High Speed CMOS Logic Quad 2-Input NAND Gates 14-PDIP -55 to 125
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP14,.3 |
| 针数 | 14 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 6 weeks |
| 系列 | HCT |
| JESD-30 代码 | R-PDIP-T14 |
| JESD-609代码 | e4 |
| 长度 | 19.3 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | NAND GATE |
| 最大I（ol） | 0.004 A |
| 功能数量 | 4 |
| 输入次数 | 2 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 包装方法 | TUBE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 最大电源电流（ICC） | 0.04 mA |
| Prop。Delay @ Nom-Su | 30 ns |
| 传播延迟（tpd） | 30 ns |
| 认证状态 | Not Qualified |
| 施密特触发器 | NO |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 6.35 mm |
| Base Number Matches | 1 |
| CD74HCT00E | CD74HC00E | CD74HC00M | CD74HC00M96G4 | CD74HC00MT | CD74HCT00M | CD74HCT00MT | |
|---|---|---|---|---|---|---|---|
| 描述 | High Speed CMOS Logic Quad 2-Input NAND Gates 14-PDIP -55 to 125 | High Speed CMOS Logic Quad 2-Input NAND Gates 14-PDIP -55 to 125 | High Speed CMOS Logic Quad 2-Input NAND Gates 14-SOIC -55 to 125 | High Speed CMOS Logic Quad 2-Input NAND Gates 14-SOIC -55 to 125 | High Speed CMOS Logic Quad 2-Input NAND Gates 14-SOIC -55 to 125 | High Speed CMOS Logic Quad 2-Input NAND Gates 14-SOIC -55 to 125 | High Speed CMOS Logic Quad 2-Input NAND Gates 14-SOIC -55 to 125 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | DIP | DIP | SOIC | SOIC | SOIC | SOIC | SOIC |
| 包装说明 | DIP, DIP14,.3 | DIP-14 | SOIC-14 | SOP, SOP14,.25 | SOP, SOP14,.25 | SOP, SOP14,.25 | SOP, SOP14,.25 |
| 针数 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli | compli |
| 系列 | HCT | HC/UH | HC/UH | HC/UH | HC | HCT | HCT |
| JESD-30 代码 | R-PDIP-T14 | R-PDIP-T14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 19.3 mm | 19.3 mm | 8.65 mm | 8.65 mm | 8.65 mm | 8.65 mm | 8.65 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| 最大I（ol） | 0.004 A | 0.0052 A | 0.0052 A | 0.004 A | 0.0052 A | 0.004 A | 0.004 A |
| 功能数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 输入次数 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | SOP | SOP | SOP | SOP | SOP |
| 封装等效代码 | DIP14,.3 | DIP14,.3 | SOP14,.25 | SOP14,.25 | SOP14,.25 | SOP14,.25 | SOP14,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 包装方法 | TUBE | TUBE | TUBE | TAPE AND REEL | TR | TUBE | TR |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | 260 | 260 | 260 | 260 | 260 |
| 电源 | 5 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 5 V | 5 V |
| Prop。Delay @ Nom-Su | 30 ns | 27 ns | 27 ns | 27 ns | 27 ns | 30 ns | 30 ns |
| 传播延迟（tpd） | 30 ns | 135 ns | 135 ns | 135 ns | 135 ns | 30 ns | 30 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 施密特触发器 | NO | NO | NO | NO | NO | NO | NO |
| 座面最大高度 | 5.08 mm | 5.08 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm |
| 最大供电电压 (Vsup) | 5.5 V | 6 V | 6 V | 6 V | 6 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 2 V | 2 V | 2 V | 2 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 6.35 mm | 6.35 mm | 3.91 mm | 3.9 mm | 3.9 mm | 3.91 mm | 3.9 mm |
| ECCN代码 | EAR99 | EAR99 | EAR99 | - | - | EAR99 | EAR99 |
| Factory Lead Time | 6 weeks | 6 weeks | 6 weeks | - | 1 week | 1 week | 1 week |
| 最大电源电流（ICC） | 0.04 mA | 0.04 mA | 0.04 mA | - | 0.04 mA | 0.04 mA | 0.04 mA |
| Base Number Matches | 1 | 1 | 1 | - | - | 1 | - |
| 厂商名称 | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) |
| 是否无铅 | - | - | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 |
| 湿度敏感等级 | - | - | 1 | 1 | 1 | 1 | 1 |
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