CBT/FST/QS/5C/B SERIES, QUAD 4-BIT DRIVER, TRUE OUTPUT, CDFP48, CERAMIC, FP-48
参数名称 | 属性值 |
厂商名称 | Texas Instruments(德州仪器) |
零件包装代码 | DFP |
包装说明 | DFP, |
针数 | 48 |
Reach Compliance Code | unknown |
系列 | CBT/FST/QS/5C/B |
JESD-30 代码 | R-GDFP-F48 |
长度 | 15.748 mm |
逻辑集成电路类型 | BUS DRIVER |
位数 | 4 |
功能数量 | 4 |
端口数量 | 2 |
端子数量 | 48 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出特性 | 3-STATE |
输出极性 | TRUE |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DFP |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
传播延迟(tpd) | 0.8 ns |
认证状态 | Not Qualified |
座面最大高度 | 3.05 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | BICMOS |
温度等级 | MILITARY |
端子形式 | FLAT |
端子节距 | 0.635 mm |
端子位置 | DUAL |
宽度 | 9.652 mm |
SN54CBT16244WD | SN74CBT16244DGG | SN74CBT16244DGV | SN74CBT16244CDGG | SN74CBT16244CDGGE4 | |
---|---|---|---|---|---|
描述 | CBT/FST/QS/5C/B SERIES, QUAD 4-BIT DRIVER, TRUE OUTPUT, CDFP48, CERAMIC, FP-48 | CBT/FST/QS/5C/B SERIES, QUAD 4-BIT DRIVER, TRUE OUTPUT, PDSO48, PLASTIC, TSSOP-56 | CBT/FST/QS/5C/B SERIES, QUAD 4-BIT DRIVER, TRUE OUTPUT, PDSO48, PLASTIC, TSOP-56 | CBT/FST/QS/5C/B SERIES, QUAD 4-BIT DRIVER, TRUE OUTPUT, PDSO48, PLASTIC, TSSOP-48 | CBT/FST/QS/5C/B SERIES, QUAD 4-BIT DRIVER, TRUE OUTPUT, PDSO48, PLASTIC, TSSOP-48 |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
零件包装代码 | DFP | TSSOP | TSOP | TSSOP | TSSOP |
包装说明 | DFP, | TSSOP, | TSSOP, | TSSOP, TSSOP48,.3,20 | TSSOP, |
针数 | 48 | 48 | 48 | 48 | 48 |
Reach Compliance Code | unknown | unknown | unknown | unknown | compliant |
系列 | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B |
JESD-30 代码 | R-GDFP-F48 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 |
长度 | 15.748 mm | 12.5 mm | 9.7 mm | 12.5 mm | 12.5 mm |
逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
位数 | 4 | 4 | 4 | 4 | 4 |
功能数量 | 4 | 4 | 4 | 4 | 4 |
端口数量 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 48 | 48 | 48 | 48 | 48 |
最高工作温度 | 125 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -55 °C | -40 °C | -40 °C | -40 °C | -40 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DFP | TSSOP | TSSOP | TSSOP | TSSOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
传播延迟(tpd) | 0.8 ns | 0.35 ns | 0.35 ns | 0.24 ns | 0.24 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 3.05 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4 V | 4 V | 4 V | 4 V | 4 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES |
技术 | BICMOS | BICMOS | BICMOS | CMOS | CMOS |
温度等级 | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | FLAT | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.635 mm | 0.5 mm | 0.4 mm | 0.5 mm | 0.5 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 9.652 mm | 6.1 mm | 4.4 mm | 6.1 mm | 6.1 mm |
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