -30 up to 85 °C
Supply voltage
– NAND flash: V
DDF
= 1.7-1.95 V or 2.5-3.6 V
– LPSDRAM: V
DDD
= V
DDQD
= 1.7-1.95 V
Electronic signature
ECOPACK
®
packages
TFBGA107 10.5 × 13 × 1.2 mm
TFBGA137 10.5 x 13 x 1.2 mm
LFBGA137 10.5 x 13 x 1.4 mm
TFBGA149 10 × 13.5 × 1.2 mm
VFBGA160 15 x 15 x 1 mm
FBGA
n
n
n
n
VFBGA152 14 x 14 x 0.9 mm
TFBGA152 14×14 × 1.1 mm
TFBGA152 14 × 14 × 1.2 mm
TFBGA128 12 x 12 x 1.1 mm
Flash memory
n
Single or double data rate LPSDRAM
n
n
n
n
n
n
n
Nand interface
– x8 or x16 bus width
– Multiplexed address/data
Page size
– x8 device: (2048 + 64 spare) bytes
– x16 device: (1024 + 32 spare) words
Block size
– x8 device: (128K + 4K spare) bytes
– x16 device: (64K + 2K spare) words
Page read/program
– Random access: 25 µs (max)
– Sequential access: 25/30 ns (min)
– Page program time: 200 µs (typ)
Copy back program mode
Fast block erase: 1.5/2 ms (typ)
Chip Enable ‘don’t care’
Status register
Data integrity
– 100 000 program/erase cycles
– 10 years data retention
Interface: x16/32 bus width
Deep power-down mode
1.8 V LVCMOS interface
Quad internal banks controlled by BA0, BA1
Wrap sequence: sequential/interleaved
Automatic and controlled precharge
Auto refresh and self refresh
– 8192 or 4096 (for 128 Mbits) refresh
cycles/64 ms
– Programmable partial array self refresh
– Auto temperature compensated self refresh
Device summary
NANDxxxxNx
NANDA8R3N0
NANDA9WxN1
NANDBAR4Nx
NANDB9R4Nx
NANDCAW4N1
NANDD3R4N5
NANDA9R3Nx
NANDB0R3N0
NANDB1R3N0
NANDC9R4N0
NANDCBR4N3
NANDDBR3N5
n
n
n
Table 1.
n
n
n
n
n
NANDA0R3N0
NANDA9R4Nx
NANDBAR3Nx
NANDB9R3N0
NANDBAW4N1
NANDC3R4N5
October 2008
Rev 12
1/52
www.numonyx.com
1

 
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