NCV7718
Hex Half-Bridge Driver
The NCV7718 is a Hex Half−Bridge Driver with protection features
designed specifically for automotive and industrial motion control
applications. The NCV7718 has independent controls and diagnostics.
The device can be operated in forward, reverse, brake, and high
impedance states. The drivers are controlled via a 16 bit SPI interface
and are daisy chain compatible.
Features
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•
Low Quiescent Current Sleep Mode
•
High−Side and Low−Side Drivers Connected in a Half−Bridge
•
•
•
•
•
•
•
•
•
•
•
•
•
Configuration
Integrated Freewheeling Protection (LS and HS)
0.55 A Peak Current
R
DS(on)
= 1
W
(typ)
5 MHz SPI Control
Compliance with 5 V and 3. 3 V Systems
Undervoltage and Overvoltage Lockout
Discriminated Fault Reporting
Overcurrent Protection
Overtemperature Protection
Under Load Detection
Daisy Chain Compatible with Multiple of 8 bit Devices
16−Bit Frame Detection
These are Pb−Free Devices
SSOP24 NB
CASE 565AL
MARKING
DIAGRAM
NCV7718
AWLYYWWG
NCV7718 = Specific Device Code
A
= Assembly Location
WL
= Wafer Lot
YY
= Year
WW
= Work Week
G
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information on page 26 of
this data sheet.
Typical Applications
•
Automotive
•
Industrial
•
DC Motor Management for HVAC Application
©
Semiconductor Components Industries, LLC, 2012
1
April, 2018 − Rev. 3
Publication Order Number:
NCV7718/D
NCV7718
Shown below is a typical application for the NCV7718 configuration.
MRA4003T3
Watchdog
NCV7718
SO
SI
SCLK
CSB
13.2V
Power On
Reset
16−Bit
Serial
Data
Interface
Logic
Control
Protection:
Under Load
Over Temperature
Under−
voltage
Over−
voltage
Over Current
VS1
VS2
uC
GND
GND
GND
EN
High
Side
Switch
Low
Side
Switch
VCC
High
Side
Switch
Low
Side
Switch
High
Side
Switch
Low
Side
Switch
High
Side
Switch
Low
Side
Switch
High
Side
Switch
Low
Side
Switch
High
Side
Switch
Low
Side
Switch
GND
Voltage
Regulator
OUT1
OUT2
OUT3
OUT4
OUT5
OUT6
Figure 1. Typical Application
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NCV7718
VS1
DRIVE1
EN
VS
ENABLE
High Side
Driver
VS
Wave Shaping
Vcc
Vref1
BIAS
POR
Vref2
Fault
Reporting
Control
Logic
Wave Shaping
VS
Low Side
Driver
OUT1
SO
SI
SPI
SCLK
Fault
16 Bit Logic
and Latch
LS Under Load
Overcurrent
Thermal Warning &
Shutdown
CSB
VS
DRIVE2
OUT
2
VS
DRIVE3
OUT
3
VS1 & VS2
Vref1
Over Voltage
Lockout
VS
DRIVE4
OUT4
VS
VS1 & VS2
DRIVE5
OUT
5
Vref2
Under Voltage
Lockout
VS
DRIVE6
OUT
6
GND GND GND GND
VS2
Figure 2. Block Diagram
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NCV7718
GND
OUT1
OUT5
NC
SI
VCC
SO
EN
NC
OUT6
OUT4
GND
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
GND
OUT2
NC
VS1
SCLK
CSB
RESERVED
RESERVED
VS2
NC
OUT3
GND
Figure 3. Pinout − SSOP24
PACKAGE DESCRIPTION
The pin−out for the Hex Half−Bridge in SSOP24 package is shown in the table below.
Pin #
SSOP24
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
Symbol
GND
OUT1
OUT5
NC
SI
VCC
SO
EN
NC
OUT6
OUT4
GND
GND
OUT3
NC
VS2
Reserved
Reserved
CSB
SCLK
VS1
NC
OUT2
GND
Ground. Shorted to pin 24 internally.
