Comparator, 1 Func, 7000uV Offset-Max, 500ns Response Time, CMOS, PDSO5, SC-70, 5 PIN
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Maxim(美信半导体) |
包装说明 | TSSOP, |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
放大器类型 | COMPARATOR |
最大平均偏置电流 (IIB) | 0.4 µA |
最大输入失调电压 | 7000 µV |
JESD-30 代码 | R-PDSO-G5 |
JESD-609代码 | e3 |
长度 | 2 mm |
湿度敏感等级 | 1 |
功能数量 | 1 |
端子数量 | 5 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
输出类型 | OPEN-DRAIN |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | NOT SPECIFIED |
标称响应时间 | 500 ns |
座面最大高度 | 1.1 mm |
供电电压上限 | 6 V |
标称供电电压 (Vsup) | 2.7 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | AUTOMOTIVE |
端子面层 | Matte Tin (Sn) |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 1.25 mm |
LMX331AXK+ | LMX331HAUK+ | LMX393AKA+ | LMX331AUK+ | LMX331HAXK+ | LMX393HAKA+ | |
---|---|---|---|---|---|---|
描述 | Comparator, 1 Func, 7000uV Offset-Max, 500ns Response Time, CMOS, PDSO5, SC-70, 5 PIN | Comparator, 1 Func, 7000uV Offset-Max, 500ns Response Time, CMOS, PDSO5, SOT-23, 5 PIN | Comparator, 2 Func, 7000uV Offset-Max, 500ns Response Time, CMOS, PDSO8, SOT-23, 8 PIN | Comparator, 1 Func, 7000uV Offset-Max, 500ns Response Time, CMOS, PDSO5, SOT-23, 5 PIN | Comparator, 1 Func, 7000uV Offset-Max, 500ns Response Time, CMOS, PDSO5, SC-70, 5 PIN | Comparator, 2 Func, 7000uV Offset-Max, 500ns Response Time, CMOS, PDSO8, SOT-23, 8 PIN |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
包装说明 | TSSOP, | LSSOP, | LSSOP, | LSSOP, | TSSOP, | LSSOP, |
Reach Compliance Code | compliant | compli | compli | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
放大器类型 | COMPARATOR | COMPARATOR | COMPARATOR | COMPARATOR | COMPARATOR | COMPARATOR |
最大平均偏置电流 (IIB) | 0.4 µA | 0.4 µA | 0.4 µA | 0.4 µA | 0.4 µA | 0.4 µA |
最大输入失调电压 | 7000 µV | 7000 µV | 7000 µV | 7000 µV | 7000 µV | 7000 µV |
JESD-30 代码 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G8 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G8 |
JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 |
长度 | 2 mm | 2.9 mm | 2.9 mm | 2.9 mm | 2 mm | 2.9 mm |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 1 | 1 | 2 | 1 | 1 | 2 |
端子数量 | 5 | 5 | 8 | 5 | 5 | 8 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
输出类型 | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | LSSOP | LSSOP | LSSOP | TSSOP | LSSOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
标称响应时间 | 500 ns | 500 ns | 500 ns | 500 ns | 500 ns | 500 ns |
座面最大高度 | 1.1 mm | 1.45 mm | 1.45 mm | 1.45 mm | 1.1 mm | 1.45 mm |
供电电压上限 | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V |
标称供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.65 mm | 0.95 mm | 0.65 mm | 0.95 mm | 0.65 mm | 0.65 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 1.25 mm | 1.625 mm | 1.625 mm | 1.625 mm | 1.25 mm | 1.625 mm |
是否无铅 | 不含铅 | - | 不含铅 | - | 不含铅 | 不含铅 |
峰值回流温度(摄氏度) | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
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