MASK ROM, 2KX8, 850ns, NMOS, PDIP24, PLASTIC, DIP-24
参数名称 | 属性值 |
厂商名称 | AMD(超微) |
Objectid | 1418337707 |
零件包装代码 | DIP |
包装说明 | DIP, |
针数 | 24 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
compound_id | 9577752 |
最长访问时间 | 850 ns |
JESD-30 代码 | R-PDIP-T24 |
长度 | 31.877 mm |
内存密度 | 16384 bit |
内存集成电路类型 | MASK ROM |
内存宽度 | 8 |
功能数量 | 1 |
端子数量 | 24 |
字数 | 2048 words |
字数代码 | 2000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 2KX8 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
并行/串行 | PARALLEL |
认证状态 | Not Qualified |
座面最大高度 | 5.461 mm |
最大供电电压 (Vsup) | 5.25 V |
最小供电电压 (Vsup) | 4.75 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | NMOS |
温度等级 | COMMERCIAL |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
宽度 | 15.24 mm |
P8316A | C8316A | AM9217BCC | AM9217BDM | AM9217ADM | AM9217APC | AM9217ADC | AM9217ACC | AM9217BPC | AM9217BDC | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | MASK ROM, 2KX8, 850ns, NMOS, PDIP24, PLASTIC, DIP-24 | MASK ROM, 2KX8, 850ns, NMOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24 | MASK ROM, 2KX8, 450ns, NMOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24 | MASK ROM, 2KX8, 450ns, NMOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24 | MASK ROM, 2KX8, 550ns, NMOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24 | MASK ROM, 2KX8, 550ns, NMOS, PDIP24, PLASTIC, DIP-24 | MASK ROM, 2KX8, 550ns, NMOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24 | MASK ROM, 2KX8, 550ns, NMOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24 | MASK ROM, 2KX8, 450ns, NMOS, PDIP24, PLASTIC, DIP-24 | MASK ROM, 2KX8, 450ns, NMOS, CDIP24, HERMETIC SEALED, SIDE BRAZED, DIP-24 |
厂商名称 | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |
零件包装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
包装说明 | DIP, | DIP, | DIP, | DIP, | DIP, | DIP, | DIP, | DIP, | DIP, | DIP, |
针数 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 850 ns | 850 ns | 450 ns | 450 ns | 550 ns | 550 ns | 550 ns | 550 ns | 450 ns | 450 ns |
JESD-30 代码 | R-PDIP-T24 | R-CDIP-T24 | R-CDIP-T24 | R-CDIP-T24 | R-CDIP-T24 | R-PDIP-T24 | R-CDIP-T24 | R-CDIP-T24 | R-PDIP-T24 | R-CDIP-T24 |
长度 | 31.877 mm | 30.099 mm | 30.099 mm | 30.099 mm | 30.099 mm | 31.877 mm | 30.099 mm | 30.099 mm | 31.877 mm | 30.099 mm |
内存密度 | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bi |
内存集成电路类型 | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
字数 | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words |
字数代码 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.461 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.461 mm | 5.08 mm | 5.08 mm | 5.461 mm | 5.08 mm |
最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.5 V | 5.5 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.5 V | 4.5 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
技术 | NMOS | NMOS | NMOS | NMOS | NMOS | NMOS | NMOS | NMOS | NMOS | NMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |
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