Half Bridge Output 1
Half Bridge Output 5
No Connection. This pin should be isolated from any traces or via on the PCB board.
Serial Input. 16 bit serial communications input. 3.3 V/5 V (TTL) Compatible. Internally pulled down.
Power supply input for Logic.
Serial Output. 16 bit serial communications output. 3.3 V/5 V Complaint
Enable. Input high wakes the IC up from a sleep mode. 3.3 V/5 V (TTL) Compatible. Internally pulled down.
No Connection. This pin should be isolated from any traces or via on the PCB board.
Half Bridge Output 6
Half Bridge Output 4
Ground. Shorted to pin 13 internally.
Ground. Shorted to pin 12 internally.
Half Bridge Output 3
No Connection. This pin should be isolated from any traces or via on the PCB board.
Voltage Power Supply input for the Drivers 3, 4 and 6. This pin must be connected to VS1 externally.
Factory use − connect to GND or leave unconnected − internally pulled down.
Factory use − connect to GND or leave unconnected − internally pulled down.
Chip Select Bar. Active low serial port operation. 3.3V/5V (TTL) Compatible. Internally pulled up.
Serial Clock. Clock input for use with SPI communication. 3.3 V/5 V (TTL) Compatible. Internally pulled down.
Voltage Power Supply input for the Drivers 1, 2 and 5, all the pre−drivers and the charge pump. This pin
must be connected to VS2 externally.
No Connection. This pin should be isolated from any traces or via on the PCB board.
Half Bridge Output 2
Ground. Shorted to pin 1 internally.
Description
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4
NCV7718
MAXIMUM RATINGS
Rating
Power Supply Voltage (VS1, VS2)
(DC)
(AC), t < 500ms, Ivsx > −2A
Output Pin OUTx
(DC)
(AC)
(AC), t< 500ms, IOUTx > −1.1A
(AC), t< 500ms, IOUTx < 1A
Pin Voltage (Logic Input pins, SI, SCLK, CSB, SO, EN, Vcc)
Output Current (OUT1, OUT2, OUT3, OUT4, OUT5, OUT6)
Electrostatic Discharge, Human Body Model, VSx, OUTx
Electrostatic Discharge, Human Body Model, all other pins
Electrostatic Discharge, Machine Model
Short Circuit Reliability Characterization
Operating Junction Temperature
Storage Temperature Range
Moisture Sensitivity Level (MAX 260°C Processing)
Symbol
VsxdcMax
VSXac
VoutxDc
VoutxAc
Value
−0.3 to 40
−1.0
V
−0.3 to 40
−0.3 to 40
−1.0
1.0
−0.3 to 5.5
−2.0 to 2.0
4.0
2.0
200
Grade A
−40 to 150
−55 to 150
3
V
A
kV
kV
V
−
°C
°C
−
Unit
V
VioMax
IoutxImax
Vesd4k
Vesd2k
Vesd200
AECQ10x
Tj
Tstr
MSL3
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL INFORMATION
(Note 1)
Rating
Junction to Ambient
Junction to Lead
Symbol
R
qJA
R
yJL
Value
95.2
62
Unit
°C/W
°C/W
1. Thermal Information is based on having 3 high side and 3 low side devices dissipating 80 mW each on a 2 layer board 0.062″ thick FR4 board
with 600 mm
2
copper spreader area. 2 oz copper is used for the copper spreader area and the ambient temperature is specified at 25°C.
RECOMMENDED OPERATING CONDITIONS
Value
Rating
Digital Supply Input Voltage
Battery Supply Input Voltage
DC Output Current
Junction Temperature
Symbol
VccOp
VsxOp
IxOp
TjOp
Min
3.15
5.5
−
−40
Max
5.25
28
0.55
125
Unit
V
V
A
°C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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