The documentation and process conversion
measures necessary to comply with this document
shall be completed by 20 January 2014.
INCH-POUND
MIL-PRF-19500/595K
20 November 2013
SUPERSEDING
MIL-PRF-19500/595J
25 October 2010
PERFORMANCE SPECIFICATION SHEET
SEMICONDUCTOR DEVICE, REPETITIVE AVALANCHE, FIELD EFFECT,
TRANSISTOR, P-CHANNEL, SILICON,
TYPES 2N7236, 2N7237, 2N7236U, AND 2N7237U,
JAN, JANTX, JANTXV, JANS, JANHC, AND JANKC
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
The requirements for acquiring the product described herein shall consist of
this specification sheet and MIL-PRF-19500.
1. SCOPE
1.1 Scope. This specification covers the performance requirements for a P-channel, enhancement-mode,
MOSFET, power transistor intended for use in high density power switching applications. Four levels of product
assurance are provided for each encapsulated device type as specified in MIL-PRF-19500, and two levels of product
assurance for each unencapsulated device type die, with avalanche energy ratings (EAS and EAR) and maximum
avalanche current (IAR).
1.2 Physical dimensions. See figure 1 (TO-254AA), figure 2 (TO-267AB) for surface mount devices, and figure 3
and 4 for JANHC and JANKC (die) dimensions.
1.3 Maximum ratings (T
C
= +25C, unless otherwise specified).
Min
Type
P
T
(1)
T
C
=
+25C
W
2N7236, 2N7236U
2N7237, 2N7237U
See notes next page.
125
125
P
T
T
A
=
+25C
W
4.0
4.0
R
JC
(2)
C/W
1.0
1.0
V
(BR)DSS
V
GS
= 0
I
D
= -1.0
mA dc
V dc
-100
-200
V
GS
I
D1
(3) (4) I
D2
(3) (4)
T
C
=
T
C
=
+25C
+100C
A dc
-18
-11
A dc
-11
-7
I
S
I
DM
(5)
T
J
and
T
STG
C
-55 to +150
-55 to +150
V dc
20
20
A dc A (pk)
-18
-11
-72
-44
* Comments, suggestions, or questions on this document should be addressed to DLA Land and Maritime,
ATTN: VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to
Semiconductor@dla.mil.
Since contact
information can change, you may want to verify the currency of this address information using the ASSIST
Online database at
https://assist.dla.mil/.
AMSC N/A
FSC 5961
MIL-PRF-19500/595K
1.3 Maximum ratings - continued.
Type
I
AR
E
AS
E
AR
r
DS(on)
max (6)
V
GS
= -10 V dc
I
D
= I
D2
T
J
= +25C
A
2N7236, 2N7236U
2N7237, 2N7237U
(1)
(2)
(3)
-18
-11
mJ
500
500
mJ
12.5
12.5
ohm
0.20
0.51
T
J
= +150C
ohm
0.400
1.122
Derate linearly 1.0 W/C for T
C
> +25C.
See figure 5, thermal impedance curves.
The following formula derives the maximum theoretical I
D
limit. I
D
is limited by package and internal wires
and may be limited by pin diameter:
I
D
=
R
JC
T
JM
- T
C
x
R
DS
( on ) at T
JM
(4)
(5)
(6)
See figure 6, maximum drain current graphs.
I
DM
= 4 X I
D1
as calculated in footnote (3).
Pulsed (see 4.5.1).
1.4 Primary electrical characteristics. T
C
= +25C (unless otherwise specified).
Max I
DSS1
V
GS
= 0
V
DS
= 80 percent
of rated V
DS
A
dc
Max
-4.0
-4.0
-25
-25
Max r
DS(on)1
(1)
I
D
= I
D2
V
GS
= 10 V
Ohms
0.20
0.51
Type
Min V
(BR)DSS
V
GS
= 0
I
D
= -1.0 mA dc
V dc
V
GS(th)1
V
DS
V
GS
I
D
= -0.25 mA dc
V dc
Min
-2.0
-2.0
2N7236, 2N7236U
2N7237, 2N7237U
-100
-200
(1)
Pulsed (see 4.5.1).
2
MIL-PRF-19500/595K
Dimensions
Ltr
Inches
Min
BL
CH
LD
LL
LO
LS
MHD
MHO
TL
TT
TW
Term
1
Term
2
Term
3
.535
.249
.035
.510
Max
.545
.260
.045
.570
Millimeters
Min
13.59
6.32
0.89
12.95
Max
13.84
6.60
1.14
14.48
3
Notes
.150 BSC
.150 BSC
.139
.665
.790
.040
.535
.149
.685
.800
.050
.545
3.81 BSC
3.81 BSC
3.53
16.89
20.07
1.02
13.59
Drain
3.78
17.40
20.32
1.27
13.84
4
4
Source
Gate
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. Protrusion thickness of ceramic eyelets included in dimension LL.
4. All terminals are isolated from case.
5. In accordance with ASME Y14.5M, diameters are equivalent to
x
symbology.
FIGURE 1. Physical dimensions for TO-254AA (2N7236 and 2N7237).
3
MIL-PRF-19500/595K
Dimensions
Letter
BL
BW
CH
LH
LL
1
LL
2
LS
1
LS
2
LW
1
LW
2
Q
1
Q
2
Term 1
Term 2
Term 3
.370
.135
.030
.035
Drain
Gate
Source
Min
.620
.445
.010
.410
.152
.210 BSC
.105 BSC
.380
.145
9.40
3.43
0.76
0.89
Inches
Max
.630
.455
.142
.020
.420
.162
Min
15.75
11.30
0.26
10.41
3.86
5.33 BSC
2.67 BSC
9.65
3.68
Millimeters
Max
16.00
11.56
3.60
0.50
10.67
4.11
NOTES:
1.
2.
3.
4.
Dimensions are in inches.
Millimeters are given for information only.
The lid shall be electrically isolated from the drain, gate and source.
In accordance with ASME Y14.5M, diameters are equivalent to
x
symbology.
FIGURE 2. Dimensions and configuration of surface mount package outline (TO-267AB), 2N7236U and 2N7237U).
4
MIL-PRF-19500/595K
A version
Inches
.018
.025
.027
.042
.060
.063
.162
.170
.192
.219
mm
0.46
0.64
0.69
1.07
1.52
1.60
4.11
4.32
4.88
5.56
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for information only.
3. Unless otherwise specified, tolerance is ±.005 inch (0.13 mm).
4. Physical characteristics of the die thickness = .0187 inch (0.47 mm).
5. Back metal: Cr - Ni - Ag.
6. Top metal: Al.
7. Back contact: Drain.
8. See 6.5 for ordering information.
FIGURE 3. Physical dimensions JANHCA and JANKCA die.
5
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