SnapTac Series
Miniature Rectangular
Connectors for Future
Combat Soldier
•
HyperSpring
®
spring loaded contacts, self cleaning
wiping action
•
12, 21 ways
•
Combine robust environmental performance with
compact size and light weight
•
Easy and fast push-pull locking mechanism
•
Full line EMI shielding
•
IP67 sealing when mated and unmated
•
D-shape hardware coding to avoid mismatching
•
Overmolding solutions
•
Upgrade commercial high speed Fast Ethernet, USB,
IEEE 1394 interconnect to Mil Spec performances
•
High-reliability commercial and military interconnect
applications: Tactical Computers, Field Radios,
Dismounted Soldier, Weapon Interconnect, Battery
Chargers, Missiles, Helmet Breakaway System,
Commercial Airframe Sensors, Autosport, Diagnostics
Technical Characteristics
General
HyperSpring Contact Number
Receptacle Contact Termination
Plug Contact Termination
Cable Diameter Range
AWG Contact
Hyperspring force (single contact)
Connector Mating Force
Connector Unmating Force
12, 21
Solder Cup, Dip Solder
Solder Cup
Max 8 mm
30-26
Max 1.5 N
50 N (12 ways), 60 N (21 ways)
10 N (after locking system release)
Shock
Weight (Plug + Receptacle)
EIA364.27 Condition G
22 g (12 ways)
29 g (21 ways)
Materials and Plating
Housing
- Material
- Plating
Overmolding (Plug)
Contact Plating
- Material
- Plating
Environmental Characteristics
Temperature Range
Salt Spray
Humidity
IP Level
Aluminium Alloy
ZnCo conductive - RoHS compliant
Thermoplastic hotmelt
Brass, CuBe
Gold
Electrical and mechanical characteristics
EMI Shielding
Current Rating
Yes
3A@25°C
Test Voltage (dc) Contact to Contact
300 V
Dielectric Withstanding Voltage
(between contacts)
500 V
Contact Resistance (low level)
<15 m Ohm
Insulation Resistance
Vibration
5000 MOhm @ 500V d.c.
(EIA364.21)
EIA364.28 Condition III
-65°C +80°C
EIA364.26 Condition A
mated connectors
EIA364.31 Method IV
67 mated and unmated
MAY
2008
11
NXP MCU
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